-
公开(公告)号:US20060131602A1
公开(公告)日:2006-06-22
申请号:US11018605
申请日:2004-12-21
申请人: Andrew Ouderkirk , Hung Tran , John Schultz , John Wheatley , Joseph Hoffman , Kay-Uwe Schenke , Michael Meis , Stephen Pojar , Wolfgang Lehnhardt
发明人: Andrew Ouderkirk , Hung Tran , John Schultz , John Wheatley , Joseph Hoffman , Kay-Uwe Schenke , Michael Meis , Stephen Pojar , Wolfgang Lehnhardt
IPC分类号: H01L29/18
CPC分类号: H05K1/021 , H01L33/60 , H01L33/642 , H01L2224/48091 , H01L2924/3025 , H05K1/056 , H05K1/182 , H05K2201/10106 , H05K2201/10409 , H01L2924/00014 , H01L2924/00
摘要: An illumination assembly including a thermally conductive substrate, a patterned conductive layer proximate a major surface of the thermally conductive substrate, a dielectric layer positioned between the patterned conductive layer and the major surface of the substrate, and at least one LED including a post that is attached to the thermally conductive substrate such that at least a portion of the post is embedded in the thermally conductive substrate is disclosed. The at least one LED can be thermally connected to the thermally conductive substrate through the post and electrically connected to the patterned conductive layer. The dielectric layer can be reflective.
摘要翻译: 一种照明组件,包括导热衬底,靠近导热衬底的主表面的图案化导电层,位于图案化导电层和衬底主表面之间的电介质层,以及至少一个LED,其包括柱 附着在导热基板上,使得柱的至少一部分嵌入在导热基板中。 所述至少一个LED可以经由柱热连接到导热基板,并电连接到图案化的导电层。 电介质层可以是反射性的。
-
公开(公告)号:US20060131601A1
公开(公告)日:2006-06-22
申请号:US11018608
申请日:2004-12-21
申请人: Andrew Ouderkirk , Hung Tran , John Schultz , John Wheatley , Kay-Uwe Schenke , Michael Meis , Stephen Pojar , Wolfgang Lehnhardt
发明人: Andrew Ouderkirk , Hung Tran , John Schultz , John Wheatley , Kay-Uwe Schenke , Michael Meis , Stephen Pojar , Wolfgang Lehnhardt
IPC分类号: H01L33/00
CPC分类号: H01L33/642 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2924/01004 , H01L2924/01012 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/12041 , H01L2924/14 , H01L2924/3025 , H01L2924/00014
摘要: An illumination assembly including a thermally conductive substrate, a patterned conductive layer proximate a major surface of the thermally conductive substrate, a dielectric layer positioned between the patterned conductive layer and the major surface of the substrate, and at least one LED including a post that is attached to the major surface of the thermally conductive substrate is disclosed. The at least one LED can be thermally connected to the thermally conductive substrate through the post and electrically connected to the patterned conductive layer. The dielectric layer can be reflective.
摘要翻译: 一种照明组件,包括导热衬底,靠近导热衬底的主表面的图案化导电层,位于图案化导电层和衬底主表面之间的电介质层,以及至少一个LED,其包括柱 公开了附着在导热基底的主表面上。 所述至少一个LED可以经由柱热连接到导热基板,并电连接到图案化的导电层。 电介质层可以是反射性的。
-