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    Electric transport component, method of manufacturing the same, as well as electro-optical device and opto-electrical device
    5.
    发明授权
    Electric transport component, method of manufacturing the same, as well as electro-optical device and opto-electrical device 有权
    电气传输部件，制造方法以及电光装置和光电装置

    公开(公告)号：US08507899B2

    公开(公告)日：2013-08-13

    申请号：US13056418

    申请日：2009-08-05

    申请人： Cristina Tanase ,  Erik Dekempeneer ,  Herbert Lifka ,  Ike de Vries ,  Antonius Maria Bernardus van Mol

    发明人： Cristina Tanase ,  Erik Dekempeneer ,  Herbert Lifka ,  Ike de Vries ,  Antonius Maria Bernardus van Mol

    IPC分类号： H01L31/00 ,  H01L51/00 ,  H01L21/00 ,  H01L29/08

    CPC分类号： H01L51/5203 ,  H01L2251/5338 ,  H01L2251/5361

    摘要： An electric transport component may include a substrate provided with a barrier structure with a first inorganic layer, an organic decoupling layer and a second inorganic layer, wherein the organic decoupling layer is sandwiched between the first and the second inorganic layer, and at least one electrically conductive structure distributed in a plane defined by the organic decoupling layer, and that is accommodated in at least one trench in the organic decoupling layer. A method of manufacturing an electric transport component may include the steps of providing a first inorganic layer, providing a first organic decoupling layer, forming at least one trench in the organic decoupling layer, depositing an electrically conductive material in the at least one trench, and providing a second inorganic layer. The component may be applied for example in opto-electrical and electro-optical devices.

    摘要翻译： 电输送部件可以包括设置有具有第一无机层，有机解耦层和第二无机层的阻挡结构的基板，其中有机解耦层夹在第一和第二无机层之间，并且至少一个电 导电结构分布在由有机解耦层限定的平面中，并且被容纳在有机解耦层中的至少一个沟槽中。 制造电输送部件的方法可以包括以下步骤：提供第一无机层，提供第一有机解耦层，在有机解耦层中形成至少一个沟槽，在至少一个沟槽中沉积导电材料;以及 提供第二无机层。 该组件可以应用于例如光电和电光器件中。

    ELECTRIC TRANSPORT COMPONENT, METHOD OF MANUFACTURING THE SAME, AS WELL AS ELECTRO-OPTICAL DEVICE AND OPTO-ELECTRICAL DEVICE
    6.
    发明申请
    ELECTRIC TRANSPORT COMPONENT, METHOD OF MANUFACTURING THE SAME, AS WELL AS ELECTRO-OPTICAL DEVICE AND OPTO-ELECTRICAL DEVICE 有权
    电动运输部件及其制造方法，作为电光装置和光电装置

    公开(公告)号：US20110273824A1

    公开(公告)日：2011-11-10

    申请号：US13056418

    申请日：2009-08-05

    申请人： Cristina Tanase ,  Erik Dekempeneer ,  Herbert Lifka ,  Ike de Vries ,  Antonius Maria Bernardus van Mol

    发明人： Cristina Tanase ,  Erik Dekempeneer ,  Herbert Lifka ,  Ike de Vries ,  Antonius Maria Bernardus van Mol

    IPC分类号： H05K7/00 ,  H01L51/56 ,  H01L51/52

    CPC分类号： H01L51/5203 ,  H01L2251/5338 ,  H01L2251/5361

    摘要： An electric transport component (10; 110; 310; 60) comprises a substrate (20; 120) provided with a barrier structure with a first inorganic layer (16; 116; 66), an organic decoupling layer (12; 112; 62) and a second inorganic layer (18; 118; 68), wherein the organic decoupling layer is sandwiched between the first and the second inorganic layer, and at least one electrically conductive structure (14; 114; 314; 414; 414-1, 414-2; 514; 614-1, 614-2; 64) distributed in a plane defined by the organic decoupling layer, and that is accommodated in at least one trench (13; 113) in the organic decoupling layer.A method of manufacturing an electric transport component comprises the steps of a) providing a first inorganic layer b) providing a first organic decoupling layer, c) forming at least one trench in the organic decoupling layer, d) depositing an electrically conductive material in the at least one trench, e) providing a second inorganic layer. The component may be applied for example in opto-electrical and electro-optical devices.

    摘要翻译： 电传输部件（10; 110; 310; 60）包括设置有具有第一无机层（16; 116; 66）的屏障结构的衬底（20; 120），有机解耦层（12; 112; 62） 和第二无机层（18; 118; 68），其中有机解耦层夹在第一和第二无机层之间，以及至少一个导电结构（14; 114; 314; 414; 414-1,414 分布在由所述有机解耦层限定的平面中并且被容纳在所述有机解耦层中的至少一个沟槽（13; 113）中的至少一个沟槽中。 制造电输送部件的方法包括以下步骤：a）提供第一无机层b）提供第一有机解耦层，c）在有机解耦层中形成至少一个沟槽，d）在导电材料中沉积导电材料 至少一个沟槽，e）提供第二无机层。 该组件可以应用于例如光电和电光器件中。

    Electronic device and method of manufacturing the same
    7.
    发明授权
    Electronic device and method of manufacturing the same 有权
    电子设备及其制造方法

    公开(公告)号：US08759884B2

    公开(公告)日：2014-06-24

    申请号：US13002981

    申请日：2009-07-07

    申请人： Jeroen van den Brand ,  Andreas Heinrich Dietzel ,  Edward Willem Albert Young ,  Herbert Lifka ,  Erik Dekempeneer

    发明人： Jeroen van den Brand ,  Andreas Heinrich Dietzel ,  Edward Willem Albert Young ,  Herbert Lifka ,  Erik Dekempeneer

    IPC分类号： H01L29/20

    CPC分类号： H01L27/3202 ,  H01L27/3204 ,  H01L51/0024 ,  H01L51/448 ,  H01L51/5203 ,  H01L51/524 ,  H01L2251/5361

    摘要： An electronic device comprises a functional stack (10) and a cover (50) coupled thereto by an insulating adhesive layer (30). The functional stack (10) comprises a first transparent and electrically conductive layer (22), a second electrically conductive layer (24) and a functional structure (26), comprising at least one layer, sandwiched between said first and second conductive layer.The cover (50) includes a substrate (52) and at least a first conductive structure (66, 68) that is arranged in a first plane between the adhesive layer (28) and the substrate (52). First and second transverse electrical conductors (32, 34) transverse to the first plane (61) electrically interconnect the first and the second electrically conductive layer (22, 24) with the first and the second conductive structure (66, 68) in the first plane (61).

    摘要翻译： 电子设备包括功能堆叠（10）和通过绝缘粘合剂层（30）与其耦合的盖（50）。 功能堆叠（10）包括第一透明和导电层（22），第二导电层（24）和功能结构（26），其包括夹在所述第一和第二导电层之间的至少一层。 盖（50）包括衬底（52）和布置在粘合剂层（28）和衬底（52）之间的第一平面中的至少第一导电结构（66,68）。 横向于第一平面（61）的第一和第二横向电导体（32,34）将第一和第二导电层（22,24）与第一和第二导电结构（66,68）在第一和第二导电结构 平面（61）。

    Electronic device and method of manufacturing the same
    8.
    发明申请
    Electronic device and method of manufacturing the same 有权
    电子设备及其制造方法

    公开(公告)号：US20110297996A1

    公开(公告)日：2011-12-08

    申请号：US13002981

    申请日：2009-07-07

    申请人： Jeroen van den Brand ,  Andreas Heinrich Dietzel ,  Edward Willem Albert Young ,  Herbert Lifka ,  Erik Dekempeneer

    发明人： Jeroen van den Brand ,  Andreas Heinrich Dietzel ,  Edward Willem Albert Young ,  Herbert Lifka ,  Erik Dekempeneer

    IPC分类号： H01L33/62 ,  H01L21/28

    CPC分类号： H01L27/3202 ,  H01L27/3204 ,  H01L51/0024 ,  H01L51/448 ,  H01L51/5203 ,  H01L51/524 ,  H01L2251/5361

    摘要： An electronic device comprises a functional stack (10) and a cover (50) coupled thereto by an insulating adhesive layer (30). The functional stack (10) comprises a first transparent and electrically conductive layer (22), a second electrically conductive layer (24) and a functional structure (26), comprising at least one layer, sandwiched between said first and second conductive layer.The cover (50) includes a substrate (52) and at least a first conductive structure (66, 68) that is arranged in a first plane between the adhesive layer (28) and the substrate (52). First and second transverse electrical conductors (32, 34) transverse to the first plane (61) electrically interconnect the first and the second electrically conductive layer (22, 24) with the first and the second conductive structure (66, 68) in the first plane (61).

    摘要翻译： 电子设备包括功能堆叠（10）和通过绝缘粘合剂层（30）与其耦合的盖（50）。 功能堆叠（10）包括第一透明和导电层（22），第二导电层（24）和功能结构（26），其包括夹在所述第一和第二导电层之间的至少一层。 盖（50）包括衬底（52）和布置在粘合剂层（28）和衬底（52）之间的第一平面中的至少第一导电结构（66,68）。 横向于第一平面（61）的第一和第二横向电导体（32,34）将第一和第二导电层（22,24）与第一和第二导电结构（66,68）在第一和第二导电结构 平面（61）。

    Substrate coated with a layered structure comprising a tetrahedral carbon coating
    9.
    发明授权
    Substrate coated with a layered structure comprising a tetrahedral carbon coating 有权
    用包含四面体碳涂层的层状结构涂覆的基材

    公开(公告)号：US07820293B2

    公开(公告)日：2010-10-26

    申请号：US12063927

    申请日：2006-07-13

    申请人： Erik Dekempeneer

    发明人： Erik Dekempeneer

    IPC分类号： B32B9/00

    CPC分类号： C23C28/044 ,  C23C28/046 ,  C23C28/321 ,  C23C28/322 ,  C23C28/343 ,  C23C28/347 ,  Y10T428/12625 ,  Y10T428/30 ,  Y10T428/31678

    摘要： The invention relates to a metal substrate (11) coated at least partially with a layered structure. The layered structure comprises an intermediate layer (14) deposited on said substrate (11) and a tetrahedral carbon layer (16) deposited on said intermediate layer. The intermediate layer comprises at least one amorphous carbon layer having a Young's modulus lower than 200 GPa and the tetrahedral carbon layer has a Young's modulus higher than 200 GPa. The invention further relates to a method to improve the adhesion of a tetrahedral carbon layer to a substrate and to a method to bridge the gap in Young's modulus of the metal substrate and the Young's modulus of a tetrahedral carbon coating deposited on said metal substrate.

    摘要翻译： 本发明涉及至少部分地涂覆有层状结构的金属基材（11）。 层状结构包括沉积在所述衬底（11）上的中间层（14）和沉积在所述中间层上的四面体碳层（16）。 中间层包含至少一个杨氏模量低于200GPa的非晶碳层，四面体碳层的杨氏模量高于200GPa。 本发明还涉及一种提高四面体碳层与基材的粘附性的方法，以及一种桥接金属基材的杨氏模量的间隙的方法和沉积在所述金属基材上的四面体碳涂层的杨氏模量。

    Substrate Coated with a Layered Structure Comprising a Tetrahedral Carbon Layer and a Softer Outer Layer
    10.
    发明申请
    Substrate Coated with a Layered Structure Comprising a Tetrahedral Carbon Layer and a Softer Outer Layer 有权
    基材涂覆有包含四面体碳层和较软外层的分层结构

    公开(公告)号：US20080220257A1

    公开(公告)日：2008-09-11

    申请号：US12063932

    申请日：2006-07-13

    申请人： Erik Dekempeneer

    发明人： Erik Dekempeneer

    IPC分类号： B32B9/04 ,  C09D7/00

    CPC分类号： C23C16/26 ,  C23C16/0272 ,  C23C28/322 ,  C23C28/343 ,  C23C28/347 ,  C23C28/42 ,  Y10T428/2495 ,  Y10T428/30

    摘要： The invention relates to a metal substrate coated at least partially with a layered structure. The layered structure comprises an intermediate layer deposited on the metal substrate and an amorphous carbon layer deposited on the intermediate layer. The amorphous carbon layer has a Young's modulus lower than 200 GPa. The intermediate layer comprises a tetrahedral carbon layer having a Young's modulus higher than 200 GPa. The invention further relates to a method to reduce the wear on a counterbody of a metal substrate coated with a tetrahedral carbon coating.

    摘要翻译： 本发明涉及至少部分地涂覆有层状结构的金属基底。 层状结构包括沉积在金属基底上的中间层和沉积在中间层上的无定形碳层。 无定形碳层的杨氏模量低于200GPa。 中间层包含杨氏模量高于200GPa的四面体碳层。 本发明还涉及一种减少涂覆有四面体碳涂层的金属基底的反向体的磨损的方法。