公开(公告)号：US11739434B2

公开(公告)日：2023-08-29

申请号：US16739569

申请日：2020-01-10

Applicant: Applied Materials, Inc.

Inventor： Cameron Law ,  Daniel Durado ,  Thomas Oberlitner

IPC: C25D17/02 ,  C25D7/12 ,  H01L21/288 ,  H01L21/67 ,  H01L21/768 ,  C25D17/04 ,  C25D21/10 ,  C25D17/00 ,  C25D21/12

CPC classification number: C25D17/02 ,  C25D7/12 ,  C25D17/04 ,  C25D21/10 ,  H01L21/288 ,  H01L21/6723 ,  H01L21/76873 ,  C25D17/001 ,  C25D21/12

Abstract: Electroplating processing systems according to the present technology may include a recirculating tank containing a first volume of processing fluid. The recirculating tank may be fluidly coupled with a delivery pump. The systems may include a vessel configured to receive the processing fluid from the pump. The vessel may include an inner chamber and an outer chamber, and the inner chamber may be sized to hold a second volume of processing fluid less than the first volume of processing fluid. A liquid level sensor may be associated with the vessel to provide a liquid level indication in the outer chamber. The systems may include a return line coupled with an outlet of the vessel and coupled with an inlet of the recirculating tank. The systems may also include a return pump fluidly coupled with the return line. The return pump may be electrically coupled with the liquid level sensor.

公开(公告)号：US20230349064A1

公开(公告)日：2023-11-02

申请号：US18348055

申请日：2023-07-06

Applicant: Applied Materials, Inc.

Inventor： Cameron Law ,  Daniel Durado ,  Thomas Oberlitner ,  Richard W. Plavidal

IPC: C25D17/02 ,  C25D7/12 ,  H01L21/288 ,  H01L21/67 ,  H01L21/768 ,  C25D17/04 ,  C25D21/10

CPC classification number: C25D17/02 ,  C25D7/12 ,  H01L21/288 ,  H01L21/6723 ,  H01L21/76873 ,  C25D17/04 ,  C25D21/10 ,  C25D17/001

Abstract: Electroplating processing systems according to the present technology may include a recirculating tank containing a first volume of processing fluid. The recirculating tank may be fluidly coupled with a delivery pump. The systems may include a vessel configured to receive the processing fluid from the pump. The vessel may include an inner chamber and an outer chamber, and the inner chamber may be sized to hold a second volume of processing fluid less than the first volume of processing fluid. A liquid level sensor may be associated with the vessel to provide a liquid level indication in the outer chamber. The systems may include a return line coupled with an outlet of the vessel and coupled with an inlet of the recirculating tank. The systems may also include a return pump fluidly coupled with the return line. The return pump may be electrically coupled with the liquid level sensor.

公开(公告)号：US20250006519A1

公开(公告)日：2025-01-02

申请号：US18342991

申请日：2023-06-28

Applicant: Applied Materials, Inc.

Inventor： Kyle M. Hanson ,  Eric J. Bergman ,  Gregory J. Wilson ,  Paul R. McHugh ,  Benjamin Clay Bradley ,  Aaron Paul Juntunen ,  Deepak Saagar Kalaikadal ,  Daniel Durado ,  Carl Campbell Stringer ,  James Jay Tripp ,  Jason A. Rye ,  John L. Klocke

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/673

Abstract: Method and systems for cleaning and wetting a semiconductor substrate, are provided. Methods and systems include forming an atmosphere in a basin housing the semiconductor substrate with a gas having a higher solubility in a wetting agent than oxygen. Methods and systems include spraying the wetting agent with a spray head onto the substrate while maintaining the atmosphere. Methods and systems include rotationally translating the semiconductor substrate, the spray head, or both the semiconductor substrate and the spray head, Methods and systems include wetting a plurality of features defined in the substrate.

公开(公告)号：US20200152467A1

公开(公告)日：2020-05-14

申请号：US16739569

申请日：2020-01-10

Applicant: Applied Materials, Inc.

Inventor： Cameron Law ,  Daniel Durado ,  Thomas Oberlitner ,  Richard W. Plavidal

IPC: H01L21/288 ,  C25D7/12 ,  H01L21/67 ,  H01L21/768 ,  C25D17/02 ,  C25D17/00 ,  C25D21/12

Abstract: Electroplating processing systems according to the present technology may include a recirculating tank containing a first volume of processing fluid. The recirculating tank may be fluidly coupled with a delivery pump. The systems may include a vessel configured to receive the processing fluid from the pump. The vessel may include an inner chamber and an outer chamber, and the inner chamber may be sized to hold a second volume of processing fluid less than the first volume of processing fluid. A liquid level sensor may be associated with the vessel to provide a liquid level indication in the outer chamber. The systems may include a return line coupled with an outlet of the vessel and coupled with an inlet of the recirculating tank. The systems may also include a return pump fluidly coupled with the return line. The return pump may be electrically coupled with the liquid level sensor.