公开(公告)号：US06680436B2

公开(公告)日：2004-01-20

申请号：US09821549

申请日：2001-03-29

申请人： Antai Xu ,  Robert Michael Echols ,  Eng Siong David Yeh ,  Michael John Peterson

发明人： Antai Xu ,  Robert Michael Echols ,  Eng Siong David Yeh ,  Michael John Peterson

IPC分类号： H01L2328

CPC分类号： H01L21/563 ,  H01L24/29 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/284 ,  H05K3/3436 ,  H05K2201/0209 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05599

摘要： A reflow encapsulant is used with substrate and an electronic device. The encapsulant is configured to cure when the assembly is heated so as to reflow solder bumps connecting the substrate and electronic device. The encapsulant includes inorganic filler in an amount of 8% to 20% by weight. The amount of filler provided is sufficiently high to lower the CTE of the encapsulant so as to enhance cured material properties and prevent undue expansion and solder joint damage, but low enough so that the solder joints are not affected by filler particles during reflow.

摘要翻译： 回流密封剂与基板和电子设备一起使用。 密封剂构造成当组件被加热时固化，以便回流连接衬底和电子器件的焊料凸块。 密封剂包括8重量％至20重量％的无机填料。 所提供的填料量足够高以降低密封剂的CTE，从而提高固化材料性能并防止不适当的膨胀和焊点损坏，但足够低以使焊点在回流期间不受填料颗粒的影响。