公开(公告)号：US20250091094A1

公开(公告)日：2025-03-20

申请号：US18471190

申请日：2023-09-20

Applicant: Applied Materials, Inc.

Inventor： Benjamin Clay Bradley ,  Ryan Michael Thompson

IPC: B08B1/00 ,  B08B3/08

Abstract: Exemplary seal cleaning apparatuses may include at least one support that is configured to receive a seal. The apparatuses may include a tool arm that is positionable within an interior of the seal. The apparatuses may include a pad holder that is rotatably coupled with the tool arm. The pad holder may include a body having a first end and a second end. The first end may define a channel that is configured to receive a cleaning pad. The body may define an aperture that extends from the second end through the channel. The pad holder may include a fluid fitting coupled with the aperture at the second end of the body. The apparatuses may include a cleaning fluid source that is fluidly coupled with the fluid fitting.

公开(公告)号：US20250006519A1

公开(公告)日：2025-01-02

申请号：US18342991

申请日：2023-06-28

Applicant: Applied Materials, Inc.

Inventor： Kyle M. Hanson ,  Eric J. Bergman ,  Gregory J. Wilson ,  Paul R. McHugh ,  Benjamin Clay Bradley ,  Aaron Paul Juntunen ,  Deepak Saagar Kalaikadal ,  Daniel Durado ,  Carl Campbell Stringer ,  James Jay Tripp ,  Jason A. Rye ,  John L. Klocke

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/673

Abstract: Method and systems for cleaning and wetting a semiconductor substrate, are provided. Methods and systems include forming an atmosphere in a basin housing the semiconductor substrate with a gas having a higher solubility in a wetting agent than oxygen. Methods and systems include spraying the wetting agent with a spray head onto the substrate while maintaining the atmosphere. Methods and systems include rotationally translating the semiconductor substrate, the spray head, or both the semiconductor substrate and the spray head, Methods and systems include wetting a plurality of features defined in the substrate.