公开(公告)号：US11935771B2

公开(公告)日：2024-03-19

申请号：US17513631

申请日：2021-10-28

Applicant: Applied Materials, Inc.

Inventor： Randy A. Harris ,  Coby Scott Grove ,  Paul Zachary Wirth ,  Avinash Shantaram ,  Alpay Yilmaz ,  Amir Nissan ,  Jitendra Ratilal Bhimjiyani ,  Niranjan Pingle ,  Vincent Dicaprio

IPC: H01L21/67 ,  H01L21/687 ,  H01L23/00

CPC classification number: H01L21/6719 ,  H01L21/67121 ,  H01L21/67167 ,  H01L21/67173 ,  H01L21/67294 ,  H01L21/68707 ,  H01L24/97

Abstract: Methods and apparatus for bonding chiplets to substrates are provided herein. In some embodiments, a multi-chamber processing tool for processing substrates, includes: a first equipment front end module (EFEM) having one or more loadports for receiving one or more types of substrates, a second EFEM having one or more loadports; and a plurality of atmospheric modular mainframes (AMMs) coupled to each other and having a first AMM coupled to the first EFEM and a last AMM coupled to the second EFEM, wherein each of the plurality of AMMs include a transfer chamber and one or more process chambers coupled to the transfer chamber, wherein the transfer chamber includes a buffer, and wherein the transfer chamber includes a transfer robot, the one or more process chambers, and a buffer disposed in an adjacent AMM of the plurality of AMMs.

公开(公告)号：US10071887B2

公开(公告)日：2018-09-11

申请号：US14521080

申请日：2014-10-22

Applicant: Applied Materials, Inc.

Inventor： Jeffrey C. Hudgens ,  Alpay Yilmaz

IPC: B66C9/00 ,  B66C19/02 ,  B66C23/48

CPC classification number: B66C9/00 ,  B66C19/02 ,  B66C23/48

Abstract: Universal component lift apparatus for moving components of electronic device manufacturing systems is described. The universal component lift apparatus includes a track, a truck moveable along the track, and a lift apparatus adapted to couple to the truck, the lift apparatus including a wheeled base, a lift portion, and a boom adapted to couple to the component. Electronic device processing systems and methods of moving components thereof are described, as are numerous other aspects.

公开(公告)号：US11935770B2

公开(公告)日：2024-03-19

申请号：US17177882

申请日：2021-02-17

Applicant: Applied Materials, Inc.

Inventor： Randy A. Harris ,  Coby Scott Grove ,  Paul Zachary Wirth ,  Avinash Shantaram ,  Alpay Yilmaz ,  Amir Nissan ,  Vincent Dicaprio

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/687

CPC classification number: H01L21/6719 ,  H01L21/67173 ,  H01L21/67201 ,  H01L21/67207 ,  H01L21/67766 ,  H01L21/68707

Abstract: Methods and apparatus bonding chiplets to substrates are provided herein. In some embodiments, a multi-chamber processing tool for processing a substrate includes: an equipment front end module (EFEM) having one or more loadports for receiving one or more types of substrates; and a plurality of automation modules coupled to each other and having a first automation module coupled to the EFEM, wherein each of the plurality of automation modules include a transfer chamber and one or more process chambers coupled to the transfer chamber, wherein the transfer chamber includes a buffer configured to hold a plurality of the one or more types of substrates, and wherein the transfer chamber includes a transfer robot configured to transfer the one or more types of substrates between the buffer, the one or more process chambers, and a buffer disposed in an adjacent automation module of the plurality of automation modules.

公开(公告)号：US20150110586A1

公开(公告)日：2015-04-23

申请号：US14521080

申请日：2014-10-22

Applicant: Applied Materials, Inc.

Inventor： Jeffrey C. Hudgens ,  Alpay Yilmaz

IPC: B25J5/00 ,  B66C23/50

CPC classification number: B66C9/00 ,  B66C19/02 ,  B66C23/48

Abstract: Universal component lift apparatus for moving components of electronic device manufacturing systems is described. The universal component lift apparatus includes a track, a truck moveable along the track, and a lift apparatus adapted to couple to the truck, the lift apparatus including a wheeled base, a lift portion, and a boom adapted to couple to the component. Electronic device processing systems and methods of moving components thereof are described, as are numerous other aspects.

Abstract translation: 描述了用于移动电子装置制造系统的部件的通用部件提升装置。 通用部件提升装置包括轨道，可沿轨道移动的卡车和适于联接到卡车的提升装置，提升装置包括轮式底座，提升部分和适于联接到部件的吊臂。 电子设备处理系统及其移动组件的方法也如许多其它方面一样被描述。