公开(公告)号：US06264187B1

公开(公告)日：2001-07-24

申请号：US09253238

申请日：1999-02-19

申请人： Allen D. Hertz ,  Eric L. Hertz ,  Anthony A. Imm ,  J. Stephen Wiggs

发明人： Allen D. Hertz ,  Eric L. Hertz ,  Anthony A. Imm ,  J. Stephen Wiggs

IPC分类号： B25B124

CPC分类号： B23Q1/035 ,  B25B1/2421

摘要： A method and apparatus are disclosed for a flexible support system using elongated support members to support a face of a module. The flexible support member(s) are arranged through a primary member with apertures, where the elongated support members are automatically returned to a home position by a self restoring mechanism, the position of the elongated support members are adjusted by the contacting forces applied by bringing the module and the flexible support apparatus together, then applying a clamping force to secure the elongated support members where the elongated support members can sustain the loads applied onto a module during an assembly process.

摘要翻译： 公开了一种使用细长的支撑构件来支撑模块的面部的柔性支撑系统的方法和装置。 柔性支撑构件通过具有孔的主构件布置，其中细长支撑构件通过自恢复机构自动地返回到初始位置，细长支撑构件的位置由通过带来的接触力调节 模块和柔性支撑装置在一起，然后施加夹紧力以固定细长支撑构件，其中细长支撑构件可以在组装过程期间承受施加到模块上的负载。

公开(公告)号：US06695298B1

公开(公告)日：2004-02-24

申请号：US09597905

申请日：2000-06-19

申请人： Allen David Hertz ,  Anthony A. Imm ,  Eric L. Hertz

发明人： Allen David Hertz ,  Anthony A. Imm ,  Eric L. Hertz

IPC分类号： B25B124

CPC分类号： B23Q1/035 ,  B25B1/2421

摘要： An apparatus and accessories are disclosed for a flexible support apparatus 100, 900 using elongated support members 110 to support a face of a workpiece 10 and respective protrusions 335. The elongated support members 110 are arranged through at least one plane of perforated material 120, where the elongated support members 110 are profiled against the workpiece 10 and respective protrusions 335. The profile of the elongated support members 110 is created by contacting forces 132 generated by bringing the workpiece 330 and the plurality of elongated support members 110 together. A holding force is then applied to the elongated support members 110 to support the workpiece 10 against forces applied by a workstation. Fluid 902 is used to raise expansion members to raise the plurality of elongate support members 110. A perforated plate 920 is used to control the flow of fluid 902 between a fluid cavity 910 and the plurality of expansion members 904. Accessories to improve performance and reliability include a protective collar for protection from foreign materials 870 (solder paste) and a reinforcing member 40, 44 to reinforce thin, flexible workpieces 10.

摘要翻译： 公开了一种用于柔性支撑装置100,900的装置和附件，其使用细长支撑构件110来支撑工件10的表面和相应的突起335.细长支撑构件110布置成穿过穿孔材料120的至少一个平面，其中 细长的支撑构件110被对准工件10和相应的突起335.细长支撑构件110的轮廓是通过将工件330和多个细长的支撑构件110一起产生的接触力132而产生的。 然后将保持力施加到细长支撑构件110上，以抵抗由工作站施加的力的工件10。 流体902用于升高膨胀构件以升高多个细长支撑构件110.多孔板920用于控制流体腔室910与多个膨胀构件904之间的流体902的流动。用于改善性能和可靠性的附件 包括用于防止异物870（焊膏）和加强构件40,44的保护套，以加强薄的柔性工件10。

公开(公告)号：US06138562A

公开(公告)日：2000-10-31

申请号：US208959

申请日：1998-12-10

申请人： Allen D. Hertz ,  Eric L. Hertz ,  Dennis D. Epp

发明人： Allen D. Hertz ,  Eric L. Hertz ,  Dennis D. Epp

IPC分类号： B23K1/08 ,  B41F15/12 ,  B41M1/12 ,  H05K3/12 ,  H05K3/34

CPC分类号： B23K1/085 ,  B41F15/12 ,  B41M1/125 ,  H05K3/1233 ,  B23K2201/40 ,  B41P2215/13 ,  H05K2203/0264 ,  H05K2203/0285 ,  H05K3/3415

摘要： Solder Paste, adhesives and other materials are screen printed onto Printed Circuit Boards (PCB's) during the assembly process for electronic circuit assemblies. Pressure forces may be applied to the material to aid in separating the material from the apertures within the stencil. The pressure forces are created from sound pressure waves generated from a vibrational energy source located some distance from the stencil. Examples of non-contacting vibrational energy sources include Ultrasonic transducers, horns, speakers, and tuning forks. Additional assistance to separate the material from the apertures may be applied by a vibrational source by contacting to the stencil. Examples of the contacting vibrational energy sources may be off-balanced motors, piezo-electric transducers, and mass-resonant vibrators.

摘要翻译： 在电子电路组件的组装过程中，焊膏，粘合剂和其他材料被丝网印刷到印刷电路板（PCB）上。 可以将压力施加到材料上以帮助将材料与模板中的孔分离。 压力由距离模板一定距离的振动能源产生的声压波产生。 非接触振动能源的实例包括超声波换能器，喇叭，扬声器和调音叉。 可以通过与模板接触的振动源来应用从孔中分离材料的附加帮助。 接触振动能源的示例可以是不平衡的电动机，压电换能器和质量共振振动器。

公开(公告)号：US08854201B1

公开(公告)日：2014-10-07

申请号：US14049153

申请日：2013-10-08

申请人： Allen D. Hertz ,  Eric L. Hertz

发明人： Allen D. Hertz ,  Eric L. Hertz

IPC分类号： B60Q7/00 ,  B60Q1/26 ,  B60Q7/02

CPC分类号： B60Q7/02 ,  B60P3/40 ,  B60Q1/2692 ,  B60Q1/305 ,  B60Q1/307

摘要： A safety light system integrated into a vehicle. The safety light system includes a safety light assembly receptacle carried by a body panel of a vehicle. The safety light assembly receptacle includes a light assembly receiving cavity for receiving and temporarily retaining a removable light assembly. The removable light assembly includes elements to provide a user controlled continuous red light, a flashing red light, and a continuous white light. The flashing red light provides a roadside flare configuration. The continuous white light provides a flashlight configuration. The continuous red light in conjunction with the flashing red light configuration provides a driving light configuration. The removable light assembly can include a securing mechanism for attaching the removable light assembly to an object to warn others of the extended object and/or support legs enabling operation as a roadside flare, spotlight, and the like.

摘要翻译： 集成到车辆中的安全灯系统。 安全灯系统包括由车辆的车身面板承载的安全灯组件插座。 安全灯组件插座包括用于接收和临时保持可拆卸灯组件的灯组件接收腔。 可拆卸灯组件包括用于提供用户控制的连续红光，闪烁的红光和连续的白光的元件。 闪烁的红灯提供了路边的耀斑配置。 连续的白光提供手电筒配置。 持续的红灯结合闪烁的红灯配置提供驱动灯配置。 可拆卸的灯组件可以包括固定机构，用于将可拆卸的灯组件附接到物体上，以警告其他扩展物体和/或支撑腿，使其能够作为路边火炬，聚光灯等操作。

公开(公告)号：US07834750B1

公开(公告)日：2010-11-16

申请号：US11562389

申请日：2006-11-21

申请人： Allen D. Hertz ,  Eric L. Hertz

发明人： Allen D. Hertz ,  Eric L. Hertz

IPC分类号： B60Q1/26

CPC分类号： B60Q1/305 ,  B60Q1/2692 ,  B60Q7/02 ,  B60R3/02 ,  B60R5/041 ,  B60R19/483

摘要： A safety light system is incorporated into the tailgate of a pickup truck. The safety light is incorporated into the tailgate and is illuminated when the tailgate is in a lowered or horizontal position and when either the ignition switch is in the on position, the parking lights are turned on, or both. The safety light can be positioned either on the top edge-rail of the tailgate, as a slide-out unit placed in a pocket with the top edge-rail of the tailgate, or as a rotating assembly incorporated into the outer sheet metal of the tailgate. Additional safety lights can be incorporated into the sides of the tailgate assembly. An optional feature includes the ability to pull the safety light out from the tailgate and secure the safety light to an object that extends beyond the length of the pickup bed. Alternatively, the safety lights can be installed in or on a bed extension apparatus. The safety light can additionally include the features of a standard taillight, comprising brake lights and or turn signal indicators. Alternates include reflective tape and a pullout feature from other locations. A pullout section can also provide a step for accessing the bed.

摘要翻译： 一个安全灯系统被并入皮卡车的后挡板。 安全灯被并入后挡板，并且当后挡板处于降低或水平位置时，当点火开关处于接通位置时，停车灯被打开或两者都亮起。 安全灯可以定位在后挡板的顶部边缘轨道上，作为放置在具有后挡板的顶部边缘轨道的口袋中的滑出单元，或者作为旋转组件结合到外部金属板 尾门 附加的安全灯可以并入后挡板组件的侧面。 可选功能包括将安全灯从后挡板拉出并将安全灯固定在延伸超过拾音台长度的物体上的能力。 或者，安全灯可以安装在床上延伸装置中或床上。 安全灯还可以包括标准尾灯的特征，包括制动灯和/或转向信号指示器。 替代品包括反光带和其他位置的拉出功能。 拉出部分还可以提供进入床的步骤。

公开(公告)号：US06471111B1

公开(公告)日：2002-10-29

申请号：US09234328

申请日：1999-01-20

申请人： Allen D. Hertz ,  Dennis D. Epp ,  Eric L. Hertz

发明人： Allen D. Hertz ,  Dennis D. Epp ,  Eric L. Hertz

IPC分类号： B23K106

CPC分类号： H05K3/3468 ,  B23K1/085 ,  B23K2101/40 ,  H05K3/3415 ,  H05K2203/0285

摘要： A method and apparatus are disclosed for improving the release of molten solder from a module via the introduction of acoustic pressure waves to the module and/or molten solder wave. The acoustic pressure waves may be created by a transducer where the waves are transferred to the module and/or solder wave through the air or reduced oxygen atmosphere. The acoustic pressure waves impinge on the molten solder and the module to reduce solder skips, bridges and icicles. The acoustic pressure waves are directed at the module/molten solder boundary to apply pressure to the boundary causing a shearing action. The shearing action causes the excess molten solder to fall, with the aid of gravity, into the molten solder bath.

摘要翻译： 公开了一种用于通过将声压波引入模块和/或熔融焊波来改善熔融焊料从模块的释放的方法和装置。 声压波可以由换能器产生，其中波被传送到模块和/或通过空气或减少的氧气气氛的焊波。 声压波撞击熔融焊料和模块，以减少焊料跳跃，桥梁和冰柱。 声压波被引导到模块/熔融焊料边界，以对施加剪切作用的边界施加压力。 剪切作用导致多余的熔融焊料在重力的作用下下降到熔融焊料槽中。

公开(公告)号：US06662812B1

公开(公告)日：2003-12-16

申请号：US09621249

申请日：2000-07-21

申请人： Allen David Hertz ,  Eric L. Hertz ,  Dennis D. Epp

发明人： Allen David Hertz ,  Eric L. Hertz ,  Dennis D. Epp

IPC分类号： B08B310

CPC分类号： H05K3/227 ,  B08B7/028 ,  B41F35/005 ,  B41P2235/14 ,  F26B5/02 ,  F26B5/12 ,  H05K3/1216 ,  H05K3/26

摘要： A method and apparatus are disclosed for improving drying of a module, tooling, and solder stencils via the introduction of acoustic pressure waves and/or vibrational energy to the module, tooling, or solder stencils. The acoustic pressure waves may be created by a transducer where the waves are transferred to the module through air or a vibrational interface medium. The acoustic pressure waves impinge on the water droplets to atomize the droplets on the surface of the module and in the cracks, crevices and hard to reach areas of connectors and other components, without undesirable heat. The acoustic energy may further be used to assist in cleaning solder stencils within an automated screen printer.

摘要翻译： 公开了一种用于通过将声压波和/或振动能引入到模块，模具或焊料模板来改进模块，模具和焊料模板的干燥的方法和装置。 声压波可以由换能器产生，其中波通过空气或振动界面介质传递到模块。 声压波冲击水滴以雾化模块表面上的液滴，并且在裂缝，缝隙中难以到达连接器和其他部件的区域，而不会有不希望的热量。 还可以使用声能来帮助清洁自动丝网印刷机内的焊锡模板。

公开(公告)号：US06230963B1

公开(公告)日：2001-05-15

申请号：US08832288

申请日：1997-04-03

申请人： Eric L. Hertz

发明人： Eric L. Hertz

IPC分类号： B23K300

CPC分类号： H05K3/3478 ,  B23K3/0623 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/082

摘要： A method and apparatus are disclosed for placing solder balls on electronic pads on a component or substrate, such as for a ball grid array (BGA) applicator. The BGA applicator utilizes a foil(s) that is treated to provide color to the surface; the color is used to assist in inspection of the solder spheres. The solder balls can transferred to the electronic pads by holding them to openings in the foil by applying a holding force such as a vacuum applied to the solder balls through the openings in a foil. Optionally, a second material can be placed against the foil where the secondary material holds solder spheres to the apertures. After locating the solder balls to the electronic pads of a component or substrate, the solder balls are released and placed on the electronic pads by removing the holding force such as by deactivating the vacuum.

摘要翻译： 公开了用于将焊球放置在组件或衬底上的电子焊盘上的方法和装置，例如用于球栅阵列（BGA）施加器。 BGA施加器使用被处理以向表面提供颜色的箔; 颜色用于帮助检查焊球。 通过在箔中通过施加到焊球上的保持力，例如通过施加到焊球上的保持力将焊球保持在箔中的开口，可以将焊球转移到电子焊盘。 可选地，可以将第二材料放置在箔上，其中辅助材料将焊球保持到孔。 在将焊球定位到部件或基板的电子焊盘之后，通过除去诸如通过去激活真空的保持力来将焊球释放并放置在电子焊盘上。