摘要:
Apparatus and methods are provided for monitoring a pulsed RF bias signal applied to a chuck in a processing chamber. One method includes operations for detecting voltage values of individual pulses of the pulsed RF bias voltage, and for determining the time for sampling the value of each individual detected pulse. At the sampling time for each pulse, a particular voltage value of the respective individual detected pulse is sampled and the particular voltage value is held. Each particular voltage value represents a characteristic peak-to-peak voltage value of each individual detected pulse. A feedback signal representing the characteristic peak-to-peak voltage value for a voltage envelope of one of the individual detected pulses is generated, and the voltage of the pulsed RF bias voltage signal applied to the chuck is adjusted according to a difference between the feedback signal and a desired voltage value of the pulsed RF bias voltage signal.
摘要:
Apparatus and methods are provided for monitoring a pulsed RF bias signal applied to a chuck in a processing chamber. One method includes operations for detecting voltage values of individual pulses of the pulsed RF bias voltage, and for determining the time for sampling the value of each individual detected pulse. At the sampling time for each pulse, a particular voltage value of the respective individual detected pulse is sampled and the particular voltage value is held. Each particular voltage value represents a characteristic peak-to-peak voltage value of each individual detected pulse. A feedback signal representing the characteristic peak-to-peak voltage value for a voltage envelope of one of the individual detected pulses is generated, and the voltage of the pulsed RF bias voltage signal applied to the chuck is adjusted according to a difference between the feedback signal and a desired voltage value of the pulsed RF bias voltage signal.
摘要:
Apparatus and methods are provided to detect and control a voltage potential applied in a plasma chamber for processing a semiconductor wafer. The plasma chamber includes circuitry for monitoring and adjusting a pulsed RF bias voltage signal to be applied to a chuck in the plasma chamber, where the chuck is configured to mount the wafer for processing. The circuitry includes an RF bias voltage detector for detecting individual pulses of the pulsed RF bias voltage signal applied to the chuck. A timing circuit is provided for determining a time for sampling each of the individual detected pulses and a sample and hold circuit. The sample and hold circuit is triggered at the sampling time for sampling each of the individual detected pulses to determine and hold a voltage value representing a peak peak-to-peak voltage value of each individual detected pulse, and the sample and hold circuit is configured to provide a feedback signal representing the peak peak-to-peak voltage value of at least one of the detected pulses. Further included is a feedback circuit for adjusting the voltage of the pulsed RF bias voltage signal applied to the chuck according to a difference between the feedback signal and a desired voltage value of the RF bias voltage signal.
摘要:
Apparatus and methods are provided for monitoring a pulsed RF bias signal applied to a chuck in a processing chamber. One method includes operations for detecting voltage values of individual pulses of the pulsed RF bias voltage, and for determining the time for sampling the value of each individual detected pulse. At the sampling time for each pulse, a particular voltage value of the respective individual detected pulse is sampled and the particular voltage value is held. Each particular voltage value represents a characteristic peak-to-peak voltage value of each individual detected pulse. A feedback signal representing the characteristic peak-to-peak voltage value for a voltage envelope of one of the individual detected pulses is generated, and the voltage of the pulsed RF bias voltage signal applied to the chuck is adjusted according to a difference between the feedback signal and a desired voltage value of the pulsed RF bias voltage signal.
摘要:
Apparatus and methods are provided to detect and control a voltage potential applied in a plasma chamber for processing a semiconductor wafer. The plasma chamber includes circuitry for monitoring and adjusting a pulsed RF bias voltage signal to be applied to a chuck in the plasma chamber, where the chuck is configured to mount the wafer for processing. The circuitry includes an RF bias voltage detector for detecting individual pulses of the pulsed RF bias voltage signal applied to the chuck. A timing circuit is provided for determining a time for sampling each of the individual detected pulses and a sample and hold circuit. The sample and hold circuit is triggered at the sampling time for sampling each of the individual detected pulses to determine and hold a voltage value representing a peak peak-to-peak voltage value of each individual detected pulse, and the sample and hold circuit is configured to provide a feedback signal representing the peak peak-to-peak voltage value of at least one of the detected pulses. Further included is a feedback circuit for adjusting the voltage of the pulsed RF bias voltage signal applied to the chuck according to a difference between the feedback signal and a desired voltage value of the RF bias voltage signal.
摘要:
An r.f. field is supplied by a reactive impedance element to a plasma in a vacuum plasma processing chamber. The element and source are connected via a matching network including first and second variable reactances that control loading of the source and tuning a load, including the reactive impedance element and the plasma, to the source. The values of the first and second variable reactances are changed to determine the amount the first variable reactance is to change for each unit change of the second variable reactance to attain the best match between the impedances seen looking into and out of output terminals of the r.f. source. Then the values of the first and second variable reactances are varied simultaneously based on the determination until the best impedance match between the impedances seen looking into and out of output terminals of the r.f. source is attained.
摘要:
A write head drive circuit for a magnetic data storage device is configured to drive a write head with a write head degaussing current that is applied at the end of a write cycle. The write head degaussing current is an alternating current waveform with a programmable number of current pulses with decreasing amplitude and a frequency controlled by a CMOS ring oscillator. The CMOS ring oscillator includes switchable feedback paths to control its frequency. A programmable timer terminates the write head degaussing current after an interval of time dependent on signals that indicate the programmable number of current pulses and the frequency of the CMOS oscillator.
摘要:
The present invention describes a voltage-mode boosting write driver circuit (160), comprising a plurality of inputs (WDP, WDN), a plurality of outputs (HWX, HWY), a transducer (L2), a flex interconnection (T1) coupled to the outputs (HWX, HWY) and to the transducer (L2), a first resistor (R15) and a second resistor (R43) coupled to the outputs (HWX, HWY) and to the transducer (L2), an H-switch (Q15, Q60, Q11, Q22) coupled to the resistors (R15, R43), and a plurality of top boosting circuits (Q42, Q47, R36, and Q43, Q48, R37) coupled to the outputs (HWX, HWY).
摘要:
Variable reactances of a matching network connected between an r.f. source and a plasma load of a vacuum plasma chamber processing a workpiece are varied so a tendency of the plasma to change in an unstable manner which can adversely affect processing of the workpiece is avoided while matching is approached. The plasma tendency to change in an unstable manner is detected by monitoring an electrical parameter resulting from r.f. current flowing between the source and load via the network. The parameter can be (1) statistically based, e.g. variance of percent delivered power, or (2) amplitude modulation in one or both of the 2-20 kHz and 50-200 kHz ranges.
摘要:
A method is provided for forming a complexly-shaped tubular structure such as a tapered pillar or other structure for a vehicle body. A sheet metal blank having a longitudinal axis is rolled about the longitudinal axis to form a tubular shape and the side edges of the blank are then welded together to form a tube. The tube is then enclosed in a hydroforming die and pressurized to conform the tube to the shape of the die and thereby form the desired complex shape. The sheet metal blank may be formed by the end-to-end welding together of a plurality of separate sheet metal blanks that differ from one another in characteristic including material thickness, material alloy composition, and/or coating. One or more of the blanks can have side edges that are non-parallel so that the tube will taper in diameter along its length.