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公开(公告)号：US20180348827A1
公开(公告)日：2018-12-06
申请号：US16042804
申请日：2018-07-23
申请人： Apple Inc.
发明人： Jonathan A. Matheson , Vinh H. Diep , Brian L. Chuang , Judith C. Segura , Frank F. Liang , Leanne Bach Lien T. Ly , Kevin Z. Lo , Po W. Chiu , Lukose Ninan , Chong Li
CPC分类号： G06F1/20 , G06F1/1656 , H05K1/0206 , H05K1/0209 , H05K7/20436 , H05K9/0049 , H05K2201/066 , H05K2201/0715 , H05K2201/10416
摘要： Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.
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公开(公告)号：US10061363B2
公开(公告)日：2018-08-28
申请号：US14846526
申请日：2015-09-04
申请人： Apple Inc.
发明人： Jonathan A. Matheson , Vinh H. Diep , Brian L. Chuang , Judith C. Segura , Frank F. Liang , Leanne Bach Lien T. Ly , Kevin Z. Lo , Po W. Chiu , Lukose Ninan , Chong Li
CPC分类号： G06F1/20 , G06F1/1656 , H05K1/0206 , H05K1/0209 , H05K7/20436 , H05K9/0049 , H05K2201/066 , H05K2201/0715 , H05K2201/10416
摘要： Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.
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公开(公告)号：US20170071074A1
公开(公告)日：2017-03-09
申请号：US14846526
申请日：2015-09-04
申请人： Apple Inc.
发明人： Jonathan A. Matheson , Vinh H. Diep , Brian L. Chuang , Judith C. Segura , Frank F. Liang , Leanne Bach Lien T. Ly , Kevin Z. Lo , Po W. Chiu , Lukose Ninan , Chong Li
CPC分类号： G06F1/20 , G06F1/1656 , H05K1/0206 , H05K1/0209 , H05K7/20436 , H05K9/0049 , H05K2201/066 , H05K2201/0715 , H05K2201/10416
摘要： Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.
摘要翻译： 电子设备具有具有发热部件（例如POP或SOC），散热器和EMI屏蔽结构的PCB。 组合结构可以包括位于POP / SOC顶部上方并与POP / SOC顶部热接触的顶部散热器/ EMI屏蔽件，位于POP / SOC底部下方并与POP / SOC底部热接触的底部散热器/ EMI屏蔽件，以及导热 部件位于PCB上，横向覆盖大部分POP / SOC侧面，并且与顶部和底部散热器热接触。 POP / SOC的所得热路径包括一个通过其顶部到顶部的散热器，另一个通过其底部到底部散热器，而另一个通过其侧面通过导热部件到达顶部和底部散热器 。 导热部件可以是一体地形成在PCB上的金属马蹄形垫。
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公开(公告)号：US10963024B2
公开(公告)日：2021-03-30
申请号：US16042804
申请日：2018-07-23
申请人： Apple Inc.
发明人： Jonathan A. Matheson , Vinh H. Diep , Brian L. Chuang , Judith C. Segura , Frank F. Liang , Leanne Bach Lien T. Ly , Kevin Z. Lo , Po W. Chiu , Lukose Ninan , Chong Li
摘要： Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.
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