摘要:
The invention relates to electronic integrated circuits capable of operating either in active mode or in standby mode and of having, in standby mode, a very low current consumption. According to the invention, the leakage current of a power transistor inserted in series between a supply terminal and an active circuit is controlled by a gate reverse overbias in the following manner: a voltage step-up charge pump generates a gate bias voltage from pulses delivered by an oscillator having its frequency controlled by a current. The control current Ic is the leakage current of a transistor having technological characteristics similar to those of the power transistor. The system optimizes the current consumption in standby mode, the frequency of the oscillator being reduced when the gate is biased so as to minimize the leakage current. The invention is applicable to circuits powered by a battery or a cell (mobile telephones, cameras, portable computers, etc.).
摘要:
The invention relates to electronic integrated circuits capable of operating either in active mode or in standby mode and of having, in standby mode, a very low current consumption. According to the invention, the leakage current of a power transistor inserted in series between a supply terminal and an active circuit is controlled by a gate reverse overbias in the following manner: a voltage step-up charge pump generates a gate bias voltage from pulses delivered by an oscillator having its frequency controlled by a current. The control current Ic is the leakage current of a transistor having technological characteristics similar to those of the power transistor. The system optimizes the current consumption in standby mode, the frequency of the oscillator being reduced when the gate is biased so as to minimize the leakage current. The invention is applicable to circuits powered by a battery or a cell (mobile telephones, cameras, portable computers, etc.).
摘要:
A method for fabricating a microelectronic device with one or plural double-gate transistors, including: a) forming one or plural structures on a substrate including at least a first block configured to form a first gate of a double-gate transistor, and at least a second block configured to form the second gate of said double-gate, the first block and the second block being located on opposite sides of at least one semiconducting zone and separated from the semiconducting zone by a first gate dielectric zone and a second gate dielectric zone respectively, and b) doping at least one or plural semiconducting zones in the second block of at least one given structure among the structures, using at least one implantation selective relative to the first block, the second block being covered by a hard mask, a critical dimension of the hard mask being larger than the critical dimension of the second block.
摘要:
The invention relates to an integrated circuit including an active semiconducting layer separated from a semiconducting substrate layer by an embedded insulating material surface, including: first and second transistors (205, 213) of a single type; first and second floorplans arranged vertically perpendicular to the first and second transistors; wherein the first transistor has a doping of the floorplan thereof, opposite that of the source thereof, and a first threshold voltage; the second transistor has a doping of the floorplan thereof, identical to that of the source thereof, and a second threshold voltage; the first threshold voltage is dependent on the potential difference applied between the source and the floorplan of the first transistor; and the second threshold voltage is dependent on the potential difference applied between the source and the floorplan of the second transistor.
摘要:
A microelectronic device including, on a substrate, at least one element such as a SRAM memory cell; one or more first transistor(s), respectively including a number k of channels (k≧1) parallel in a direction forming a non-zero angle with the main plane of the substrate, and one or more second transistor(s), respectively including a number m of channels, such that m>k, parallel in a direction forming a non-zero angle, or an orthogonal direction, with the main plane of the substrate.
摘要:
A microelectronic device, including at least one transistor including: on a substrate, a semiconductor zone with a channel zone covered with a gate dielectric zone, a mobile gate, suspended above the gate dielectric zone and separated from the gate dielectric zone by an empty space, which the gate is located at an adjustable distance from the gate dielectric zone, and a piezoelectric actuation device including a stack formed by at least one layer of piezoelectric material resting on a first biasing electrode, and a second biasing electrode resting on the piezoelectric material layer, wherein the gate is attached to the first biasing electrode and is in contact with the first biasing electrode, and the piezoelectric actuation device is configured to move the gate with respect to the channel zone.
摘要:
A manufacture includes an IC comprising a stacking of a semiconducting substrate, a buried insulating layer, and a semiconducting layer, a first electronic component formed in and/or on the semiconductor layer, a bias circuit to generate a first bias voltage, first and second via-type interconnections, to which the bias circuit applies a same bias voltage equal to the first bias voltage, a first insulation trench separating the first electronic component from the first and second interconnections, a first ground plane having a first type of doping, placed beneath the buried insulating layer plumb with the first electronic component, and extending beneath the first insulation trench and up into contact the first interconnection, and a first well having a second type of doping opposite that of the first type, plumb with the first ground plane, and extending beneath the first insulation trench and up into contact with the second interconnection.
摘要:
A support substrate comprises first and second counter-electrodes arranged in the same plane at the level of a surface of the support substrate. An electrically insulating area separates the first and second counter-electrodes. A semi-conducting area with first and second portions is separated from the support substrate by an electrically insulating material. The electrically insulating material is different from the material forming the support substrate. The first portion of the semi-conducting area is facing the first counter-electrode. The second portion of the semi-conducting area is facing the second counter-electrode.
摘要:
A random access memory cell including: two double-gate access transistors respectively arranged between a first bit line and a first storage node and between a second bit line and a second storage node, a word line, a first double-gate load transistor and a second double-gate load transistor, a first double-gate driver transistor and a second double-gate driver transistor, a mechanism to apply a given potential to at least one electrode of each of the load or driver transistors, and a mechanism to cause the given potential to vary.
摘要:
A method for fabricating a microelectronic device with one or plural asymmetric double-gate transistors, including: a) forming one or plural structures on a substrate including at least a first semiconducting block configured to form a first gate of a double-gate transistor, and at least a second semiconducting block configured to form a second gate of the double-gate transistor, the first block and the second block being located on opposite sides of at least one semiconducting zone and separated from the semiconducting zone by a first gate dielectric zone and a second gate dielectric zone respectively, and b) doping at least one or plural semiconducting zones in the second block of at least one given structure among the structures, using at least one implantation selective relative to the first block.