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公开(公告)号：US20050073464A1
公开(公告)日：2005-04-07
申请号：US10962579
申请日：2004-10-13
申请人： Pontus Bergmark , Anders Remgard
发明人： Pontus Bergmark , Anders Remgard
CPC分类号： H01Q13/0291 , H01P1/208 , H01P3/12 , H01P11/002 , Y10T29/49016
摘要： The present invention relates to a microwave component with an at least partially enclosed cavity, such as a microwave filter, a waveguide or a horn antenna, comprising an outer support structure (A) and an electric layer (C) which is made of pulse-plated silver and which is arranged on the inside of the support structure and faces the cavity. The microwave component is distinguished in that it further comprises a first inner protective layer of chemically precipitated gold (D), said a protective layer being arranged on the electric layer (C) and facing the cavity.
摘要翻译： 本发明涉及一种具有至少部分封闭空腔的微波部件，例如微波滤波器，波导或喇叭天线，其包括由外部支撑结构（A）和电气层（C）构成的外部支撑结构（A） 并且其布置在支撑结构的内侧并面向空腔。 微波组件的特征在于它还包括化学沉淀金（D）的第一内保护层，所述保护层布置在电层（C）上并面向空腔。
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公开(公告)号：US20080206474A1
公开(公告)日：2008-08-28
申请号：US11791512
申请日：2005-12-13
申请人： Anders Remgard
发明人： Anders Remgard
CPC分类号： C23C18/1675 , C23C18/1601 , C23C18/1651 , C23C18/1882 , C23C18/31 , C23C18/34 , C23C18/40 , C23C18/44 , C23C18/54 , Y10T428/31678
摘要： Disclosed is a method of plating a substrate with a metal using an autocatalytic electroless plating bath wherein the bath is operated above its cloud point temperature such that at least two phases are present in the bath. An autocatalytic electroless plating bath for coating silver metal is also described. A method for autocatalytic plating of silver metal directly onto a silicon surface without the need for an intervening layer of metal is also disclosed. The deposits of silver obtained are uniform, non-porous and have electrical properties. The technique can be applied for different processes and bath formulations i.e. different metals, complexing agents and reducing agents.
摘要翻译： 公开了一种使用自催化无电解镀液将金属镀金的方法，其中浴在其浊点温度以上运行，使得浴中存在至少两相。 还描述了用于涂覆银金属的自催化无电镀浴。 还公开了一种将银金属直接自动电镀到硅表面上而不需要中间金属层的方法。 获得的银的沉积物是均匀的，无孔的并且具有电性能。 该技术可以应用于不同的方法和浴制剂，即不同的金属，络合剂和还原剂。
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