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公开(公告)号：US07611400B2
公开(公告)日：2009-11-03
申请号：US11741609
申请日：2007-04-27
申请人： Alpay Yilmaz , Lakshmanan Karuppiah
发明人： Alpay Yilmaz , Lakshmanan Karuppiah
IPC分类号： B24B53/00
CPC分类号： B24B53/017 , H01L21/67051 , H01L21/67092 , H01L21/67253
摘要： A method and apparatus for monitoring polishing pad conditioning mechanisms is provided. In one embodiment, a semiconductor substrate polishing system includes a rinse station, a polishing surface, a conditioning element, and a conditioning mechanism. The conditioning mechanism selectively positions the conditioning element over the polishing surface and over the rinse station. At least one sensor is provided and is configured to detect a first position and a second position of the conditioning element when disposed over the rinse station.
摘要翻译： 提供了一种用于监测抛光垫调节机构的方法和装置。 在一个实施例中，半导体衬底抛光系统包括冲洗台，抛光表面，调节元件和调节机构。 调理机构选择性地将调理元件定位在抛光表面上和漂洗台上。 提供至少一个传感器，并且被配置为当设置在漂洗站上时检测调理元件的第一位置和第二位置。
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2.发明申请Process for high copper removal rate with good planarization and surface finish 审中-公开具有良好的平坦化和表面光洁度的高铜去除率的工艺公开(公告)号：US20070235344A1
公开(公告)日：2007-10-11
申请号：US11399560
申请日：2006-04-06
申请人： Renhe Jia , You Wang , Gerald Alonzo , Yongqi Hu , Zhihong Wang , Jie Diao , Stan D Tsai , Alpay Yilmaz , Lakshmanan Karuppiah , Liang-Yuh Chen
发明人： Renhe Jia , You Wang , Gerald Alonzo , Yongqi Hu , Zhihong Wang , Jie Diao , Stan D Tsai , Alpay Yilmaz , Lakshmanan Karuppiah , Liang-Yuh Chen
IPC分类号： B23H5/08
CPC分类号： B23H5/08 , C25F3/02 , H01L21/32125
摘要： A method for electrochemical mechanical polishing (ECMP) is disclosed. The polishing rate and surface finish of the layer on the wafer are improved by controlling the surface speed of both the platen and head, controlling the current applied to the pad, and preselecting the density of the perforations on the fully conductive polishing pad. ECMP produces much higher removal rates, good surface finishes, and good planarization efficiency at a lower down force. Generally, increasing the surface speed of both the platen and the head will increase the surface smoothness. Also, increasing the current density on the wafer will increase the surface smoothness. There is virtually no difference in the smoothness of the wafer surface between the center, middle, and edge of the wafer. For copper, removal rates of 10,000 Å/min and greater can be achieved.
摘要翻译： 公开了一种用于电化学机械抛光（ECMP）的方法。 通过控制压板和头部的表面速度，控制施加到垫的电流以及预选在全导电抛光垫上的穿孔密度来提高晶片上层的抛光速率和表面光洁度。 ECMP在较低的下压力下产生高得多的去除率，良好的表面光洁度和良好的平面化效率。 通常，增加压板和头部的表面速度将增加表面平滑度。 此外，增加晶片上的电流密度将增加表面平滑度。 在晶片的中心，中间和边缘之间的晶片表面的平滑度几乎没有差别。 对于铜，可以实现10,000 / min以上的去除率。
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公开(公告)号：US20070095677A1
公开(公告)日：2007-05-03
申请号：US11554928
申请日：2006-10-31
申请人： You Wang , Stan Tsai , Lakshmanan Karuppiah , Jie Diao , Renhe Jia , Alpay Yilmaz
发明人： You Wang , Stan Tsai , Lakshmanan Karuppiah , Jie Diao , Renhe Jia , Alpay Yilmaz
IPC分类号： B23H3/00
CPC分类号： B23H5/08 , B24B37/042 , B24B37/046 , B24B53/017 , C25F1/00 , H01L21/32125
摘要： A method for conditioning an Ecmp pad is provided. In one embodiment, a method for electrochemically processing a substrate includes the steps of providing an electrical bias voltage between the top surface of the pad assembly and an electrode, and electrochemically removing contaminants from the top surface of the pad.
摘要翻译： 提供了一种调节Ecmp垫的方法。 在一个实施例中，用于电化学处理衬底的方法包括以下步骤：在衬垫组件的顶表面和电极之间提供电偏置电压，以及电化学去除衬垫顶表面的污染物。
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公开(公告)号：US07210981B2
公开(公告)日：2007-05-01
申请号：US11273766
申请日：2005-11-14
申请人： Alpay Yilmaz , Lakshmanan Karuppiah
发明人： Alpay Yilmaz , Lakshmanan Karuppiah
IPC分类号： B24B53/00
CPC分类号： B24B53/017 , H01L21/67051 , H01L21/67092 , H01L21/67253
摘要： A method and apparatus for monitoring polishing pad conditioning mechanisms is provided. In one embodiment, a semiconductor substrate polishing system includes a rinse station, a polishing surface, a conditioning element, and a conditioning mechanism. The conditioning mechanism selectively positions the conditioning element over the polishing surface and over the rinse station. At least one sensor is provided and is configured to detect a first position and a second position of the conditioning element when disposed over the rinse station.
摘要翻译： 提供了一种用于监测抛光垫调节机构的方法和装置。 在一个实施例中，半导体衬底抛光系统包括冲洗台，抛光表面，调节元件和调节机构。 调理机构选择性地将调理元件定位在抛光表面上和漂洗台上。 提供至少一个传感器，并且被配置为当设置在漂洗站上时检测调理元件的第一位置和第二位置。
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公开(公告)号：US20080146121A1
公开(公告)日：2008-06-19
申请号：US11957798
申请日：2007-12-17
摘要： A processing pad and platen assembly for processing a substrate is provided. The platen assembly includes a spacer having an upper surface adapted to contact a lower surface of a pad assembly, an upper plate having a recessed area coupled to and disposed below the spacer, and a lower plate coupled to and disposed below the upper plate. The pad assembly includes at least a processing layer having a working surface adapted to process a substrate and an electrode disposed below the working surface of the processing layer. The spacer and the pad assembly have apertures therethrough to provide an electrolyte pathway to the platen assembly for removal of residual materials and other byproducts.
摘要翻译： 提供了一种用于处理基板的处理垫和压板组件。 压板组件包括具有适于接触焊盘组件的下表面的上表面的间隔件，具有联接到并设置在间隔件下方的凹陷区域的上板和联接到并设置在上板下方的下板。 衬垫组件至少包括具有适于处理衬底的工作表面和设置在处理层的工作表面下方的电极的处理层。 间隔件和衬垫组件具有穿过其中的孔，以提供到压板组件的电解质通路，用于去除残余材料和其它副产物。
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公开(公告)号：US20080014845A1
公开(公告)日：2008-01-17
申请号：US11775533
申请日：2007-07-10
申请人： Alpay Yilmaz , Omer Ozgun , Gerald Alonzo , Lakshmanan Karuppiah , Shou-Sung Chang , Antoine P. Manens , Clinton Sakata
发明人： Alpay Yilmaz , Omer Ozgun , Gerald Alonzo , Lakshmanan Karuppiah , Shou-Sung Chang , Antoine P. Manens , Clinton Sakata
IPC分类号： B24B21/18
CPC分类号： B24B53/017
摘要： A method and apparatus for conditioning a conductive polishing material is described. In one embodiment, the pad dresser comprises a backing plate adapted to coupled to a conditioning head assembly, the backing plate comprising a rigid disk having a first side and an opposing second side, the second side having a perpendicular orientation to a centerline of the backing plate, and an annular member having a base portion adhered to the second side of the backing plate, wherein the annular member defines a conditioning surface opposite the second side that is radially sloped relative to a plane of the second side.
摘要翻译： 描述了用于调理导电抛光材料的方法和装置。 在一个实施例中，垫修整器包括适于联接到调节头组件的背板，所述背板包括具有第一侧和相对的第二侧的刚性盘，所述第二侧具有与所述背衬的中心线垂直的取向 板和环形构件，其具有粘附到背板的第二侧的基部，其中环形构件限定相对于第二侧的平面径向倾斜的第二侧相对的调节表面。
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公开(公告)号：US08172643B2
公开(公告)日：2012-05-08
申请号：US12420996
申请日：2009-04-09
CPC分类号： B24B37/04 , B24B41/047 , B24B45/003
摘要： Embodiments described herein relate to a track system in a polishing system. One embodiment described herein provides a track system configured to transfer polishing heads in a polishing system. The track system comprises a supporting frame, a track coupled to the supporting frame and defining a path along which the polishing heads are configured to move, and one or more carriages configured to carry at least one polishing head along the path defined by the track, wherein the one or more carriages are coupled to the track and independently movable along the track.
摘要翻译： 本文所述的实施例涉及抛光系统中的轨道系统。 本文所述的一个实施例提供了一种配置成在抛光系统中传送抛光头的轨道系统。 轨道系统包括支撑框架，轨道，其联接到支撑框架并且限定抛光头被配置为移动的路径，以及一个或多个托架，其构造成沿着由轨道限定的路径承载至少一个抛光头， 其中所述一个或多个托架联接到所述轨道并且可以沿着所述轨道独立地移动。
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公开(公告)号：US20060270322A1
公开(公告)日：2006-11-30
申请号：US11273766
申请日：2005-11-14
申请人： Alpay Yilmaz , Lakshmanan Karuppiah
发明人： Alpay Yilmaz , Lakshmanan Karuppiah
CPC分类号： B24B53/017 , H01L21/67051 , H01L21/67092 , H01L21/67253
摘要： A method and apparatus for monitoring polishing pad conditioning mechanisms is provided. In one embodiment, a semiconductor substrate polishing system includes a rinse station, a polishing surface, a conditioning element, and a conditioning mechanism. The conditioning mechanism selectively positions the conditioning element over the polishing surface and over the rinse station. At least one sensor is provided and is configured to detect a first position and a second position of the conditioning element when disposed over the rinse station.
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公开(公告)号：US07914363B2
公开(公告)日：2011-03-29
申请号：US12576820
申请日：2009-10-09
申请人： Alpay Yilmaz , Lakshmanan Karuppiah
发明人： Alpay Yilmaz , Lakshmanan Karuppiah
IPC分类号： B24B53/00
CPC分类号： B24B53/017 , H01L21/67051 , H01L21/67092 , H01L21/67253
摘要： A method and apparatus for monitoring polishing pad conditioning mechanisms is provided. In one embodiment, a semiconductor substrate polishing system includes a rinse station, a polishing surface, a conditioning element, and a conditioning mechanism. The conditioning mechanism selectively positions the conditioning element over the polishing surface and over the rinse station. At least one sensor is provided and is configured to detect a first position and a second position of the conditioning element when disposed over the rinse station.
摘要翻译： 提供了一种用于监测抛光垫调节机构的方法和装置。 在一个实施例中，半导体衬底抛光系统包括冲洗台，抛光表面，调节元件和调节机构。 调理机构选择性地将调理元件定位在抛光表面上和漂洗台上。 提供至少一个传感器，并且被配置为当设置在漂洗站上时检测调理元件的第一位置和第二位置。
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公开(公告)号：US20100029178A1
公开(公告)日：2010-02-04
申请号：US12576820
申请日：2009-10-09
申请人： Alpay Yilmaz , Lakshmanan Karuppiah
发明人： Alpay Yilmaz , Lakshmanan Karuppiah
CPC分类号： B24B53/017 , H01L21/67051 , H01L21/67092 , H01L21/67253
摘要： A method and apparatus for monitoring polishing pad conditioning mechanisms is provided. In one embodiment, a semiconductor substrate polishing system includes a rinse station, a polishing surface, a conditioning element, and a conditioning mechanism. The conditioning mechanism selectively positions the conditioning element over the polishing surface and over the rinse station. At least one sensor is provided and is configured to detect a first position and a second position of the conditioning element when disposed over the rinse station.
摘要翻译： 提供了一种用于监测抛光垫调节机构的方法和装置。 在一个实施例中，半导体衬底抛光系统包括冲洗台，抛光表面，调节元件和调节机构。 调理机构选择性地将调理元件定位在抛光表面上和漂洗台上。 提供至少一个传感器，并且被配置为当设置在漂洗站上时检测调理元件的第一位置和第二位置。
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