公开(公告)号：US20180145397A1

公开(公告)日：2018-05-24

申请号：US15863269

申请日：2018-01-05

Applicant: Alps Electric Co., Ltd.

Inventor： Masashi Nakagawa ,  Takehiro Seike ,  Hideki Watanabe ,  Yoshihisa Shibuya ,  Shunji Kuwana

IPC: H01Q1/22 ,  H05K1/18 ,  H05K3/36 ,  H05K1/14 ,  H05K1/02

CPC classification number: H01Q1/2283 ,  H01Q1/2291 ,  H01Q1/36 ,  H01Q1/405 ,  H01Q5/371 ,  H01Q9/42 ,  H05K1/0243 ,  H05K1/144 ,  H05K1/181 ,  H05K1/185 ,  H05K3/321 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/09909 ,  H05K2201/10098 ,  H05K2201/10522 ,  H05K2201/10568 ,  H05K2201/10636 ,  H05K2201/2036 ,  H05K2201/2081

Abstract: A high-frequency module includes a wiring substrate and an antenna substrate disposed on an upper surface of the wiring substrate, an antenna is formed by a metal pattern on the antenna substrate, a non-conductive adhesive and a conductive adhesive are disposed between the wiring substrate and the antenna substrate, and a spacer is provided between the non-conductive adhesive and the conductive adhesive. Thus, by the spacer, it is possible to prevent contact between the non-conductive adhesive and the conductive adhesive and it is also possible to ensure a required height between the wiring substrate and the antenna substrate. In addition, it is possible to achieve connection between the wiring substrate and the antenna substrate by a simple structure.