公开(公告)号：US08193592B2

公开(公告)日：2012-06-05

申请号：US12904662

申请日：2010-10-14

申请人： Frank Bin Yang ,  Andrew M. Waite ,  Scott Luning

发明人： Frank Bin Yang ,  Andrew M. Waite ,  Scott Luning

IPC分类号： H01L29/76 ,  H01L29/94 ,  H01L31/062 ,  H01L31/113 ,  H01L31/119

CPC分类号： H01L21/26586 ,  H01L29/66659 ,  H01L29/7834 ,  H01L2924/0002 ,  Y10S438/931 ,  H01L2924/00

摘要： A method for fabricating a MOSFET (e.g., a PMOS FET) includes providing a semiconductor substrate having surface characterized by a (110) surface orientation or (110) sidewall surfaces, forming a gate structure on the surface, and forming a source extension and a drain extension in the semiconductor substrate asymmetrically positioned with respect to the gate structure. An ion implantation process is performed at a non-zero tilt angle. At least one spacer and the gate electrode mask a portion of the surface during the ion implantation process such that the source extension and drain extension are asymmetrically positioned with respect to the gate structure by an asymmetry measure.

摘要翻译： 一种用于制造MOSFET（例如，PMOS FET）的方法包括提供具有由（110）表面取向或（110）侧壁表面表征的表面的半导体衬底，在表面上形成栅极结构，并形成源延伸和 半导体衬底中的漏极延伸部相对于栅极结构非对称地定位。 以非零倾角进行离子注入工艺。 在离子注入过程期间，至少一个间隔物和栅电极掩盖表面的一部分，使得源极延伸和漏极延伸通过不对称度量相对于栅极结构不对称地定位。

公开(公告)号：US08148214B2

公开(公告)日：2012-04-03

申请号：US12360961

申请日：2009-01-28

申请人： Andrew M. Waite ,  Scott Luning

发明人： Andrew M. Waite ,  Scott Luning

IPC分类号： H01L21/00

CPC分类号： H01L29/6656 ,  H01L21/823807 ,  H01L21/823814 ,  H01L29/6653 ,  H01L29/66636 ,  H01L29/7848

摘要： A stressed field effect transistor and methods for its fabrication are provided. The field effect transistor comprises a silicon substrate with a gate insulator overlying the silicon substrate. A gate electrode overlies the gate insulator and defines a channel region in the silicon substrate underlying the gate electrode. A first silicon germanium region having a first thickness is embedded in the silicon substrate and contacts the channel region. A second silicon germanium region having a second thickness greater than the first thickness and spaced apart from the channel region is also embedded in the silicon substrate.

摘要翻译： 提供了一种应力场效应晶体管及其制造方法。 场效应晶体管包括具有覆盖硅衬底的栅极绝缘体的硅衬底。 栅电极覆盖栅极绝缘体，并且在栅电极下面的硅衬底中限定沟道区。 具有第一厚度的第一硅锗区域嵌入在硅衬底中并与沟道区域接触。 具有大于第一厚度并且与沟道区间隔开的第二厚度的第二硅锗区域也嵌入在硅衬底中。

公开(公告)号：US06972478B1

公开(公告)日：2005-12-06

申请号：US11075774

申请日：2005-03-07

申请人： Andrew M. Waite ,  Scott Luning

发明人： Andrew M. Waite ,  Scott Luning

IPC分类号： H01L21/20 ,  H01L21/8238 ,  H01L21/84 ,  H01L27/12 ,  H01L29/04 ,  H01L29/78

CPC分类号： H01L29/045 ,  H01L21/2007 ,  H01L21/823807 ,  H01L21/84 ,  H01L27/1203 ,  H01L27/1207 ,  H01L29/7833

摘要： An integrated circuit and methods for its manufacture are provided. The integrated circuit comprises a bulk silicon substrate having a first region of crystalline orientation and a second region of crystalline orientation. A layer of silicon on insulator overlies a portion of the bulk silicon substrate. At least one field effect transistor is formed in the layer of silicon on insulator, at least one P-channel field effect transistor is formed in the second region of crystalline orientation, and at least one N-channel field effect transistor is formed in the first region of crystalline orientation.

摘要翻译： 提供集成电路及其制造方法。 集成电路包括具有<100>晶体取向的第一区域和<110>晶体取向的第二区域的体硅衬底。 绝缘体上的一层覆盖在体硅衬底的一部分上。 在绝缘体上的硅层中形成至少一个场效应晶体管，在<110>晶取向的第二区域中形成至少一个P沟道场效应晶体管，并形成至少一个N沟道场效应晶体管 在<100>晶体取向的第一区域。

公开(公告)号：US20090283806A1

公开(公告)日：2009-11-19

申请号：US12121387

申请日：2008-05-15

申请人： Frank Bin YANG ,  Andrew M. WAITE ,  Scott Luning

发明人： Frank Bin YANG ,  Andrew M. WAITE ,  Scott Luning

IPC分类号： H01L29/00 ,  H01L21/336

CPC分类号： H01L21/26586 ,  H01L29/66659 ,  H01L29/7834 ,  H01L2924/0002 ,  Y10S438/931 ,  H01L2924/00

摘要： A method for fabricating a MOSFET (e.g., a PMOS FET) includes providing a semiconductor substrate having surface characterized by a (110) surface orientation or (110) sidewall surfaces, forming a gate structure on the surface, and forming a source extension and a drain extension in the semiconductor substrate asymmetrically positioned with respect to the gate structure. An ion implantation process is performed at a non-zero tilt angle. At least one spacer and the gate electrode mask a portion of the surface during the ion implantation process such that the source extension and drain extension are asymmetrically positioned with respect to the gate structure by an asymmetry measure.

摘要翻译： 一种用于制造MOSFET（例如，PMOS FET）的方法包括提供具有由（110）表面取向或（110）侧壁表面表征的表面的半导体衬底，在表面上形成栅极结构，并形成源延伸和 半导体衬底中的漏极延伸部相对于栅极结构非对称地定位。 以非零倾角进行离子注入工艺。 在离子注入过程期间，至少一个间隔物和栅电极掩盖表面的一部分，使得源极延伸和漏极延伸通过不对称度量相对于栅极结构不对称地定位。

公开(公告)号：US07521380B2

公开(公告)日：2009-04-21

申请号：US11738828

申请日：2007-04-23

申请人： Andrew M. Waite ,  Scott Luning ,  Frank (Bin) Yang

发明人： Andrew M. Waite ,  Scott Luning ,  Frank (Bin) Yang

IPC分类号： H01L21/31 ,  H01L21/469

CPC分类号： H01L21/823807 ,  H01L21/84 ,  H01L27/1203 ,  H01L29/7843

摘要： A method is provided for fabricating a semiconductor device on a semiconductor substrate. A plurality of narrow gate pitch transistors (NPTs) and wide gate pitch transistors (WPTs) are formed on and in the semiconductor substrate. The NPTs are spaced apart by a first distance, and the WPTs are spaced apart by a second distance greater than the first distance. A first stress liner layer is deposited overlying the NPTs, the WPTs and the semiconductor layer, an etch stop layer is deposited overlying the first stress liner layer, and a second stress liner layer is deposited overlying the etch stop layer. A portion of the second stress liner layer which overlies the WPTs is covered, and an exposed portion of the second stress liner layer which overlies the NPTs is removed to expose an exposed portion of the etch stop layer. The exposed portion of the etch stop layer which overlies the NPTs is removed.

摘要翻译： 提供了一种在半导体衬底上制造半导体器件的方法。 在半导体衬底上形成多个窄栅极间距晶体管（NPT）和宽栅极间距晶体管（WPT）。 NPT间隔开第一距离，并且WPT间隔开大于第一距离的第二距离。 沉积覆盖在NPT，WPT和半导体层上的第一应力衬垫层，沉积覆盖在第一应力衬垫层上的蚀刻停止层，并且沉积覆盖在蚀刻停止层上的第二应力衬垫层。 覆盖在WPT上的第二应力衬垫层的一部分被覆盖，并且去除覆盖在NPT上的第二应力衬垫层的暴露部分以露出蚀刻停止层的暴露部分。 去除覆盖在NPT上的蚀刻停止层的暴露部分。

公开(公告)号：US07829401B2

公开(公告)日：2010-11-09

申请号：US12121387

申请日：2008-05-15

申请人： Frank Bin Yang ,  Andrew M. Waite ,  Scott Luning

发明人： Frank Bin Yang ,  Andrew M. Waite ,  Scott Luning

IPC分类号： H01L21/336 ,  H01L21/8234

CPC分类号： H01L21/26586 ,  H01L29/66659 ,  H01L29/7834 ,  H01L2924/0002 ,  Y10S438/931 ,  H01L2924/00

摘要： A method for fabricating a MOSFET (e.g., a PMOS FET) includes providing a semiconductor substrate having surface characterized by a (110) surface orientation or (110) sidewall surfaces, forming a gate structure on the surface, and forming a source extension and a drain extension in the semiconductor substrate asymmetrically positioned with respect to the gate structure. An ion implantation process is performed at a non-zero tilt angle. At least one spacer and the gate electrode mask a portion of the surface during the ion implantation process such that the source extension and drain extension are asymmetrically positioned with respect to the gate structure by an asymmetry measure.

摘要翻译： 一种用于制造MOSFET（例如，PMOS FET）的方法包括提供具有由（110）表面取向或（110）侧壁表面表征的表面的半导体衬底，在表面上形成栅极结构，并形成源延伸和 半导体衬底中的漏极延伸部相对于栅极结构非对称地定位。 以非零倾角进行离子注入工艺。 在离子注入过程期间，至少一个间隔物和栅电极掩盖表面的一部分，使得源极延伸和漏极延伸通过不对称度量相对于栅极结构不对称地定位。

公开(公告)号：US07504301B2

公开(公告)日：2009-03-17

申请号：US11536126

申请日：2006-09-28

申请人： Andrew M. Waite ,  Scott Luning

发明人： Andrew M. Waite ,  Scott Luning

IPC分类号： H01L21/00

CPC分类号： H01L29/6656 ,  H01L21/823807 ,  H01L21/823814 ,  H01L29/6653 ,  H01L29/66636 ,  H01L29/7848

摘要： A stressed field effect transistor and methods for its fabrication are provided. The field effect transistor comprises a silicon substrate with a gate insulator overlying the silicon substrate. A gate electrode overlies the gate insulator and defines a channel region in the silicon substrate underlying the gate electrode. A first silicon germanium region having a first thickness is embedded in the silicon substrate and contacts the channel region. A second silicon germanium region having a second thickness greater than the first thickness and spaced apart from the channel region is also embedded in the silicon substrate.

摘要翻译： 提供了一种应力场效应晶体管及其制造方法。 场效应晶体管包括具有覆盖硅衬底的栅极绝缘体的硅衬底。 栅电极覆盖栅极绝缘体，并且在栅电极下面的硅衬底中限定沟道区。 具有第一厚度的第一硅锗区域嵌入在硅衬底中并与沟道区域接触。 具有大于第一厚度并且与沟道区间隔开的第二厚度的第二硅锗区域也嵌入在硅衬底中。

公开(公告)号：US07183169B1

公开(公告)日：2007-02-27

申请号：US11072312

申请日：2005-03-07

申请人： Andrew M. Waite ,  Scott Luning ,  Philip A. Fisher

发明人： Andrew M. Waite ,  Scott Luning ,  Philip A. Fisher

IPC分类号： H01L21/336

CPC分类号： H01L29/78621 ,  H01L29/665 ,  H01L29/66628

摘要： A method and arrangement for reducing the series resistance of the source and drain in a MOSFET device provides for epitaxially grown regions on top of the source and drain extensions to cover portions of the top surfaces of the silicide regions formed on the substrate. The epitaxial material provides an extra flow path for current to flow through to the silicide from the extension, as well as increasing the surface area between the source/drain and the silicide to reduce the contact resistance between the source/drain and the silicide.

摘要翻译： 用于降低MOSFET器件中的源极和漏极的串联电阻的方法和装置提供了在源极和漏极延伸部的顶部上的外延生长区域，以覆盖形成在衬底上的硅化物区域的顶表面的部分。 外延材料提供了一个额外的流动路径，用于电流从延伸部分流到硅化物，以及增加源极/漏极和硅化物之间的表面积，以减少源极/漏极和硅化物之间的接触电阻。

公开(公告)号：US20080079033A1

公开(公告)日：2008-04-03

申请号：US11536126

申请日：2006-09-28

申请人： Andrew M. Waite ,  Scott Luning

发明人： Andrew M. Waite ,  Scott Luning

IPC分类号： H01L29/78 ,  H01L21/336

CPC分类号： H01L29/6656 ,  H01L21/823807 ,  H01L21/823814 ,  H01L29/6653 ,  H01L29/66636 ,  H01L29/7848

摘要： A stressed field effect transistor and methods for its fabrication are provided. The field effect transistor comprises a silicon substrate with a gate insulator overlying the silicon substrate. A gate electrode overlies the gate insulator and defines a channel region in the silicon substrate underlying the gate electrode. A first silicon germanium region having a first thickness is embedded in the silicon substrate and contacts the channel region. A second silicon germanium region having a second thickness greater than the first thickness and spaced apart from the channel region is also embedded in the silicon substrate.

摘要翻译： 提供了一种应力场效应晶体管及其制造方法。 场效应晶体管包括具有覆盖硅衬底的栅极绝缘体的硅衬底。 栅电极覆盖栅极绝缘体，并且在栅电极下面的硅衬底中限定沟道区。 具有第一厚度的第一硅锗区域嵌入在硅衬底中并与沟道区域接触。 具有大于第一厚度并且与沟道区间隔开的第二厚度的第二硅锗区域也嵌入在硅衬底中。

公开(公告)号：US20110062498A1

公开(公告)日：2011-03-17

申请号：US12561685

申请日：2009-09-17

申请人： Frank (Bin) Yang ,  Johan W. Weijtmans ,  Scott Luning

发明人： Frank (Bin) Yang ,  Johan W. Weijtmans ,  Scott Luning

IPC分类号： H01L29/772 ,  H01L21/335

CPC分类号： H01L29/665 ,  H01L29/165 ,  H01L29/6656 ,  H01L29/66575 ,  H01L29/66636 ,  H01L29/78 ,  H01L29/7848

摘要： Semiconductor devices with embedded silicon germanium source/drain regions are formed with enhanced channel mobility, reduced contact resistance, and reduced silicide encroachment. Embodiments include embedded silicon germanium source/drain regions with a first portion having a relatively high germanium concentration, e.g., about 25 to about 35 at. %, an overlying second portion having a first layer with a relatively low germanium concentration, e.g., about 10 to about 20 at. %, and a second layer having a germanium concentration greater than that of the first layer. Embodiments include forming additional layers on the second layer, each odd numbered layer having relatively low germanium concentration, at. % germanium, and each even numbered layer having a relatively high germanium concentration. Embodiments include forming the first region at a thickness of about 400 Å to 28 about 800 Å, and the first and second layers at a thickness of about 30 Å to about 70 Å.

摘要翻译： 具有嵌入式硅锗源极/漏极区域的半导体器件形成具有增强的沟道迁移率，降低的接触电阻和减少的硅化物侵蚀。 实施例包括具有较高锗浓度的第一部分的嵌入式硅锗源/漏区，例如约25至约35at。 ％，上覆的第二部分具有具有相对低的锗浓度的第一层，例如约10至约20at。 ％，第二层的锗浓度大于第一层的浓度。 实施例包括在第二层上形成附加层，每个奇数层具有较低的锗浓度。 ％锗，并且每个偶数层具有较高的锗浓度。 实施例包括形成厚度为约400至28约800的第一区域，第一和第二层的厚度为约至大约为70埃。