公开(公告)号：US20240164149A1

公开(公告)日：2024-05-16

申请号：US18545676

申请日：2023-12-19

Applicant: Applied Materials, Inc.

Inventor： Ji Young CHOUNG ,  Dieter HAAS ,  Yu-hsin LIN ,  Jungmin LEE ,  Seong Ho YOO ,  Si Kyoung KIM

IPC: H10K59/122 ,  H10K50/84 ,  H10K50/844 ,  H10K71/00

CPC classification number: H10K59/122 ,  H10K50/84 ,  H10K50/844 ,  H10K71/00 ,  H10K59/1201

Abstract: Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes a plurality of sub-pixels, each sub-pixel of the plurality of sub-pixels defined by adjacent pixel-defining layer (PDL) structures with inorganic overhang structures disposed on the PDL structures, each sub-pixel having an anode, organic light-emitting diode (OLED) material disposed on the anode, and a cathode disposed on the OLED material. The device is made by a process including the steps of: depositing the OLED material and the cathode by evaporation deposition, and depositing an encapsulation layer disposed over the cathode.

公开(公告)号：US20240114727A1

公开(公告)日：2024-04-04

申请号：US18528888

申请日：2023-12-05

Applicant: Applied Materials, Inc.

Inventor： Jungmin LEE ,  Chung-chia CHEN ,  Ji Young CHOUNG ,  Yu-hsin LIN

IPC: H10K59/122 ,  H10K59/12 ,  H10K59/80

CPC classification number: H10K59/122 ,  H10K59/1201 ,  H10K59/80521

Abstract: Embodiments described herein relate to a sub-pixel. The sub-pixel includes an anode, overhang structures, separation structures, an organic light emitting diode (OLED) material, and a cathode. The anode is defined by adjacent first pixel isolation structures (PIS) and adjacent second PIS. The overhang structures are disposed on the first PIS. The overhang structures include a second structure disposed over the first structure and an intermediate structure disposed between the second structure and the first structure. A bottom surface of the second structure extends laterally past an upper surface of the first structure. The first structure is disposed over the first PIS. Separation structures are disposed over the second PIS. The OLED material is disposed over the anode and an upper surface of the separation structures. The cathode disposed over the OLED material and an upper surface of the separation structures.

公开(公告)号：US20230269969A1

公开(公告)日：2023-08-24

申请号：US18040161

申请日：2021-07-27

Applicant: Applied Materials, Inc.

Inventor： Jungmin LEE ,  Seong Ho YOO ,  Dieter HAAS ,  Si Kyoung KIM ,  Yu-hsin LIN ,  Ji Young CHOUNG

IPC: H10K59/122 ,  H10K59/80 ,  H10K59/12

CPC classification number: H10K59/122 ,  H10K59/873 ,  H10K59/1201

Abstract: Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in an organic light-emitting diode (OLED) display are described herein. The adjacent metal-containing overhang structures defining each sub-pixel of the sub-pixel circuit of the display provide for formation of the sub-pixel circuit using evaporation deposition and provide for the metal-containing overhang structures to remain in place after the sub-pixel circuit is formed (e.g., utilizing the methods of the fifth, sixth, or seventh exemplary embodiments). Evaporation deposition may be utilized for deposition of an OLED material and cathode. The metal-containing overhang structures define deposition angles, i.e., provide for a shadowing effect during evaporation deposition. The encapsulation layer of a respective sub-pixel is disposed over the cathode with the encapsulation layer extending under at least a portion of each of the adjacent metal-containing overhang structures and along a sidewall of each of the adjacent metal-containing overhang structures.

公开(公告)号：US20220077251A1

公开(公告)日：2022-03-10

申请号：US17193321

申请日：2021-03-05

Applicant: Applied Materials, Inc.

Inventor： Ji-young CHOUNG ,  Dieter HAAS ,  Yu Hsin LIN ,  Jungmin LEE ,  Seong Ho YOO ,  Si Kyoung KIM

IPC: H01L27/32 ,  H01L51/52 ,  H01L51/56

Abstract: Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes a substrate, adjacent pixel-defining layer (PDL) structures disposed over the substrate and defining sub-pixels of the device, inorganic overhang structures disposed on an upper surface of the PDL structures, and a plurality of sub-pixels. Each sub-pixel includes an anode, an organic light-emitting diode (OLED) material disposed over and in contact with the anode, a cathode disposed over the OLED material and extending under the inorganic overhang structures adjacent to each sub-pixel, and an encapsulation layer disposed over the cathode. The encapsulation layer extends under at least a portion of the inorganic overhang structures and along a sidewall of the inorganic overhang structures.

公开(公告)号：US20240065043A1

公开(公告)日：2024-02-22

申请号：US18498140

申请日：2023-10-31

Applicant: Applied Materials, Inc.

Inventor： Ji-young CHOUNG ,  Jungmin LEE ,  Chung-chia CHEN ,  Yusin LIN ,  Dieter HAAS ,  Si Kyoung KIM

IPC: H10K59/122 ,  H10K50/822 ,  H10K59/173

CPC classification number: H10K59/122 ,  H10K50/822 ,  H10K59/173

Abstract: Embodiments described herein generally relate to sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes substrate, pixel-defining layer (PDL) structures disposed over the section of the substrate, inorganic or metal overhang structures disposed on an upper surface of the PDL structures, and a plurality of sub-pixels. The PDL structures include a trench disposed in the top surface of the PDL structure. Each sub-pixel includes an anode, an OLED material disposed over and in contact with the anode, and a cathode disposed over the OLED material. The inorganic or metal overhang structures have an overhang extension that extends laterally over the trench. An encapsulation layer is disposed over the cathode and extends under at least a portion of the inorganic or metal overhang structures and along a top surface of the PDL structures.

公开(公告)号：US20240023379A1

公开(公告)日：2024-01-18

申请号：US18352802

申请日：2023-07-14

Applicant: Applied Materials, Inc.

Inventor： Ji Young CHOUNG ,  Chung-chia CHEN ,  Yu-hsin LIN ,  Jungmin LEE ,  Dieter HAAS ,  Si Kyoung KIM

IPC: H10K59/122 ,  H10K50/84 ,  H10K71/16

CPC classification number: H10K59/122 ,  H10K50/84 ,  H10K71/16 ,  H10K2102/103

Abstract: Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in an organic light-emitting diode (OLED) display are described herein. The overhang structures are permanent to the sub-pixel circuit. The overhang structures include a conductive oxide. A first configuration of the overhang structures includes a base portion and a top portion with the top portion disposed on the base portion. In a first sub-configuration, the base portion includes the conductive oxide of at least one of a TCO material or a TMO material. In a second sub-configuration, the base portion includes a metal alloy material and the conductive oxide of a metal oxide surface. A second configuration of the overhang structures includes the base portion and the top portion with a body portion disposed between the base portion and the top portion. The body portion includes the metal alloy body and the metal oxide surface.

公开(公告)号：US20230354649A1

公开(公告)日：2023-11-02

申请号：US18065124

申请日：2022-12-13

Applicant: Applied Materials, Inc.

Inventor： Ji-young CHOUNG ,  Jungmin LEE ,  Chung-chia CHEN ,  Yusin LIN ,  Dieter HAAS ,  Si Kyoung KIM

IPC: H10K59/122 ,  H10K50/822 ,  H10K59/173

CPC classification number: H01L27/3246 ,  H01L51/5225 ,  H01L27/3283

Abstract: Embodiments described herein generally relate to sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes substrate, pixel-defining layer (PDL) structures disposed over the section of the substrate, inorganic or metal overhang structures disposed on an upper surface of the PDL structures, and a plurality of sub-pixels. The PDL structures include a trench disposed in the top surface of the PDL structure. Each sub-pixel includes an anode, an OLED material disposed over and in contact with the anode, and a cathode disposed over the OLED material. The inorganic or metal overhang structures have an overhang extension that extends laterally over the trench. An encapsulation layer is disposed over the cathode and extends under at least a portion of the inorganic or metal overhang structures and along a top surface of the PDL structures.

公开(公告)号：US20230263014A1

公开(公告)日：2023-08-17

申请号：US18183822

申请日：2023-03-14

Applicant: Applied Materials, Inc.

Inventor： Yu-hsin LIN ,  Ji Young CHOUNG ,  Chung-chia CHEN ,  Jungmin LEE ,  Wen-Hao WU ,  Takashi ANJIKI ,  Takuji KATO ,  Dieter HAAS ,  Si Kyoung KIM ,  Stefan KELLER

IPC: H10K59/122 ,  H10K59/173

CPC classification number: H10K59/122 ,  H10K59/173 ,  H10K71/16

Abstract: Embodiments described herein relate to a device including a substrate, a plurality of adjacent pixel-defining layer (PDL) structures disposed over the substrate, and a plurality of sub-pixels. Each sub-pixel includes adjacent first overhangs, adjacent second overhangs, an anode, a hole injection layer (HIL) material, an additional organic light emitting diode (OLED) material, and a cathode. Each first overhang is defined by a body structure disposed on and extending laterally past a base structure disposed on the PDL structure. Each second overhang is defined by a top structure disposed on and extending laterally past the body structure. The HIL material is disposed over and in contact with the anode and disposed under the adjacent first overhangs. The additional OLED material is disposed on the HIL material and extends under the first overhang.

公开(公告)号：US20230076050A1

公开(公告)日：2023-03-09

申请号：US18049825

申请日：2022-10-26

Applicant: Applied Materials, Inc.

Inventor： Ji Young CHOUNG ,  Dieter HAAS ,  Yu-hsin LIN ,  Jungmin LEE ,  Seong Ho YOO ,  Si Kyoung KIM

IPC: H01L27/32 ,  H01L51/56 ,  H01L51/52

Abstract: Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes a plurality of sub-pixels, each sub-pixel of the plurality of sub-pixels defined by adjacent pixel-defining layer (PDL) structures with inorganic overhang structures disposed on the PDL structures, each sub-pixel having an anode, organic light-emitting diode (OLED) material disposed on the anode, and a cathode disposed on the OLED material. The device is made by a process including the steps of: depositing the OLED material and the cathode by evaporation deposition, and depositing an encapsulation layer disposed over the cathode.

公开(公告)号：US20220376204A1

公开(公告)日：2022-11-24

申请号：US17754233

申请日：2020-09-14

Applicant: Applied Materials, Inc.

Inventor： Yu Hsin LIN ,  Si Kyoung KIM ,  Jungmin LEE ,  Dieter HAAS

IPC: H01L51/52 ,  H01L51/56

Abstract: Methods and apparatus for forming organic light emitting diode (OLED) structures disposed on a substrate are provided. In one embodiment, a method for forming an organic light emitting diode (OLED) substrate is provided that includes forming a first conductive layer on a substrate in a first direction, forming a dielectric layer on a portion of the first conductive layer, wherein the dielectric layer includes a well having a portion of the first conductive layer exposed, depositing an organic material into the well and on the dielectric layer continuously in the second direction and between the two bus bars, and forming a second conductive layer on the organic material continuously in a second direction orthogonal to the first direction and between two bus bars, wherein the second conductive layer is in direct contact with the bus bars on opposing sides thereof; and depositing an encapsulating layer on the second conductive layer continuously in the second direction and fully cover the second conductive layer.