公开(公告)号：US20220333998A1

公开(公告)日：2022-10-20

申请号：US17658882

申请日：2022-04-12

Applicant: Apple Inc.

Inventor： William B. Libeer ,  Chunwei Yu ,  Judith C. Segura ,  Mei Li ,  Xiangfei Yu

IPC: G01K1/08 ,  G01K7/22 ,  G01K7/02

Abstract: A portable electronic device can include a housing at least partially defining an internal volume, a set of temperature sensors disposed in the internal volume, a display assembly, and a processor or main logic board. The set of temperature sensors can be positioned adjacent to or affixed to components of the portable electronic device. The processor can determine a temperature of an environment based on an adjustment factor and weighted temperature measurements taken by a subset of the set of temperature sensors.

公开(公告)号：US20180348827A1

公开(公告)日：2018-12-06

申请号：US16042804

申请日：2018-07-23

Applicant: Apple Inc.

Inventor： Jonathan A. Matheson ,  Vinh H. Diep ,  Brian L. Chuang ,  Judith C. Segura ,  Frank F. Liang ,  Leanne Bach Lien T. Ly ,  Kevin Z. Lo ,  Po W. Chiu ,  Lukose Ninan ,  Chong Li

IPC: G06F1/20 ,  H05K1/02 ,  H05K7/20 ,  H05K9/00

CPC classification number: G06F1/20 ,  G06F1/1656 ,  H05K1/0206 ,  H05K1/0209 ,  H05K7/20436 ,  H05K9/0049 ,  H05K2201/066 ,  H05K2201/0715 ,  H05K2201/10416

Abstract: Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.

公开(公告)号：US10963024B2

公开(公告)日：2021-03-30

申请号：US16042804

申请日：2018-07-23

Applicant: Apple Inc.

Inventor： Jonathan A. Matheson ,  Vinh H. Diep ,  Brian L. Chuang ,  Judith C. Segura ,  Frank F. Liang ,  Leanne Bach Lien T. Ly ,  Kevin Z. Lo ,  Po W. Chiu ,  Lukose Ninan ,  Chong Li

IPC: G06F1/20 ,  G06F1/16 ,  H05K7/20 ,  H05K9/00 ,  H05K1/02

Abstract: Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.

公开(公告)号：US12123784B2

公开(公告)日：2024-10-22

申请号：US17658882

申请日：2022-04-12

Applicant: Apple Inc.

Inventor： William B. Libeer ,  Chunwei Yu ,  Judith C. Segura ,  Mei Li ,  Xiangfei Yu

IPC: G01K1/08 ,  G01K7/02 ,  G01K7/16 ,  G01K7/22

CPC classification number: G01K1/08 ,  G01K7/02 ,  G01K7/16 ,  G01K7/22

Abstract: A portable electronic device can include a housing at least partially defining an internal volume, a set of temperature sensors disposed in the internal volume, a display assembly, and a processor or main logic board. The set of temperature sensors can be positioned adjacent to or affixed to components of the portable electronic device. The processor can determine a temperature of an environment based on an adjustment factor and weighted temperature measurements taken by a subset of the set of temperature sensors.

公开(公告)号：US10061363B2

公开(公告)日：2018-08-28

申请号：US14846526

申请日：2015-09-04

Applicant: Apple Inc.

Inventor： Jonathan A. Matheson ,  Vinh H. Diep ,  Brian L. Chuang ,  Judith C. Segura ,  Frank F. Liang ,  Leanne Bach Lien T. Ly ,  Kevin Z. Lo ,  Po W. Chiu ,  Lukose Ninan ,  Chong Li

IPC: G06F1/20 ,  H05K7/20 ,  H05K9/00 ,  H05K1/02

CPC classification number: G06F1/20 ,  G06F1/1656 ,  H05K1/0206 ,  H05K1/0209 ,  H05K7/20436 ,  H05K9/0049 ,  H05K2201/066 ,  H05K2201/0715 ,  H05K2201/10416

Abstract: Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.

公开(公告)号：US10467982B2

公开(公告)日：2019-11-05

申请号：US15658312

申请日：2017-07-24

Applicant: Apple Inc.

Inventor： Mahnaz Mohammadi ,  Adria Fores Herranz ,  Marc Albrecht ,  Alexander P. Yu ,  Ross Thompson ,  Daming Xu ,  Suraj P. Gorkhali ,  Heesang Suh ,  Mookyung Son ,  Victor H. Yin ,  Judith C. Segura ,  Mingkun Li ,  Jay Mayur Khandhar

IPC: G09G5/04 ,  G09G5/06 ,  G01K13/00 ,  G01K1/02 ,  G09G3/20 ,  G09G3/36 ,  F21V8/00

Abstract: An electronic device has a display with a pixel array overlapping an array of temperature sensors. Control circuitry in the device may gather temperature measurements from the temperature sensor array. The control circuitry may apply a global offset to the temperature measurements and may apply a damping factor to the globally offset measurements to produce a two-dimensional temperature profile for the display. A look-up table or other data structure may be used to store information on pixel color correction gain values as a function of temperature. This temperature-gain information and temperature information from the two-dimensional temperature profile may be used by display circuitry in the device to display color-corrected images on the display.

公开(公告)号：US20180286349A1

公开(公告)日：2018-10-04

申请号：US15658312

申请日：2017-07-24

Applicant: Apple Inc.

Inventor： Mahnaz Mohammadi ,  Adria Fores Herranz ,  Marc Albrecht ,  Alexander P. Yu ,  Ross Thompson ,  Daming Xu ,  Suraj P. Gorkhali ,  Heesang Suh ,  Mookyung Son ,  Victor H. Yin ,  Judith C. Segura ,  Mingkun Li ,  Jay Mayur Khandhar

IPC: G09G5/04 ,  G09G5/06 ,  G01K13/00

CPC classification number: G09G5/04 ,  G01K1/026 ,  G01K13/00 ,  G02B6/004 ,  G09G3/20 ,  G09G3/3607 ,  G09G5/06 ,  G09G2300/0452 ,  G09G2320/0242 ,  G09G2320/0285 ,  G09G2320/041 ,  G09G2320/0666 ,  G09G2320/0693

Abstract: An electronic device has a display with a pixel array overlapping an array of temperature sensors. Control circuitry in the device may gather temperature measurements from the temperature sensor array. The control circuitry may apply a global offset to the temperature measurements and may apply a damping factor to the globally offset measurements to produce a two-dimensional temperature profile for the display. A look-up table or other data structure may be used to store information on pixel color correction gain values as a function of temperature. This temperature-gain information and temperature information from the two-dimensional temperature profile may be used by display circuitry in the device to display color-corrected images on the display.

公开(公告)号：US20170071074A1

公开(公告)日：2017-03-09

申请号：US14846526

申请日：2015-09-04

Applicant: Apple Inc.

Inventor： Jonathan A. Matheson ,  Vinh H. Diep ,  Brian L. Chuang ,  Judith C. Segura ,  Frank F. Liang ,  Leanne Bach Lien T. Ly ,  Kevin Z. Lo ,  Po W. Chiu ,  Lukose Ninan ,  Chong Li

IPC: H05K7/20 ,  G06F1/20 ,  H05K9/00

CPC classification number: G06F1/20 ,  G06F1/1656 ,  H05K1/0206 ,  H05K1/0209 ,  H05K7/20436 ,  H05K9/0049 ,  H05K2201/066 ,  H05K2201/0715 ,  H05K2201/10416

Abstract: Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.

Abstract translation: 电子设备具有具有发热部件（例如POP或SOC），散热器和EMI屏蔽结构的PCB。 组合结构可以包括位于POP / SOC顶部上方并与POP / SOC顶部热接触的顶部散热器/ EMI屏蔽件，位于POP / SOC底部下方并与POP / SOC底部热接触的底部散热器/ EMI屏蔽件，以及导热 部件位于PCB上，横向覆盖大部分POP / SOC侧面，并且与顶部和底部散热器热接触。 POP / SOC的所得热路径包括一个通过其顶部到顶部的散热器，另一个通过其底部到底部散热器，而另一个通过其侧面通过导热部件到达顶部和底部散热器 。 导热部件可以是一体地形成在PCB上的金属马蹄形垫。