Electronic device and method of manufacturing the same
    9.
    发明授权
    Electronic device and method of manufacturing the same 有权
    电子设备及其制造方法

    公开(公告)号:US08759884B2

    公开(公告)日:2014-06-24

    申请号:US13002981

    申请日:2009-07-07

    IPC分类号: H01L29/20

    摘要: An electronic device comprises a functional stack (10) and a cover (50) coupled thereto by an insulating adhesive layer (30). The functional stack (10) comprises a first transparent and electrically conductive layer (22), a second electrically conductive layer (24) and a functional structure (26), comprising at least one layer, sandwiched between said first and second conductive layer.The cover (50) includes a substrate (52) and at least a first conductive structure (66, 68) that is arranged in a first plane between the adhesive layer (28) and the substrate (52). First and second transverse electrical conductors (32, 34) transverse to the first plane (61) electrically interconnect the first and the second electrically conductive layer (22, 24) with the first and the second conductive structure (66, 68) in the first plane (61).

    摘要翻译: 电子设备包括功能堆叠(10)和通过绝缘粘合剂层(30)与其耦合的盖(50)。 功能堆叠(10)包括第一透明和导电层(22),第二导电层(24)和功能结构(26),其包括夹在所述第一和第二导电层之间的至少一层。 盖(50)包括衬底(52)和布置在粘合剂层(28)和衬底(52)之间的第一平面中的至少第一导电结构(66,68)。 横向于第一平面(61)的第一和第二横向电导体(32,34)将第一和第二导电层(22,24)与第一和第二导电结构(66,68)在第一和第二导电结构 平面(61)。

    Electronic device and method of manufacturing the same
    10.
    发明申请
    Electronic device and method of manufacturing the same 有权
    电子设备及其制造方法

    公开(公告)号:US20110297996A1

    公开(公告)日:2011-12-08

    申请号:US13002981

    申请日:2009-07-07

    IPC分类号: H01L33/62 H01L21/28

    摘要: An electronic device comprises a functional stack (10) and a cover (50) coupled thereto by an insulating adhesive layer (30). The functional stack (10) comprises a first transparent and electrically conductive layer (22), a second electrically conductive layer (24) and a functional structure (26), comprising at least one layer, sandwiched between said first and second conductive layer.The cover (50) includes a substrate (52) and at least a first conductive structure (66, 68) that is arranged in a first plane between the adhesive layer (28) and the substrate (52). First and second transverse electrical conductors (32, 34) transverse to the first plane (61) electrically interconnect the first and the second electrically conductive layer (22, 24) with the first and the second conductive structure (66, 68) in the first plane (61).

    摘要翻译: 电子设备包括功能堆叠(10)和通过绝缘粘合剂层(30)与其耦合的盖(50)。 功能堆叠(10)包括第一透明和导电层(22),第二导电层(24)和功能结构(26),其包括夹在所述第一和第二导电层之间的至少一层。 盖(50)包括衬底(52)和布置在粘合剂层(28)和衬底(52)之间的第一平面中的至少第一导电结构(66,68)。 横向于第一平面(61)的第一和第二横向电导体(32,34)将第一和第二导电层(22,24)与第一和第二导电结构(66,68)在第一和第二导电结构 平面(61)。