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1.发明申请Optocoupler for Converting Optical Signals into Electrical Signals and Vice Versa 有权光耦合器将光信号转换为电信号和副信号公开(公告)号：US20070217734A1
公开(公告)日：2007-09-20
申请号：US11679601
申请日：2007-02-27
申请人： Albert Auburger , Jochen Dangelmaier , Cyrus Ghahremani , Thomas Lichtenegger , Stefan Paulus , Jean Schmitt , Horst Theuss , Helmut Wietschorke
发明人： Albert Auburger , Jochen Dangelmaier , Cyrus Ghahremani , Thomas Lichtenegger , Stefan Paulus , Jean Schmitt , Horst Theuss , Helmut Wietschorke
IPC分类号： G02B6/26
CPC分类号： G02B6/4202 , G02B6/423 , H01L31/0203 , H01L31/125 , H01L2224/48091 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： An optocoupler, for converting optical signals into electrical signals and vice versa, includes a package with a jack connector for receiving an optical waveguide. On a lower side of the package, surface-mountable outer contacts are arranged on an interconnection film. A mounting position for semiconductor chips, including one optical semiconductor chip and one application-specific semiconductor chip, is provided in the package on the optical axis of the optical waveguide. The optical semiconductor chip is aligned with the optical axis inside the package. The outer contacts are arranged outside the package on the flexible interconnection film. Between the mounting position and the outer contacts, the interconnection film includes a curved region which is embedded in the package material such that the surface-mountable outer contacts on the lower side of the package are freely accessible.
摘要翻译： 用于将光信号转换为电信号的光耦合器，反之亦然，包括具有用于接收光波导的插座连接器的封装。 在封装的下侧，表面安装的外触点设置在互连膜上。 在光波导的光轴上的封装中设置包括一个光学半导体芯片和一个专用半导体芯片的半导体芯片的安装位置。 光学半导体芯片与封装内的光轴对准。 外部触点布置在柔性互连膜上的封装外部。 在安装位置和外部触点之间，互连膜包括嵌入封装材料中的弯曲区域，使得封装的下侧上的可表面安装的外部触点可自由接近。
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2.发明授权Optocoupler for converting optical signals into electrical signals and vice versa 有权光耦合器用于将光信号转换为电信号，反之亦然公开(公告)号：US07476036B2
公开(公告)日：2009-01-13
申请号：US11679601
申请日：2007-02-27
申请人： Albert Auburger , Jochen Dangelmaier , Cyrus Ghahremani , Thomas Lichtenegger , Stefan Paulus , Jean Schmitt , Horst Theuss , Helmut Wietschorke
发明人： Albert Auburger , Jochen Dangelmaier , Cyrus Ghahremani , Thomas Lichtenegger , Stefan Paulus , Jean Schmitt , Horst Theuss , Helmut Wietschorke
IPC分类号： G02B6/42
CPC分类号： G02B6/4202 , G02B6/423 , H01L31/0203 , H01L31/125 , H01L2224/48091 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： An optocoupler, for converting optical signals into electrical signals and vice versa, includes a package with a jack connector for receiving an optical waveguide. On a lower side of the package, surface-mountable outer contacts are arranged on an interconnection film. A mounting position for semiconductor chips, including one optical semiconductor chip and one application-specific semiconductor chip, is provided in the package on the optical axis of the optical waveguide. The optical semiconductor chip is aligned with the optical axis inside the package. The outer contacts are arranged outside the package on the flexible interconnection film. Between the mounting position and the outer contacts, the interconnection film includes a curved region which is embedded in the package material such that the surface-mountable outer contacts on the lower side of the package are freely accessible.
摘要翻译： 用于将光信号转换为电信号的光耦合器，反之亦然，包括具有用于接收光波导的插座连接器的封装。 在封装的下侧，表面安装的外触点设置在互连膜上。 在光波导的光轴上的封装中设置包括一个光学半导体芯片和一个专用半导体芯片的半导体芯片的安装位置。 光学半导体芯片与封装内的光轴对准。 外部触点布置在柔性互连膜上的封装外部。 在安装位置和外部触点之间，互连膜包括嵌入封装材料中的弯曲区域，使得封装的下侧上的可表面安装的外部触点可自由接近。
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公开(公告)号：US07189009B2
公开(公告)日：2007-03-13
申请号：US11273264
申请日：2005-11-15
CPC分类号： G02B6/4214 , G02B6/4246
摘要： A micro-optical module includes a housing, at least one optoelectronic component, and an optoelectronic unit assigned thereto. The housing is partly embodied as an MID body, having a cavity and having a three-dimensional conductor structure in the cavity. The MID body includes an optical channel filled with a plastic waveguide.
摘要翻译： 微型光模块包括壳体，至少一个光电子部件和分配给其的光电单元。 壳体部分地实现为具有空腔并且在空腔中具有三维导体结构的MID主体。 MID主体包括填充有塑料波导的光学通道。
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公开(公告)号：US20060088256A1
公开(公告)日：2006-04-27
申请号：US11273264
申请日：2005-11-15
IPC分类号： G02B6/36
CPC分类号： G02B6/4214 , G02B6/4246
摘要： A micro-optical module includes a housing, at least one optoelectronic component, and an optoelectronic unit assigned thereto. The housing is partly embodied as an MID body, having a cavity and having a three-dimensional conductor structure in the cavity. The MID body includes an optical channel filled with a plastic waveguide.
摘要翻译： 微型光模块包括壳体，至少一个光电子部件和分配给其的光电单元。 壳体部分地实现为具有空腔并且在空腔中具有三维导体结构的MID主体。 MID主体包括填充有塑料波导的光学通道。
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公开(公告)号：US20120299170A1
公开(公告)日：2012-11-29
申请号：US13116285
申请日：2011-05-26
申请人： Daniel Kehrer , Stefan Martens , Tze Yang Hin , Helmut Wietschorke , Horst Theuss , Beng Keh See , Ulrich Krumbein
发明人： Daniel Kehrer , Stefan Martens , Tze Yang Hin , Helmut Wietschorke , Horst Theuss , Beng Keh See , Ulrich Krumbein
IPC分类号： H01L23/495 , H01L21/56
CPC分类号： H01L23/495 , H01L23/3107 , H01L23/315 , H01L23/49548 , H01L23/49575 , H01L23/66 , H01L24/45 , H01L24/48 , H01L24/83 , H01L25/16 , H01L2223/6611 , H01L2224/16145 , H01L2224/16245 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/83 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01047 , H01L2924/01322 , H01L2924/181 , H01L2924/3011 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： A module and a method for manufacturing a module are disclosed. An embodiment of a module comprises a first semiconductor device, a frame arranged on the first semiconductor device, the frame comprising a cavity, and a second semiconductor device arranged on the frame wherein the second semiconductor device seals the cavity.
摘要翻译： 公开了一种用于制造模块的模块和方法。 模块的实施例包括第一半导体器件，布置在第一半导体器件上的框架，框架包括空腔，以及布置在框架上的第二半导体器件，其中第二半导体器件密封空腔。
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公开(公告)号：US08535983B2
公开(公告)日：2013-09-17
申请号：US13152021
申请日：2011-06-02
申请人： Tze Yang Hin , Stefan Martens , Werner Simbuerger , Helmut Wietschorke , Horst Theuss , Beng Keh See , Ulrich Krumbein
发明人： Tze Yang Hin , Stefan Martens , Werner Simbuerger , Helmut Wietschorke , Horst Theuss , Beng Keh See , Ulrich Krumbein
IPC分类号： H01L21/56
CPC分类号： H01L21/6836 , H01L21/568 , H01L23/3114 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2221/68327 , H01L2221/68368 , H01L2221/68372 , H01L2224/03002 , H01L2224/03003 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/16245 , H01L2224/94 , H01L2224/96 , H01L2924/07802 , H01L2924/12042 , H01L2924/1461 , H01L2924/181 , H01L2224/81 , H01L2224/81815 , H01L2924/00014 , H01L2224/81203 , H01L2224/11 , H01L2924/00
摘要： In one embodiment a method for manufacturing a semiconductor device comprises arranging a wafer on a carrier, the wafer comprising singulated chips; bonding the singulated chips to a support wafer, and removing the carrier.
摘要翻译： 在一个实施例中，制造半导体器件的方法包括将晶片布置在载体上，所述晶片包括单片化芯片; 将分割的芯片接合到支撑晶片，并移除载体。
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7.发明授权公开(公告)号：US08080993B2
公开(公告)日：2011-12-20
申请号：US12056776
申请日：2008-03-27
申请人： Horst Theuss , Helmut Wietschorke
发明人： Horst Theuss , Helmut Wietschorke
CPC分类号： B29C45/14639 , B29C70/78 , B29K2995/0008 , G01D5/147 , G01P1/026 , G01P3/487 , G01R33/0047 , H01L2224/48091 , H01L2924/00014
摘要： A method of manufacturing a sensor module includes providing a substrate comprising a magnetically sensitive sensor element. The sensor element and the substrate are encapsulated with at least one mold material that is configured to apply a bias magnetic field to the sensor element.
摘要翻译： 一种制造传感器模块的方法包括提供包括磁敏感传感器元件的基板。 所述传感器元件和所述衬底被封装有至少一个模具材料，所述至少一个模具材料被配置为向所述传感器元件施加偏置磁场。
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公开(公告)号：US20120309130A1
公开(公告)日：2012-12-06
申请号：US13152021
申请日：2011-06-02
申请人： Tze Yang Hin , Stefan Martens , Werner Simbuerger , Helmut Wietschorke , Horst Theuss , Beng Keh See , Ulrich Krumbein
发明人： Tze Yang Hin , Stefan Martens , Werner Simbuerger , Helmut Wietschorke , Horst Theuss , Beng Keh See , Ulrich Krumbein
CPC分类号： H01L21/6836 , H01L21/568 , H01L23/3114 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2221/68327 , H01L2221/68368 , H01L2221/68372 , H01L2224/03002 , H01L2224/03003 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/16245 , H01L2224/94 , H01L2224/96 , H01L2924/07802 , H01L2924/12042 , H01L2924/1461 , H01L2924/181 , H01L2224/81 , H01L2224/81815 , H01L2924/00014 , H01L2224/81203 , H01L2224/11 , H01L2924/00
摘要： In one embodiment a method for manufacturing a semiconductor device comprises arranging a wafer on a carrier, the wafer comprising singulated chips; bonding the singulated chips to a support wafer, and removing the carrier.
摘要翻译： 在一个实施例中，制造半导体器件的方法包括将晶片布置在载体上，所述晶片包括单片化芯片; 将分割的芯片接合到支撑晶片，并移除载体。
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公开(公告)号：US08106654B2
公开(公告)日：2012-01-31
申请号：US12127510
申请日：2008-05-27
申请人： Horst Theuss , Helmut Wietschorke
发明人： Horst Theuss , Helmut Wietschorke
CPC分类号： G01R33/09 , G01R33/0005
摘要： An sensor includes a substrate with a magnetic field sensor mounted on the substrate. The magnetic field sensor has a first surface defining a plane. A magnetic flux conducting member has a second surface that is not parallel to the first surface. A non-magnetic member is situated between the magnetic field sensor and the magnetic flux conducting member.
摘要翻译： 传感器包括具有安装在基板上的磁场传感器的基板。 磁场传感器具有限定平面的第一表面。 磁通导电构件具有不平行于第一表面的第二表面。 非磁性部件位于磁场传感器和磁通导体之间。
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公开(公告)号：US20090295381A1
公开(公告)日：2009-12-03
申请号：US12127510
申请日：2008-05-27
申请人： Horst Theuss , Helmut Wietschorke
发明人： Horst Theuss , Helmut Wietschorke
CPC分类号： G01R33/09 , G01R33/0005
摘要： An sensor includes a substrate with a magnetic field sensor mounted on the substrate. The magnetic field sensor has a first surface defining a plane. A magnetic flux conducting member has a second surface that is not parallel to the first surface. A non-magnetic member is situated between the magnetic field sensor and the magnetic flux conducting member.
摘要翻译： 传感器包括具有安装在基板上的磁场传感器的基板。 磁场传感器具有限定平面的第一表面。 磁通导电构件具有不平行于第一表面的第二表面。 非磁性部件位于磁场传感器和磁通导体之间。
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