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公开(公告)号：US10061363B2
公开(公告)日：2018-08-28
申请号：US14846526
申请日：2015-09-04
Applicant: Apple Inc.
Inventor： Jonathan A. Matheson , Vinh H. Diep , Brian L. Chuang , Judith C. Segura , Frank F. Liang , Leanne Bach Lien T. Ly , Kevin Z. Lo , Po W. Chiu , Lukose Ninan , Chong Li
CPC classification number: G06F1/20 , G06F1/1656 , H05K1/0206 , H05K1/0209 , H05K7/20436 , H05K9/0049 , H05K2201/066 , H05K2201/0715 , H05K2201/10416
Abstract: Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.
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公开(公告)号：US20180348827A1
公开(公告)日：2018-12-06
申请号：US16042804
申请日：2018-07-23
Applicant: Apple Inc.
Inventor： Jonathan A. Matheson , Vinh H. Diep , Brian L. Chuang , Judith C. Segura , Frank F. Liang , Leanne Bach Lien T. Ly , Kevin Z. Lo , Po W. Chiu , Lukose Ninan , Chong Li
CPC classification number: G06F1/20 , G06F1/1656 , H05K1/0206 , H05K1/0209 , H05K7/20436 , H05K9/0049 , H05K2201/066 , H05K2201/0715 , H05K2201/10416
Abstract: Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.
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公开(公告)号：US09677223B2
公开(公告)日：2017-06-13
申请号：US15093479
申请日：2016-04-07
Applicant: Apple Inc.
Inventor： Brian L. Chuang , Min Chul Kim , Andrew M. Weidner , Adrianne M. Ruggiero
CPC classification number: D07B1/005 , D07B1/0673 , D07B1/0686 , D07B1/10 , D07B1/147 , D07B1/16 , D07B2201/104 , D07B2201/1064 , D07B2201/1068 , D07B2201/2057 , D07B2201/2061 , D07B2205/205 , D07B2205/2096 , D07B2401/20 , E05B73/0005 , E05B73/0011 , H01B7/041 , D07B2801/14 , D07B2801/12 , D07B2801/24
Abstract: Cable structures of security systems may include multiple subassemblies having different cut-resistant characteristics. One system includes, inter alia, a portable article, a support, and a length of a cable assembly extending between a first cable end coupled to the portable article and a second cable end coupled to the support, where the cable assembly includes a first cable subassembly extending along at least a portion of the length of the cable assembly, and a second cable subassembly extending along at least the portion of the length of the cable assembly and adjacent to the first cable subassembly, and where the first cable subassembly includes a first cut resistant characteristic and the second cable subassembly includes a second cut resistant characteristic that is different than the first cut resistant characteristic.
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Patent Agency Ranking
公开(公告)号：US20170071074A1
公开(公告)日：2017-03-09
申请号：US14846526
申请日：2015-09-04
Applicant: Apple Inc.
Inventor： Jonathan A. Matheson , Vinh H. Diep , Brian L. Chuang , Judith C. Segura , Frank F. Liang , Leanne Bach Lien T. Ly , Kevin Z. Lo , Po W. Chiu , Lukose Ninan , Chong Li
CPC classification number: G06F1/20 , G06F1/1656 , H05K1/0206 , H05K1/0209 , H05K7/20436 , H05K9/0049 , H05K2201/066 , H05K2201/0715 , H05K2201/10416
Abstract: Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.
Abstract translation: 电子设备具有具有发热部件（例如POP或SOC），散热器和EMI屏蔽结构的PCB。 组合结构可以包括位于POP / SOC顶部上方并与POP / SOC顶部热接触的顶部散热器/ EMI屏蔽件，位于POP / SOC底部下方并与POP / SOC底部热接触的底部散热器/ EMI屏蔽件，以及导热 部件位于PCB上，横向覆盖大部分POP / SOC侧面，并且与顶部和底部散热器热接触。 POP / SOC的所得热路径包括一个通过其顶部到顶部的散热器，另一个通过其底部到底部散热器，而另一个通过其侧面通过导热部件到达顶部和底部散热器 。 导热部件可以是一体地形成在PCB上的金属马蹄形垫。
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公开(公告)号：US09322131B2
公开(公告)日：2016-04-26
申请号：US14299351
申请日：2014-06-09
Applicant: Apple Inc.
Inventor： Brian L. Chuang , Min Chul Kim , Andrew M. Weidner , Adrianne M. Ruggiero
CPC classification number: D07B1/005 , D07B1/0673 , D07B1/0686 , D07B1/10 , D07B1/147 , D07B1/16 , D07B2201/104 , D07B2201/1064 , D07B2201/1068 , D07B2201/2057 , D07B2201/2061 , D07B2205/205 , D07B2205/2096 , D07B2401/20 , E05B73/0005 , E05B73/0011 , H01B7/041 , D07B2801/14 , D07B2801/12 , D07B2801/24
Abstract: Cable structures of security systems may include multiple subassemblies having different cut-resistant characteristics. One system includes, inter alia, a portable article, a support, and a length of a cable assembly extending between a first cable end coupled to the portable article and a second cable end coupled to the support, where the cable assembly includes a first cable subassembly extending along at least a portion of the length of the cable assembly, and a second cable subassembly extending along at least the portion of the length of the cable assembly and adjacent to the first cable subassembly, and where the first cable subassembly includes a first cut resistant characteristic and the second cable subassembly includes a second cut resistant characteristic that is different than the first cut resistant characteristic.
Abstract translation: 安全系统的电缆结构可以包括具有不同切割特性的多个子组件。 一个系统尤其包括在耦合到便携式物品的第一电缆端和耦合到支撑件的第二电缆端之间延伸的便携式物品，支撑件和电缆组件的长度，其中电缆组件包括第一电缆 子组件沿着电缆组件的长度的至少一部分延伸，以及沿着电缆组件的长度的至少一部分延伸并且邻近第一电缆子组件延伸的第二电缆子组件，并且其中第一电缆子组件包括第一电缆组件 第二电缆子组件包括与第一耐切割特性不同的第二切割特性。
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公开(公告)号：US10963024B2
公开(公告)日：2021-03-30
申请号：US16042804
申请日：2018-07-23
Applicant: Apple Inc.
Inventor： Jonathan A. Matheson , Vinh H. Diep , Brian L. Chuang , Judith C. Segura , Frank F. Liang , Leanne Bach Lien T. Ly , Kevin Z. Lo , Po W. Chiu , Lukose Ninan , Chong Li
Abstract: Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.
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7.发明申请公开(公告)号：US20160215447A1
公开(公告)日：2016-07-28
申请号：US15093479
申请日：2016-04-07
Applicant: Apple Inc.
Inventor： Brian L. Chuang , Min Chul Kim , Andrew M. Weidner , Adrianne M. Ruggiero
CPC classification number: D07B1/005 , D07B1/0673 , D07B1/0686 , D07B1/10 , D07B1/147 , D07B1/16 , D07B2201/104 , D07B2201/1064 , D07B2201/1068 , D07B2201/2057 , D07B2201/2061 , D07B2205/205 , D07B2205/2096 , D07B2401/20 , E05B73/0005 , E05B73/0011 , H01B7/041 , D07B2801/14 , D07B2801/12 , D07B2801/24
Abstract: Cable structures of security systems may include multiple subassemblies having different cut-resistant characteristics. One system includes, inter alia, a portable article, a support, and a length of a cable assembly extending between a first cable end coupled to the portable article and a second cable end coupled to the support, where the cable assembly includes a first cable subassembly extending along at least a portion of the length of the cable assembly, and a second cable subassembly extending along at least the portion of the length of the cable assembly and adjacent to the first cable subassembly, and where the first cable subassembly includes a first cut resistant characteristic and the second cable subassembly includes a second cut resistant characteristic that is different than the first cut resistant characteristic.
Abstract translation: 安全系统的电缆结构可以包括具有不同切割特性的多个子组件。 一个系统尤其包括在耦合到便携式物品的第一电缆端和耦合到支撑件的第二电缆端之间延伸的便携式物品，支撑件和电缆组件的长度，其中电缆组件包括第一电缆 子组件沿着电缆组件的长度的至少一部分延伸，以及沿着电缆组件的长度的至少一部分延伸并且邻近第一电缆子组件延伸的第二电缆子组件，并且其中第一电缆子组件包括第一电缆组件 第二电缆子组件包括与第一耐切割特性不同的第二切割特性。
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8.发明申请公开(公告)号：US20150184336A1
公开(公告)日：2015-07-02
申请号：US14299351
申请日：2014-06-09
Applicant: Apple Inc.
Inventor： Brian L. Chuang , Min Chul Kim , Andrew M. Weidner , Adrianne M. Ruggiero
CPC classification number: D07B1/005 , D07B1/0673 , D07B1/0686 , D07B1/10 , D07B1/147 , D07B1/16 , D07B2201/104 , D07B2201/1064 , D07B2201/1068 , D07B2201/2057 , D07B2201/2061 , D07B2205/205 , D07B2205/2096 , D07B2401/20 , E05B73/0005 , E05B73/0011 , H01B7/041 , D07B2801/14 , D07B2801/12 , D07B2801/24
Abstract: Cable structures with multiple subassemblies having different cut-resistant characteristics and systems and methods for making the same are provided.
Abstract translation: 提供了具有不同切割特性的多个子组件的电缆结构以及用于制造该组件的系统和方法。
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