Method and apparatus for the coating of substrates for pharmaceutical use
    8.
    发明授权
    Method and apparatus for the coating of substrates for pharmaceutical use 失效
    用于药物用途的底物涂层的方法和装置

    公开(公告)号:US06783768B1

    公开(公告)日:2004-08-31

    申请号:US09310740

    申请日:1999-05-13

    IPC分类号: A61K970

    摘要: Method of coating a substrate which is a belt, sheet, film, or tape, comprising applying an active coating material to the substrate to form an active coating layer, the active coating material comprising biologically active material. The active coating material is applied electrostatically as a powder and, after the active coating material is applied, the active coating material is fused to form an active film layer. The active coating material is removable from the substrate as a wafer comprising the active film layer.

    摘要翻译: 涂布作为带,片,薄膜或胶带的基材的方法包括将活性涂料施用于基材以形成活性涂层,所述活性涂料包含生物活性材料。 活性涂料以静电作为粉末涂布,并且在施加活性涂料后,将活性涂料熔融以形成活性薄膜层。 活性涂层材料作为包含有源膜层的晶片从基板上移除。

    Electrostatic coating of substrates of medicinal products
    9.
    发明授权
    Electrostatic coating of substrates of medicinal products 失效
    医药产品底物的静电涂层

    公开(公告)号:US5470603A

    公开(公告)日:1995-11-28

    申请号:US937870

    申请日:1992-10-19

    摘要: Method of coating cores of pharmaceutical tablets with a dry powder, wherein the cores are fed onto a conveyor, the dry powder is supplied to a region through which the cores are to be conveyed, and the cores are conveyed on the conveyor through the region with the cores maintained at a different electric potential from the dry powder. In this way, the dry powder is attracted to the exposed surfaces of the cores to form powder coatings thereon. The dry powder on the surface of the cores is then melted to convert the powder into fused film coatings secured to the cores.

    摘要翻译: PCT No.PCT / GB92 / 00323 Sec。 371日期:1992年10月19日 102(e)日期1992年10月19日PCT提交1992年2月21日PCT公布。 公开号WO92 / 14451 日期:使用干燥粉末将药片包芯的方法,其中芯体被输送到输送机上,将干燥粉末供给到要被输送芯的区域,并且将核心在输送机上通过 核心与干粉保持不同的电位。 以这种方式,干粉被吸引到芯的暴露表面,以在其上形成粉末涂层。 然后将芯的表面上的干粉熔化以将粉末转化成固定到芯的熔融膜涂层。