-
1.发明授权公开(公告)号：US11935770B2
公开(公告)日：2024-03-19
申请号：US17177882
申请日：2021-02-17
Applicant: Applied Materials, Inc.
Inventor： Randy A. Harris , Coby Scott Grove , Paul Zachary Wirth , Avinash Shantaram , Alpay Yilmaz , Amir Nissan , Vincent Dicaprio
IPC: H01L21/67 , H01L21/677 , H01L21/687
CPC classification number: H01L21/6719 , H01L21/67173 , H01L21/67201 , H01L21/67207 , H01L21/67766 , H01L21/68707
Abstract: Methods and apparatus bonding chiplets to substrates are provided herein. In some embodiments, a multi-chamber processing tool for processing a substrate includes: an equipment front end module (EFEM) having one or more loadports for receiving one or more types of substrates; and a plurality of automation modules coupled to each other and having a first automation module coupled to the EFEM, wherein each of the plurality of automation modules include a transfer chamber and one or more process chambers coupled to the transfer chamber, wherein the transfer chamber includes a buffer configured to hold a plurality of the one or more types of substrates, and wherein the transfer chamber includes a transfer robot configured to transfer the one or more types of substrates between the buffer, the one or more process chambers, and a buffer disposed in an adjacent automation module of the plurality of automation modules.
-
公开(公告)号：US09812344B2
公开(公告)日：2017-11-07
申请号：US14613081
申请日：2015-02-03
Applicant: APPLIED Materials, Inc.
Inventor： Jason Rye , Mario David Silvetti , Randy A. Harris , Bryan Puch , Vincent Steffan Francischetti , Satish Sundar
IPC: H01L21/00 , H01L21/677 , B08B3/02 , H01L21/687
CPC classification number: H01L21/67751 , B08B3/02 , B08B2203/0229 , H01L21/68721
Abstract: A wafer processing system has a ring maintenance module for loading wafers into a chuck assembly, and for cleaning and inspecting the chuck assembly used in electroplating processors of the system. A shaft is attached to a rotor plate. A rotation motor rotates the shaft and a rotor plate on the shaft. A chuck clamp on an upper end of the shaft holds the chuck assembly onto the rotor plate. A lift motor raises and lowers the rotor plate and the shaft, to move open the chuck assembly for wafer loading and unloading, and to move the chuck assembly into different process positions. A swing arm having spray nozzles may be provided for cleaning the chuck assembly.
-
公开(公告)号：US20160237584A1
公开(公告)日：2016-08-18
申请号：US14620984
申请日：2015-02-12
Applicant: APPLIED Materials, Inc.
Inventor： Paul R. McHugh , Gregory J. Wilson , John L. Klocke , Randy A. Harris , Bridger Hoerner , Paul Van Valkenburg
CPC classification number: C25D5/34 , C25D5/022 , C25D7/12 , C25D17/001 , C25D17/004
Abstract: A method for processing a wafer includes holding the wafer in a face-up position with a seal ring contacting the wafer on a contact circumference. A bead of liquid is applied onto the entire contact circumference, with the bead of liquid contacting the wafer and the seal ring. The wafer is then inverted into a head-down position, lowered into contact with electrolyte and plated with a conductive film. Formation of the bead of liquid helps to displace air bubbles as the wafer is immersed into the electrolyte which reduces plating defects.
Abstract translation: 一种用于处理晶片的方法包括将晶片保持在面朝上位置，其中密封环在接触圆周上接触晶片。 液体珠被施加到整个接触圆周上，液体珠接触晶片和密封环。 然后将晶片倒置成下降位置，降低成与电解质接触并镀上导电膜。 当晶片浸入电解质中时，液体珠的形成有助于置换气泡，这减少了电镀缺陷。
-
公开(公告)号：US20160225656A1
公开(公告)日：2016-08-04
申请号：US14613081
申请日：2015-02-03
Applicant: APPLIED Materials, Inc.
Inventor： Jason Rye , Mario David Silvetti , Randy A. Harris , Bryan Puch , Vincent Steffan Francischetti , Satish Sundar
IPC: H01L21/687 , H01L21/677 , B08B3/10
CPC classification number: H01L21/67751 , B08B3/02 , B08B2203/0229 , H01L21/68721
Abstract: A wafer processing system has a ring maintenance module for loading wafers into a chuck assembly, and for cleaning and inspecting the chuck assembly used in electroplating processors of the system. A shaft is attached to a rotor plate. A rotation motor rotates the shaft and a rotor plate on the shaft. A chuck clamp on an upper end of the shaft holds the chuck assembly onto the rotor plate. A lift motor raises and lowers the rotor plate and the shaft, to move open the chuck assembly for wafer loading and unloading, and to move the chuck assembly into different process positions. A swing arm having spray nozzles may be provided for cleaning the chuck assembly.
Abstract translation: 晶片处理系统具有用于将晶片装载到卡盘组件中的环维护模块，以及用于清洁和检查在系统的电镀处理器中使用的卡盘组件。 轴连接到转子板上。 旋转马达使轴和转子板旋转在轴上。 在轴的上端上的卡盘夹将卡盘组件保持在转子板上。 升降马达提升和降低转子板和轴，以移动打开用于晶片装载和卸载的卡盘组件，并将卡盘组件移动到不同的加工位置。 可以提供具有喷嘴的摆臂来清洁卡盘组件。
-
公开(公告)号：US20150075976A1
公开(公告)日：2015-03-19
申请号：US14553840
申请日：2014-11-25
Applicant: APPLIED Materials, Inc.
Inventor： Randy A. Harris , Daniel J. Woodruff , Jeffrey I. Turner , Gregory J. Wilson , Paul R. McHugh
CPC classification number: C25D17/12 , C25D7/123 , C25D17/001 , C25D17/002
Abstract: An electroplating processor includes an electrode plate having a continuous flow path formed in a channel. The flow path may optionally be a coiled flow path. One or more electrodes are positioned in the channel. A membrane plate is attached to the electrode plate with a membrane in between them. Electrolyte moves through the flow path at a high velocity, preventing bubbles from sticking to the bottom surface of membrane. Any bubbles in the flow path are entrained in the fast moving electrolyte and carried away from the membrane. The electroplating processor may alternatively have a wire electrode extending through a tubular membrane formed into a coil or other shape, optionally including shapes having straight segments.
Abstract translation: 电镀处理器包括具有形成在通道中的连续流路的电极板。 流路可以可选地是卷绕的流动路径。 一个或多个电极定位在通道中。 膜板在它们之间附着有电极板。 电解液以高速移动通过流路，防止气泡粘到膜底部。 流动路径中的任何气泡被夹带在快速移动的电解质中并从膜中带走。 电镀处理器可以替代地具有延伸通过形成为线圈或其它形状的管状膜的线电极，任选地包括具有直段的形状。
-
Patent Agency Ranking
公开(公告)号：US20140083862A1
公开(公告)日：2014-03-27
申请号：US14037158
申请日：2013-09-25
Applicant: Applied Materials, Inc.
Inventor： Randy A. Harris , Bryan J. Puch
IPC: C25D5/48
CPC classification number: C25D5/48 , C25D17/001 , C25D17/005 , C25D21/00
Abstract: An electroplating apparatus has a rotor in a head, with a contact ring on the rotor. A lift/rotate actuator may move the head to position a sector of the contact ring into a deplate channel of a deplating station. Electrical current and a deplate liquid are applied directly onto the contacts of the contact ring, from a position radially inward of the contacts. Electrical current and a deplate liquid may also be separately applied onto the back side of the ring contact, from a position radially to the outside of the contact ring. A seal on the deplating station makes sliding contact with the contact ring as the contact ring rotates through the deplate channel, with the seal associated with an exhaust or vacuum opening that pulls deplating and rinse liquid through openings in the contact ring.
Abstract translation: 电镀设备在头部具有转子，转子上具有接触环。 提升/旋转致动器可以移动头部以将接触环的一个扇区定位到脱落台的去槽通道中。 从接触件径向向内的位置，将电流和去离子液体直接施加到接触环的触点上。 电流和去离子液体也可以从接触环的径向到外部的位置分开施加到环形接触的背面上。 脱模站上的密封件随着接触环通过凹槽通道旋转而与接触环滑动接触，密封件与排气或真空开口相关联，排气或真空开口通过接触环中的开口拉动脱液和冲洗液体。
-
7.发明授权公开(公告)号：US11935771B2
公开(公告)日：2024-03-19
申请号：US17513631
申请日：2021-10-28
Applicant: Applied Materials, Inc.
Inventor： Randy A. Harris , Coby Scott Grove , Paul Zachary Wirth , Avinash Shantaram , Alpay Yilmaz , Amir Nissan , Jitendra Ratilal Bhimjiyani , Niranjan Pingle , Vincent Dicaprio
IPC: H01L21/67 , H01L21/687 , H01L23/00
CPC classification number: H01L21/6719 , H01L21/67121 , H01L21/67167 , H01L21/67173 , H01L21/67294 , H01L21/68707 , H01L24/97
Abstract: Methods and apparatus for bonding chiplets to substrates are provided herein. In some embodiments, a multi-chamber processing tool for processing substrates, includes: a first equipment front end module (EFEM) having one or more loadports for receiving one or more types of substrates, a second EFEM having one or more loadports; and a plurality of atmospheric modular mainframes (AMMs) coupled to each other and having a first AMM coupled to the first EFEM and a last AMM coupled to the second EFEM, wherein each of the plurality of AMMs include a transfer chamber and one or more process chambers coupled to the transfer chamber, wherein the transfer chamber includes a buffer, and wherein the transfer chamber includes a transfer robot, the one or more process chambers, and a buffer disposed in an adjacent AMM of the plurality of AMMs.
-
公开(公告)号：US10174437B2
公开(公告)日：2019-01-08
申请号：US15198945
申请日：2016-06-30
Applicant: APPLIED Materials, Inc.
Inventor： Randy A. Harris , Michael Windham
Abstract: A wafer is placed into a chuck assembly within an electroplating system. The chuck assembly includes a backing plate assembly engageable with a ring. A hub may be provided on one side of the backing plate assembly for attaching the chuck assembly to a rotor of a processor for electroplating a wafer. A wafer plate may be provided on the other side of the backing plate assembly. The ring has contact fingers electrically connected to a ring bus bar, and with the ring bus bar electrically connected to a power source in the processor via the backing plate assembly when the ring is engaged to the backing plate assembly. A wafer seal on the ring overlies the contact fingers. A chuck seal may be provided around a perimeter. Maintenance of the electrical contacts and the seal is performed remotely from the processors.
-
公开(公告)号：US09598788B2
公开(公告)日：2017-03-21
申请号：US14037158
申请日：2013-09-25
Applicant: APPLIED Materials, Inc.
Inventor： Randy A. Harris , Bryan J. Puch
CPC classification number: C25D5/48 , C25D17/001 , C25D17/005 , C25D21/00
Abstract: An electroplating apparatus has a rotor in a head, with a contact ring on the rotor. A lift/rotate actuator may move the head to position a sector of the contact ring into a deplate channel of a deplating station. Electrical current and a deplate liquid are applied directly onto the contacts of the contact ring, from a position radially inward of the contacts. Electrical current and a deplate liquid may also be separately applied onto the back side of the ring contact, from a position radially to the outside of the contact ring. A seal on the deplating station makes sliding contact with the contact ring as the contact ring rotates through the deplate channel, with the seal associated with an exhaust or vacuum opening that pulls deplating and rinse liquid through openings in the contact ring.
-
公开(公告)号：US20250116028A1
公开(公告)日：2025-04-10
申请号：US18483957
申请日：2023-10-10
Applicant: Applied Materials, Inc.
Inventor： Paul R. McHugh , Gregory J. Wilson , Kyle M. Hanson , Nolan L. Zimmerman , Randy A. Harris , John L. Klocke , Eric J. Bergman , Keith Edward Ypma
Abstract: Exemplary electroplating systems may include a vessel. The systems may include a head that is configured to hold a substrate. The head may be positionable within an interior of the vessel. The systems may include a spray jet array disposed within the interior of the vessel. The spray jet array may include a plate defining a plurality of apertures through a thickness of the plate. The systems may include at least one fluid pump that is fluidly coupled with an inlet end of each of the plurality of apertures.
-
-
-
-
-
-
-
-
-
Search Results
12
records
(took 0.012 seconds)
