公开(公告)号：US20170267581A1

公开(公告)日：2017-09-21

申请号：US15448369

申请日：2017-03-02

Applicant: Apple Inc.

Inventor： Xianwei ZHAO ,  Avery P. YUEN ,  Lei YU ,  Li ZHANG ,  Wookyung BAE ,  Matthew S. ROGERS ,  Naoto MATSUYUKI ,  Sunggu KANG ,  Enkhamgalan DORJGOTOV ,  Cheng CHEN ,  John Z. ZHONG

IPC: C03C17/42 ,  B32B9/04 ,  C23C14/35 ,  C23C14/08 ,  C23C14/12 ,  B32B17/06 ,  C23C14/10

CPC classification number: C03C17/42 ,  B32B9/04 ,  B32B17/06 ,  B32B2255/20 ,  B32B2255/26 ,  B32B2255/28 ,  B32B2307/412 ,  B32B2457/208 ,  C23C14/08 ,  C23C14/3414 ,  G06F3/041 ,  G06F2203/04103

Abstract: A bonding operation to increase the bond between a coating layer and substrate is described. The coating layer may be designed to resist residue on a substrate that covers a display of an electronic device. An adhesion layer including silica (SiO2) and a catalyst or dopant, such as zirconium, may be used to bond the coating layer with the substrate. The dopant can alter the chemical nature of the adhesion layer and increase the number of chemical bonding sites at a bonding surface of the adhesion layer, thereby creating an activated bonding surface. One activated surface of the adhesion layer can be bonded with the substrate, while another activated surface of the adhesion layer can be bonded with the coating layer.

公开(公告)号：US20140272217A1

公开(公告)日：2014-09-18

申请号：US13865102

申请日：2013-04-17

Applicant: APPLE INC.

Inventor： Douglas J. WEBER ,  Naoto MATSUYUKI

IPC: H05K7/20 ,  H05K13/00

CPC classification number: H05K13/00 ,  G02B5/281 ,  H04M1/0202 ,  H05K7/20427 ,  Y10T428/1317

Abstract: The described embodiments relate generally to a structure and methods of forming a structure for improving thermal management in an electronic device. The structure including a casing; a cover glass; a multilayer film on an exterior surface of the casing and of the cover glass, adapted to reflect radiation in a first spectral region and to transmit radiation in a second spectral region. In embodiments consistent with the present disclosure a casing for a portable electronic device may include a reflective portion in an interior surface including a hot spot in the electronic device; and an emissive portion in the interior surface including an area non-overlapping a hot spot.

Abstract translation: 所描述的实施例大体上涉及形成用于改善电子设备中的热管理的结构的结构和方法。 该结构包括壳体; 盖玻璃; 壳体和盖玻璃的外表面上的多层膜，适于反射第一光谱区域中的辐射并在第二光谱区域中透射辐射。 在符合本公开的实施例中，用于便携式电子设备的壳体可以包括在包括电子设备中的热点的内表面中的反射部分; 以及内表面中的发光部分，包括不重叠热点的区域。

公开(公告)号：US20170224064A1

公开(公告)日：2017-08-10

申请号：US15501926

申请日：2015-07-12

Applicant: Apple Inc.

Inventor： Yoji HAMADA ,  Peter F. COXETER ,  Ying-Liang SU ,  Edward SIAHAAN ,  Whitney D. MATTSON ,  Naoto MATSUYUKI

IPC: A44C5/00 ,  A44C27/00 ,  D03D11/00 ,  D03D15/00 ,  D03D1/00 ,  D03D3/00

CPC classification number: A44C5/0053 ,  A44C27/001 ,  D03D1/00 ,  D03D3/005 ,  D03D3/06 ,  D03D11/00 ,  D03D15/00 ,  D10B2321/022 ,  D10B2331/02 ,  D10B2331/04 ,  D10B2331/10 ,  D10B2401/041 ,  D10B2403/032

Abstract: A woven material (100) including bonding fibers (108) and a method of reinforcing woven material using bonding fibers is disclosed. The woven material (100) includes a plurality of warp threads (102), and at least one weft thread (104) coupled to the warp threads (102). The woven material (100) also includes a plurality of bonding fibers (108). The bonding fibers (108) are positioned in parallel with the warp threads (102), and/or in parallel with the weft thread(s) (104). Additionally, the bonding fibers (108) are formed from a material having a melting temperature that is lower than a melting temperature of the material(s) used to form the warp threads (102) and the weft thread(s) (104) of the woven material.