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公开(公告)号:US10574247B1
公开(公告)日:2020-02-25
申请号:US16131886
申请日:2018-09-14
Applicant: Analog Devices Global Unlimited Company
Inventor: Junbiao Ding , Tony Yincai Liu , Dennis A. Dempsey , John Jude O'Donnell
Abstract: The present disclosure relates to a digital-to-analog converter (DAC) which includes a resistor string and a transfer function modification circuit. The transfer function modification circuit may be a calibration circuit for calibrating the DAC, The calibration circuit may include a plurality of current sources, which may be current DACs. Each of the current DACS inject current into, or drain current from, a respective node of the resistor string, in order to correct for voltage errors. The injected currents may be positive or negative, depending on the voltage error. The current DACs are controlled by trim codes, which are set dependent on the measured or simulated voltage errors for a given resistor string.
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公开(公告)号:US20170265794A1
公开(公告)日:2017-09-21
申请号:US15072961
申请日:2016-03-17
Applicant: Analog Devices Global
Inventor: John Jude O'Donnell , Javier Calpe Maravilla , Colin G. Lyden , Thomas G. O'Dwyer
IPC: A61B5/1455 , A61B5/00 , A61B5/0402
CPC classification number: A61B5/14552 , A61B5/0402 , A61B5/7292 , A61B2562/0238
Abstract: A blood oxygenation sensor is provided comprising: a first current-powered light source to produce light having a first wavelength; a second current-powered light source to produce light having a second wavelength; a light sensor to produce a current signal having a magnitude that is indicative of intensity of light incident upon it; a current level driver circuit that includes a current source configured to couple the current source to alternatively provide current to one of the first current-powered light source and the second light current-powered light source; a processor configured to predict times of occurrence of one or more first time intervals in which arterial volume at a tissue site is at one of a maximum and a minimum; wherein the processor is configured to control the current source, to provide a first pattern of higher power-dissipation current pulses to the first and second current-powered light sources during the first time intervals, and to provide a second pattern of lower power-dissipation current pulses to at least one of the first and second current-powered light sources during second time intervals.
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公开(公告)号:US20180323750A1
公开(公告)日:2018-11-08
申请号:US15586922
申请日:2017-05-04
Applicant: Analog Devices Global
Inventor: Hanqing Wang , John Jude O'Donnell
IPC: H03F1/26 , H03G3/20 , H03F3/45 , G01N27/416
CPC classification number: H03F1/26 , G01N27/4163 , H03F3/45475 , H03F2200/555 , H03G3/20
Abstract: Techniques for improving noise performance while processing signals received from an electrochemical sensor are provided. In an example, an interface circuit can include a first amplifier configured to provide a voltage to a counter electrode of an electrochemical sensor, a second amplifier configured to receive sensor information from a working electrode of the electrochemical sensor and to provide concentration information using the sensor information. In certain examples, an input of the first amplifier can be directly coupled to an input of the second amplifier to attenuate noise, of either the first amplifier or the second amplifier, within the concentration information provided by the second amplifier.
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公开(公告)号:US20200091923A1
公开(公告)日:2020-03-19
申请号:US16131886
申请日:2018-09-14
Applicant: Analog Devices Global Unlimited Company
Inventor: Junbiao Ding , Tony Yincai Liu , Dennis A. Dempsey , John Jude O'Donnell
Abstract: The present disclosure relates to a digital-to-analog converter (DAC) which includes a resistor string and a transfer function modification circuit. The transfer function modification circuit may be a calibration circuit for calibrating the DAC, The calibration circuit may include a plurality of current sources, which may be current DACs. Each of the current DACS inject current into, or drain current from, a respective node of the resistor string, in order to correct for voltage errors. The injected currents may be positive or negative, depending on the voltage error. The current DACs are controlled by trim codes, which are set dependent on the measured or simulated voltage errors for a given resistor string.
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公开(公告)号:US20180360359A1
公开(公告)日:2018-12-20
申请号:US15622846
申请日:2017-06-14
Applicant: Analog Devices Global
Inventor: John Jude O'Donnell , Colin G. Lyden , Michael C.W. Coln
IPC: A61B5/1455 , G01J1/46 , G01J1/08 , A61B5/00
Abstract: A photometry device can include a first LED to emit light to a target in response to a first current through the first LED, a second LED to emit light to the target in response to a second current through the second LED, and an inductor, coupled to the first and second LEDs, to store energy associated with at least one of the first and second currents.
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公开(公告)号:US10461151B2
公开(公告)日:2019-10-29
申请号:US15288502
申请日:2016-10-07
Applicant: ANALOG DEVICES GLOBAL
Inventor: Patrick F. M. Poucher , Padraig L. Fitzgerald , John Jude O'Donnell , Oliver J. Kierse , Denis M. O'Connor
Abstract: An integrated circuit may include a semiconductor die having a trench formed in a surface of the semiconductor die. One or more circuit components may be formed on the surface of the semiconductor die. The trench can extend into the semiconductor die next to at least one circuit component. The trench may surround the circuit component partially or wholly. The trench may be filled with a material having a lower bulk modulus than the semiconductor die in which the trench is formed.
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公开(公告)号:US20170025497A1
公开(公告)日:2017-01-26
申请号:US15288502
申请日:2016-10-07
Applicant: ANALOG DEVICES GLOBAL
Inventor: Patrick F.M. Poucher , Padraig L. Fitzgerald , John Jude O'Donnell , Oliver J. Kierse , Denis M. O'Connor
CPC classification number: H01L29/0649 , H01L21/764 , H01L23/16 , H01L23/3135 , H01L23/3178 , H01L23/562 , H01L2924/0002 , H01L2924/00
Abstract: An integrated circuit may include a semiconductor die having a trench formed in a surface of the semiconductor die. One or more circuit components may be formed on the surface of the semiconductor die. The trench can extend into the semiconductor die next to at least one circuit component. The trench may surround the circuit component partially or wholly. The trench may be filled with a material having a lower bulk modulus than the semiconductor die in which the trench is formed.
Abstract translation: 集成电路可以包括具有形成在半导体管芯的表面中的沟槽的半导体管芯。 可以在半导体管芯的表面上形成一个或多个电路部件。 沟槽可以在至少一个电路部件旁边延伸到半导体管芯中。 沟槽可以部分或全部地围绕电路部件。 沟槽可以填充具有比其中形成沟槽的半导体管芯更低的体积模量的材料。
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公开(公告)号:US10582887B2
公开(公告)日:2020-03-10
申请号:US15072961
申请日:2016-03-17
Applicant: Analog Devices Global
Inventor: John Jude O'Donnell , Javier Calpe Maravilla , Colin G. Lyden , Thomas G. O'Dwyer
IPC: A61B5/1455 , A61B5/0402 , A61B5/00
Abstract: A blood oxygenation sensor is provided comprising: a first current-powered light source to produce light having a first wavelength; a second current-powered light source to produce light having a second wavelength; a light sensor to produce a current signal having a magnitude that is indicative of intensity of light incident upon it; a current level driver circuit that includes a current source configured to couple the current source to alternatively provide current to one of the first current-powered light source and the second light current-powered light source; a processor configured to predict times of occurrence of one or more first time intervals in which arterial volume at a tissue site is at one of a maximum and a minimum; wherein the processor is configured to control the current source, to provide a first pattern of higher power-dissipation current pulses to the first and second current-powered light sources during the first time intervals, and to provide a second pattern of lower power-dissipation current pulses to at least one of the first and second current-powered light sources during second time intervals.
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公开(公告)号:US09466666B2
公开(公告)日:2016-10-11
申请号:US13740677
申请日:2013-01-14
Applicant: ANALOG DEVICES GLOBAL
Inventor: Patrick F. M. Poucher , Padraig L. Fitzgerald , John Jude O'Donnell , Oliver J. Kierse , Denis M. O'Connor
CPC classification number: H01L29/0649 , H01L21/764 , H01L23/16 , H01L23/3135 , H01L23/3178 , H01L23/562 , H01L2924/0002 , H01L2924/00
Abstract: An integrated circuit may include a semiconductor die having a trench formed in a surface of the semiconductor die. One or more circuit components may be formed on the surface of the semiconductor die. The trench can extend into the semiconductor die next to at least one circuit component. The trench may surround the circuit component partially or wholly. The trench may be filled with a material having a lower bulk modulus than the semiconductor die in which the trench is formed.
Abstract translation: 集成电路可以包括具有形成在半导体管芯的表面中的沟槽的半导体管芯。 可以在半导体管芯的表面上形成一个或多个电路部件。 沟槽可以延伸到半导体管芯中,靠近至少一个电路部件。 沟槽可以部分或全部地围绕电路部件。 沟槽可以填充具有比其中形成沟槽的半导体管芯更低的体积模量的材料。
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