公开(公告)号：US20230360940A1

公开(公告)日：2023-11-09

申请号：US17735623

申请日：2022-05-03

Applicant: Applied Materials, Inc.

Inventor： Jason A. Rye

IPC: H01L21/673

CPC classification number: H01L21/67346 ,  H01L21/67326 ,  H01L21/67313

Abstract: Exemplary semiconductor substrate carrier frames may include a frame body defining a central aperture. The frames may include a plurality of fingers that are coupled with the frame body. Each of the plurality of fingers may extend into the central aperture. Each of the plurality of fingers may include a substrate receiving interface. At least one of the plurality of fingers may include an actuator that manipulates a respective one of the at least one of the plurality of fingers between a substrate holding position and an open position.

公开(公告)号：US11241718B2

公开(公告)日：2022-02-08

申请号：US16386646

申请日：2019-04-17

Applicant: Applied Materials, Inc.

Inventor： Joseph Antony Jonathan ,  Kyle M. Hanson ,  Jason A. Rye ,  James E. Brown ,  Gregory J. Wilson ,  Eric J. Bergman ,  Tricia A. Youngbull ,  Timothy G. Stolt

IPC: C25D21/08 ,  B08B1/00 ,  C25D17/00

Abstract: Systems for cleaning electroplating system components may include a seal cleaning assembly incorporated with an electroplating system. The seal cleaning assembly may include an arm pivotable between a first position and a second position. The arm may be rotatable about a central axis of the arm. The seal cleaning assembly may include a cleaning head coupled with a distal portion of the arm. The cleaning head may include a bracket having a faceplate coupled with the arm, and a housing extending from the faceplate. The housing may define one or more arcuate channels extending through the housing to a front surface of the bracket. The cleaning head may also include a rotatable cartridge extending from the housing of the bracket. The cartridge may include a mount cylinder defining one or more apertures configured to deliver a cleaning solution to a pad coupled about the mount cylinder.

公开(公告)号：US20250006519A1

公开(公告)日：2025-01-02

申请号：US18342991

申请日：2023-06-28

Applicant: Applied Materials, Inc.

Inventor： Kyle M. Hanson ,  Eric J. Bergman ,  Gregory J. Wilson ,  Paul R. McHugh ,  Benjamin Clay Bradley ,  Aaron Paul Juntunen ,  Deepak Saagar Kalaikadal ,  Daniel Durado ,  Carl Campbell Stringer ,  James Jay Tripp ,  Jason A. Rye ,  John L. Klocke

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/673

Abstract: Method and systems for cleaning and wetting a semiconductor substrate, are provided. Methods and systems include forming an atmosphere in a basin housing the semiconductor substrate with a gas having a higher solubility in a wetting agent than oxygen. Methods and systems include spraying the wetting agent with a spray head onto the substrate while maintaining the atmosphere. Methods and systems include rotationally translating the semiconductor substrate, the spray head, or both the semiconductor substrate and the spray head, Methods and systems include wetting a plurality of features defined in the substrate.