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    CONDITIONING DISK HAVING UNIFORM STRUCTURES
    1.
    发明申请
    CONDITIONING DISK HAVING UNIFORM STRUCTURES 审中-公开
    具有均匀结构的调节盘

    公开(公告)号：US20080014845A1

    公开(公告)日：2008-01-17

    申请号：US11775533

    申请日：2007-07-10

    申请人： Alpay Yilmaz ,  Omer Ozgun ,  Gerald Alonzo ,  Lakshmanan Karuppiah ,  Shou-Sung Chang ,  Antoine P. Manens ,  Clinton Sakata

    发明人： Alpay Yilmaz ,  Omer Ozgun ,  Gerald Alonzo ,  Lakshmanan Karuppiah ,  Shou-Sung Chang ,  Antoine P. Manens ,  Clinton Sakata

    IPC分类号： B24B21/18

    CPC分类号： B24B53/017

    摘要： A method and apparatus for conditioning a conductive polishing material is described. In one embodiment, the pad dresser comprises a backing plate adapted to coupled to a conditioning head assembly, the backing plate comprising a rigid disk having a first side and an opposing second side, the second side having a perpendicular orientation to a centerline of the backing plate, and an annular member having a base portion adhered to the second side of the backing plate, wherein the annular member defines a conditioning surface opposite the second side that is radially sloped relative to a plane of the second side.

    摘要翻译： 描述了用于调理导电抛光材料的方法和装置。 在一个实施例中，垫修整器包括适于联接到调节头组件的背板，所述背板包括具有第一侧和相对的第二侧的刚性盘，所述第二侧具有与所述背衬的中心线垂直的取向 板和环形构件，其具有粘附到背板的第二侧的基部，其中环形构件限定相对于第二侧的平面径向倾斜的第二侧相对的调节表面。

    PLATEN ASSEMBLY FOR ELECTROCHEMICAL MECHANICAL PROCESSING
    2.
    发明申请
    PLATEN ASSEMBLY FOR ELECTROCHEMICAL MECHANICAL PROCESSING 审中-公开
    电化学机械加工用板组件

    公开(公告)号：US20080146121A1

    公开(公告)日：2008-06-19

    申请号：US11957798

    申请日：2007-12-17

    申请人： Omer Ozgun ,  Alpay Yilmaz ,  Antoine P. Manens ,  Lakshmanan Karuppiah

    发明人： Omer Ozgun ,  Alpay Yilmaz ,  Antoine P. Manens ,  Lakshmanan Karuppiah

    IPC分类号： B24B7/04 ,  B24B1/00 ,  B23H5/08

    CPC分类号： B24B37/16 ,  B23H5/08

    摘要： A processing pad and platen assembly for processing a substrate is provided. The platen assembly includes a spacer having an upper surface adapted to contact a lower surface of a pad assembly, an upper plate having a recessed area coupled to and disposed below the spacer, and a lower plate coupled to and disposed below the upper plate. The pad assembly includes at least a processing layer having a working surface adapted to process a substrate and an electrode disposed below the working surface of the processing layer. The spacer and the pad assembly have apertures therethrough to provide an electrolyte pathway to the platen assembly for removal of residual materials and other byproducts.

    摘要翻译： 提供了一种用于处理基板的处理垫和压板组件。 压板组件包括具有适于接触焊盘组件的下表面的上表面的间隔件，具有联接到并设置在间隔件下方的凹陷区域的上板和联接到并设置在上板下方的下板。 衬垫组件至少包括具有适于处理衬底的工作表面和设置在处理层的工作表面下方的电极的处理层。 间隔件和衬垫组件具有穿过其中的孔，以提供到压板组件的电解质通路，用于去除残余材料和其它副产物。

    Multi-layer polishing pad for low-pressure polishing
    3.
    发明授权
    Multi-layer polishing pad for low-pressure polishing 有权
    用于低压抛光的多层抛光垫

    公开(公告)号：US08066552B2

    公开(公告)日：2011-11-29

    申请号：US11043361

    申请日：2005-01-26

    申请人： Alain Duboust ,  Shou-Sung Chang ,  Wei Lu ,  Siew Neo ,  Yan Wang ,  Antoine P. Manens ,  Yongsik Moon

    发明人： Alain Duboust ,  Shou-Sung Chang ,  Wei Lu ,  Siew Neo ,  Yan Wang ,  Antoine P. Manens ,  Yongsik Moon

    IPC分类号： B24B29/00

    CPC分类号： B24B37/013 ,  B24B37/046 ,  B24B37/205 ,  B24B37/22 ,  B24B37/26 ,  B24D11/02

    摘要： A polishing pad has a polishing layer and a backing layer secured to the polishing layer. The polishing layer has a polishing surface, a first thickness, a first compressibility, and a hardness between about 40 to 80 Shore D. The backing layer has a second thickness and has a second compressibility greater than the first compressibility. The first thickness, first compressibility, second thickness and second compressibility are such that the polishing surface deflects more than the thickness non-uniformity of the polishing layer under an applied pressure of 1.5 psi or less.

    摘要翻译： 抛光垫具有固定到抛光层的抛光层和背衬层。 抛光层具有抛光表面，第一厚度，第一可压缩性和约40至80肖氏D之间的硬度。背衬层具有大于第一可压缩性的第二厚度并具有第二可压缩性。 第一厚度，第一可压缩性，第二厚度和第二可压缩性使得抛光表面在1.5psi或更小的施加压力下偏转大于抛光层的厚度不均匀性。