PROCESSES AND APPARATUSES FOR MANUFACTURING WAFERS
    1.
    发明申请
    PROCESSES AND APPARATUSES FOR MANUFACTURING WAFERS 有权
    制造水龙头的工艺和设备

    公开(公告)号:US20140026617A1

    公开(公告)日:2014-01-30

    申请号:US13954868

    申请日:2013-07-30

    Inventor: Andrew X. Yakub

    Abstract: The process for manufacturing wafers includes the steps of mounting an ingot as a work piece in a manner that permits rotation about a longitudinal axis of rotation and rotating the ingot about its longitudinal axis of rotation to permit a microwave device that generates an energized beam to penetrate an outer surface layer thereof. Furthermore, the process includes exfoliating the outer surface layer with the energized beam, removing the exfoliated outer surface layer from the ingot as a continuous planar strip and cutting the continuous planar strip into a wafer.

    Abstract translation: 制造晶圆的方法包括以允许围绕其纵向旋转轴线旋转并围绕其纵向旋转轴线旋转铸锭的方式安装作为工件的铸锭的步骤,以允许产生通电束的微波装置穿透 其外表面层。 此外,该方法包括用激发的光束去除外表面层,将作为连续平面条带的剥离的外表面层从铸锭中去除并将连续的平面条切割成晶片。

    Processes and apparatuses for manufacturing wafers
    3.
    发明授权
    Processes and apparatuses for manufacturing wafers 有权
    制造晶圆的工艺和设备

    公开(公告)号:US09404198B2

    公开(公告)日:2016-08-02

    申请号:US13954868

    申请日:2013-07-30

    Inventor: Andrew X. Yakub

    Abstract: The process for manufacturing wafers includes the steps of mounting an ingot as a work piece in a manner that permits rotation about a longitudinal axis of rotation and rotating the ingot about its longitudinal axis of rotation to permit a microwave device that generates an energized beam to penetrate an outer surface layer thereof. Furthermore, the process includes exfoliating the outer surface layer with the energized beam, removing the exfoliated outer surface layer from the ingot as a continuous planar strip and cutting the continuous planar strip into a wafer.

    Abstract translation: 制造晶圆的方法包括以允许围绕其纵向旋转轴线旋转并围绕其纵向旋转轴线旋转铸锭的方式安装作为工件的铸锭的步骤,以允许产生通电束的微波装置穿透 其外表面层。 此外,该方法包括用激发的光束去除外表面层,将作为连续平面条带的剥离的外表面层从铸锭移除,并将连续的平面条切割成晶片。

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