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1.发明授权Systems and methods for protection of cosmetic surfaces and overflow prevention on electronic devices 有权用于保护化妆品表面的系统和方法以及电子设备上的防溢流公开(公告)号：US08999487B2
公开(公告)日：2015-04-07
申请号：US13607538
申请日：2012-09-07
CPC分类号： H01L21/64 , B32B3/266 , B32B7/02 , B32B17/067 , C09J7/35 , C09J2201/128 , C09J2203/326 , C09J2461/00 , H05K5/02 , Y10T156/10 , Y10T156/1039 , Y10T156/1062 , Y10T156/108 , Y10T428/24322 , Y10T428/24331 , Y10T428/24959 , Y10T428/2826
摘要： Systems and methods for protection of cosmetic surfaces on electronic devices and adhesive overflow prevention are provided. In particular, an assembly for protecting a cosmetic surface can include a heat activated adhesive, such as a heat active film adhesive (“HAF”), which can be used to secure a mesh to the cosmetic surface. In some embodiments, a protective layer having a center layer laminated between two layers of heat activated adhesive can be used to protect the cosmetic surface from scratches caused by the mesh. In some embodiments, one or more hot shoes can be used to cross-link the heat activated adhesives to the mesh and the cosmetic surface. Because the shape of a shoe can influence the flow of heat activated adhesives during cross-linking, different shoes can be selected in order to minimize overflow in certain locations in the assembly.
摘要翻译： 提供了用于保护电子设备上的化妆品表面的系统和方法以及防止粘合剂溢出。 特别地，用于保护化妆品表面的组件可以包括热活化粘合剂，例如可用于将网状物固定到化妆品表面的热活性膜粘合剂（“HAF”）。 在一些实施方案中，具有层压在两层热活化粘合剂层之间的中心层的保护层可用于保护化妆品表面免受网状物引起的划痕。 在一些实施例中，可以使用一个或多个热靴将热活化粘合剂交联到网和化妆品表面。 因为鞋的形状可以在交联期间影响热活化粘合剂的流动，所以可以选择不同的鞋以便最小化组件中某些位置的溢流。
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公开(公告)号：US09118354B2
公开(公告)日：2015-08-25
申请号：US13221642
申请日：2011-08-30
CPC分类号： H04B5/0031 , H04B5/0081 , H04M1/7253 , H04M1/72591 , H04M2250/04
摘要： Electronic devices may be provided with near field communications capabilities. A near field communications antenna may be formed from multiple inductive components. The inductive components may include a speaker coil. One or more switches may be provided in the near field communications antenna to adjust the inductance of the near field communications antenna during different modes of operation. An audio circuit may be used to generate audio signals. A first transmitter may be used to transmit near field hearing aid signals through the near field communications antenna. A second transmitter may be used to transmit near field communications signals to external equipment such as near field communications point of sale equipment. Switching circuitry may be used to selectively couple the audio circuit, the first transmitter, and the second transmitter to the near field communications antenna.
摘要翻译： 电子设备可以具有近场通信能力。 近场通信天线可以由多个感应组件形成。 电感元件可包括扬声器线圈。 可以在近场通信天线中提供一个或多个开关，以在不同的操作模式期间调整近场通信天线的电感。 可以使用音频电路来产生音频信号。 第一发射机可以用于通过近场通信天线发射近场助听信号。 第二发射机可以用于将近场通信信号发送到诸如近场通信销售点设备的外部设备。 开关电路可用于选择性地将音频电路，第一发射器和第二发射器耦合到近场通信天线。
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公开(公告)号：US08988890B2
公开(公告)日：2015-03-24
申请号：US13598308
申请日：2012-08-29
IPC分类号： H05K7/00
CPC分类号： H05K3/341 , H05K3/0052 , H05K2201/0394 , H05K2201/09063 , H05K2201/1031 , H05K2201/1034 , Y02P70/611 , Y02P70/613 , Y10T29/4913 , Y10T29/49144
摘要： Components may be mounted to printed circuit substrates using solder. A breakaway support tab may be detachably connected to a component and may help prevent the component from shifting or toppling over during reflow operations. The component and breakaway support tab may be formed from sheet metal. The interface that links the component to the breakaway support tab may be perforated or half sheared to allow the breakaway support tab to be easily separated from the component following reflow operations. The breakaway support tab may be fixed in place during reflow operations by mechanically coupling the breakaway support tab to a fixture or by mounting the breakaway support tab to an unused portion of a panel of printed circuit substrates. A breakaway support tab may be mechanically coupled between two components on a printed circuit substrate and may be used to maintain a distance between the components during reflow operations.
摘要翻译： 组件可以使用焊料安装到印刷电路基板上。 分离的支撑片可以可拆卸地连接到部件，并且可以有助于防止在回流操作期间部件移动或翻倒。 部件和分离支撑片可以由金属片形成。 将组件连接到分离支撑片的接口可以是穿孔的或半剪切的，以允许分离支撑片在回流操作之后容易地与部件分离。 分离式支撑片可以在回流操作期间通过将分离支撑片机械地联接到固定装置或通过将分离的支撑片安装到印刷电路板的面板的未使用部分来固定到位。 分离的支撑片可以机械耦合在印刷电路基板上的两个部件之间，并且可以用于在回流操作期间保持部件之间的距离。
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公开(公告)号：US20140071594A1
公开(公告)日：2014-03-13
申请号：US13606377
申请日：2012-09-07
申请人： Sawyer I. Cohen , Jared M. Kole , Andriy Pletenetskyy , Ashutosh Y. Shukla , Michael B. Wittenberg
发明人： Sawyer I. Cohen , Jared M. Kole , Andriy Pletenetskyy , Ashutosh Y. Shukla , Michael B. Wittenberg
CPC分类号： B29C45/382 , B29C2045/0086 , Y10T29/49826 , Y10T29/53
摘要： A component may be molded with an integral breakaway installation handle. The breakaway installation handle may be used to manipulate and maneuver the component during assembly operations and during component mounting operations. A technician may use the breakaway installation handle to mount the component to a fixture while applying adhesive, attaching a mesh, or performing other assembly operations on the component. Following assembly operations, the technician may use the breakaway installation handle to install the component in an electronic device. After installing the component in the electronic device, the technician may bend the breakaway installation handle with respect to the component until the breakaway installation handle breaks off from the component. Components having breakaway installation handles may be formed form an injection molding system in which mold cavities each receive molten plastic from a runner. Plastic that solidifies in each runner may form the breakaway installation handle for each component.
摘要翻译： 组件可以用一体的分离安装手柄模制。 分离安装手柄可用于在组装操作期间和组件安装操作期间操纵和操纵组件。 技术人员可以使用分离式安装手柄将组件安装到固定装置上，同时施加粘合剂，附接网格或对组件执行其他组装操作。 在组装操作之后，技术人员可以使用分离式安装手柄将组件安装在电子设备中。 在将组件安装在电子设备中之后，技术人员可以相对于组件弯曲分离的安装手柄，直到分离式安装手柄从组件中断。 具有分离的安装手柄的部件可以由注塑系统形成，其中模腔各自从流道接收熔融塑料。 在每个流道中固化的塑料可以形成每个部件的分离安装手柄。
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公开(公告)号：US20140063769A1
公开(公告)日：2014-03-06
申请号：US13598308
申请日：2012-08-29
CPC分类号： H05K3/341 , H05K3/0052 , H05K2201/0394 , H05K2201/09063 , H05K2201/1031 , H05K2201/1034 , Y02P70/611 , Y02P70/613 , Y10T29/4913 , Y10T29/49144
摘要： Components may be mounted to printed circuit substrates using solder. A breakaway support tab may be detachably connected to a component and may help prevent the component from shifting or toppling over during reflow operations. The component and breakaway support tab may be formed from sheet metal. The interface that links the component to the breakaway support tab may be perforated or half sheared to allow the breakaway support tab to be easily separated from the component following reflow operations. The breakaway support tab may be fixed in place during reflow operations by mechanically coupling the breakaway support tab to a fixture or by mounting the breakaway support tab to an unused portion of a panel of printed circuit substrates. A breakaway support tab may be mechanically coupled between two components on a printed circuit substrate and may be used to maintain a distance between the components during reflow operations.
摘要翻译： 组件可以使用焊料安装到印刷电路基板上。 分离的支撑片可以可拆卸地连接到部件，并且可以有助于防止在回流操作期间部件移动或翻倒。 部件和分离支撑片可以由金属片形成。 将组件连接到分离支撑片的接口可以是穿孔的或半剪切的，以允许分离支撑片在回流操作之后容易地与部件分离。 分离式支撑片可以在回流操作期间通过将分离支撑片机械地联接到固定装置或通过将分离的支撑片安装到印刷电路板的面板的未使用部分来固定到位。 分离的支撑片可以机械耦合在印刷电路基板上的两个部件之间，并且可以用于在回流操作期间保持部件之间的距离。
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公开(公告)号：US20140071651A1
公开(公告)日：2014-03-13
申请号：US13607440
申请日：2012-09-07
申请人： Michael B. Wittenberg , Sawyer I. Cohen , Jared M. Kole , Shayan Malek , David A. Pakula , Ashutosh Y. Shukla
发明人： Michael B. Wittenberg , Sawyer I. Cohen , Jared M. Kole , Shayan Malek , David A. Pakula , Ashutosh Y. Shukla
CPC分类号： H01Q1/243
摘要： Electronic devices may be provided with electronic components and cowling structures that secure the electronic components. A cowling structure may include a metal portion and an insulating portion that has been insert-molded onto the metal portion. The metal portion and the insert-molded insulating portion may each have an opening that receives a screw. The screws may pass through the respective opening and attach to a substrate. The substrate may be a transparent cover layer for a device display. The cowling structure may press the electronic components against the transparent substrate layer. The device may include an antenna. The insert-molded insulating portion may extend from an edge of the metal portion in the direction of the antenna. The insert-molded insulating portion may prevent one of the screws from forming an electrical connection with the metal portion.
摘要翻译： 电子设备可以设置有固定电子部件的电子部件和整流罩结构。 整流罩结构可以包括已经插入模制到金属部分上的金属部分和绝缘部分。 金属部分和嵌入成型的绝缘部分可以各自具有容纳螺钉的开口。 螺钉可以穿过相应的开口并附着到基底上。 衬底可以是用于器件显示的透明覆盖层。 整流罩结构可以将电子部件压靠在透明基板层上。 该装置可以包括天线。 插入成型的绝缘部分可以沿着天线的方向从金属部分的边缘延伸。 插入成型的绝缘部分可以防止其中一个螺钉与金属部分形成电连接。
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公开(公告)号：US20130052947A1
公开(公告)日：2013-02-28
申请号：US13221642
申请日：2011-08-30
IPC分类号： H04B5/00
CPC分类号： H04B5/0031 , H04B5/0081 , H04M1/7253 , H04M1/72591 , H04M2250/04
摘要： Electronic devices may be provided with near field communications capabilities. A near field communications antenna may be formed from multiple inductive components. The inductive components may include a speaker coil. One or more switches may be provided in the near field communications antenna to adjust the inductance of the near field communications antenna during different modes of operation. An audio circuit may be used to generate audio signals. A first transmitter may be used to transmit near field hearing aid signals through the near field communications antenna. A second transmitter may be used to transmit near field communications signals to external equipment such as near field communications point of sale equipment. Switching circuitry may be used to selectively couple the audio circuit, the first transmitter, and the second transmitter to the near field communications antenna.
摘要翻译： 电子设备可以具有近场通信能力。 近场通信天线可以由多个感应组件形成。 电感元件可包括扬声器线圈。 可以在近场通信天线中提供一个或多个开关，以在不同的操作模式期间调整近场通信天线的电感。 可以使用音频电路来产生音频信号。 第一发射机可以用于通过近场通信天线发射近场助听信号。 第二发射机可以用于将近场通信信号发送到诸如近场通信销售点设备的外部设备。 开关电路可用于选择性地将音频电路，第一发射器和第二发射器耦合到近场通信天线。
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公开(公告)号：US09414141B2
公开(公告)日：2016-08-09
申请号：US13343645
申请日：2012-01-04
CPC分类号： H04R1/023 , H04M1/03 , H04M1/035 , H04M1/18 , H04R1/02 , H04R1/086 , H04R7/00 , H04R2499/11 , Y10T29/49002
摘要： A portable electronic device that provides compact configurations for audio elements are disclosed. The audio elements can be drivers (e.g., speakers) or receivers (e.g., microphones). According to one aspect, mesh structures, such as mesh barriers, are formed to facilitate improved acoustic sealing in a space efficient manner. In one embodiment, a mesh barrier for an audio port can be reliably acoustically sealed (or coupled) with an audio chamber and/or outer device housing in a space efficient manner. A mesh barrier can serve to block undesired foreign substances from entry or further entry into an audio port and/or serve as a cosmetic barrier which obscures vision into an audio port. In one embodiment, a portion of a mesh structure can be provided with a substantially planar surface that facilitates improved acoustic sealing.
摘要翻译： 公开了一种为音频元件提供紧凑配置的便携式电子设备。 音频元件可以是驱动器（例如，扬声器）或接收器（例如，麦克风）。 根据一个方面，形成网状结构，例如网状屏障，以便以空间有效的方式促进改进的声学密封。 在一个实施例中，用于音频端口的网状屏障可以以空间有效的方式可靠地与音频室和/或外部设备壳体声学密封（或耦合）。 网状屏障可以用于阻止不期望的异物进入或进一步进入音频端口和/或用作将视觉遮蔽到音频端口中的化妆品屏障。 在一个实施例中，网状结构的一部分可以具有促进改进的声学密封的基本平坦的表面。
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公开(公告)号：US08927881B2
公开(公告)日：2015-01-06
申请号：US13607440
申请日：2012-09-07
申请人： Michael B. Wittenberg , Sawyer I. Cohen , Jared M. Kole , Shayan Malek , David A. Pakula , Ashutosh Y. Shukla
发明人： Michael B. Wittenberg , Sawyer I. Cohen , Jared M. Kole , Shayan Malek , David A. Pakula , Ashutosh Y. Shukla
IPC分类号： H05K7/14
CPC分类号： H01Q1/243
摘要： Electronic devices may be provided with electronic components and cowling structures that secure the electronic components. A cowling structure may include a metal portion and an insulating portion that has been insert-molded onto the metal portion. The metal portion and the insert-molded insulating portion may each have an opening that receives a screw. The screws may pass through the respective opening and attach to a substrate. The substrate may be a transparent cover layer for a device display. The cowling structure may press the electronic components against the transparent substrate layer. The device may include an antenna. The insert-molded insulating portion may extend from an edge of the metal portion in the direction of the antenna. The insert-molded insulating portion may prevent one of the screws from forming an electrical connection with the metal portion.
摘要翻译： 电子设备可以设置有固定电子部件的电子部件和整流罩结构。 整流罩结构可以包括已经插入模制到金属部分上的金属部分和绝缘部分。 金属部分和嵌入成型的绝缘部分可以各自具有容纳螺钉的开口。 螺钉可以穿过相应的开口并附着到基底上。 衬底可以是用于器件显示的透明覆盖层。 整流罩结构可以将电子部件压靠在透明基板层上。 该装置可以包括天线。 插入成型的绝缘部分可以沿着天线的方向从金属部分的边缘延伸。 插入成型的绝缘部分可以防止其中一个螺钉与金属部分形成电连接。
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10.发明申请SYSTEMS AND METHODS FOR PROTECTION OF COSMETIC SURFACES AND OVERFLOW PREVENTION ON ELECTRONIC DEVICES 有权用于保护化妆品表面和防止电子设备溢出的系统和方法公开(公告)号：US20140072759A1
公开(公告)日：2014-03-13
申请号：US13607538
申请日：2012-09-07
CPC分类号： H01L21/64 , B32B3/266 , B32B7/02 , B32B17/067 , C09J7/35 , C09J2201/128 , C09J2203/326 , C09J2461/00 , H05K5/02 , Y10T156/10 , Y10T156/1039 , Y10T156/1062 , Y10T156/108 , Y10T428/24322 , Y10T428/24331 , Y10T428/24959 , Y10T428/2826
摘要： Systems and methods for protection of cosmetic surfaces on electronic devices and adhesive overflow prevention are provided. In particular, an assembly for protecting a cosmetic surface can include a heat activated adhesive, such as a heat active film adhesive (“HAF”), which can be used to secure a mesh to the cosmetic surface. In some embodiments, a protective layer having a center layer laminated between two layers of heat activated adhesive can be used to protect the cosmetic surface from scratches caused by the mesh. In some embodiments, one or more hot shoes can be used to cross-link the heat activated adhesives to the mesh and the cosmetic surface. Because the shape of a shoe can influence the flow of heat activated adhesives during cross-linking, different shoes can be selected in order to minimize overflow in certain locations in the assembly.
摘要翻译： 提供了用于保护电子设备上的化妆品表面的系统和方法以及防止粘合剂溢出。 特别地，用于保护化妆品表面的组件可以包括热活化粘合剂，例如可用于将网状物固定到化妆品表面的热活性膜粘合剂（“HAF”）。 在一些实施方案中，具有层压在两层热活化粘合剂层之间的中心层的保护层可用于保护化妆品表面免受网状物引起的划痕。 在一些实施例中，可以使用一个或多个热靴将热活化粘合剂交联到网和化妆品表面。 因为鞋的形状可以在交联期间影响热活化粘合剂的流动，因此可以选择不同的鞋以便最小化组件中某些位置的溢流。
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