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公开(公告)号：US20230313405A1
公开(公告)日：2023-10-05
申请号：US18129999
申请日：2023-04-03
Applicant: Applied Materials, Inc.
Inventor： Paul R. McHugh , Gregory J. Wilson , Kwan Wook Roh , Kyle M. Hanson , Forrest G. Reinhart , David J. Reis , James E. Brown , Nolan L. Zimmerman
CPC classification number: C25D17/002 , C25D3/38 , C25D21/04 , C25D21/02
Abstract: Embodiments of the present technology include electroplating methods that include providing a first portion of an electrolyte feedstock to a first compartment of an electrochemical cell. The first portion of an electrolyte feedstock may be characterized by an initial metal ion concentration and an initial acid concentration. The methods may include providing a second portion of an electrolyte feedstock to a second compartment of the electrochemical cell. The second compartment and first compartment may be separated by a first membrane. The methods may include providing an acidic solution to a third compartment of the electrochemical cell. The third compartment and second compartment may be separated by a second membrane. The acidic solution may be characterized by an initial acid concentration. The methods may include applying a current to an anode of the electrochemical cell. The anode of the electrochemical cell may be disposed proximate the first compartment and across from the first membrane.
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公开(公告)号：US20230272546A1
公开(公告)日：2023-08-31
申请号：US18195021
申请日：2023-05-09
Applicant: Applied Materials, Inc.
Inventor： Kwan Wook Roh , Charles Sharbono , Kyle M. Hanson
CPC classification number: C25D3/38 , C25D7/12 , C25D17/002 , C25D21/14 , C25D17/001
Abstract: Electroplating methods and systems are described that include adding a metal-ion-containing starting solution to a catholyte to increase a metal ion concentration in the catholyte to a first metal ion concentration. The methods and systems further include measuring the metal ion concentration in the catholyte while the metal ions electroplate onto a substrate and the catholyte reaches a second metal ion concentration that is less than the first metal ion concentration. The methods and systems additionally include adding a portion of an anolyte directly to the catholyte when the catholyte reaches the second metal ion concentration. The addition of the portion of the anolyte increases the metal ion concentration in the catholyte to a third metal ion concentration that is greater than or about the first metal ion concentration.
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公开(公告)号：US11697887B2
公开(公告)日：2023-07-11
申请号：US17078413
申请日：2020-10-23
Applicant: Applied Materials, Inc.
Inventor： Nolan L. Zimmerman , Charles Sharbono , Gregory J. Wilson , Paul R. McHugh , Paul Van Valkenburg , Deepak Saagar Kalaikadal , Kyle M. Hanson
CPC classification number: C25D17/10 , C25D7/123 , C25D17/001 , C25D17/002 , C25D21/12 , C25D21/18
Abstract: Electroplating systems may include an electroplating chamber. The systems may also include a replenish assembly fluidly coupled with the electroplating chamber. The replenish assembly may include a first compartment housing anode material. The first compartment may include a first compartment section in which the anode material is housed and a second compartment section separated from the first compartment section by a divider. The replenish assembly may include a second compartment fluidly coupled with the electroplating chamber and electrically coupled with the first compartment. The replenish assembly may also include a third compartment electrically coupled with the second compartment, the third compartment including an inert cathode.
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公开(公告)号：US11262662B2
公开(公告)日：2022-03-01
申请号：US17062326
申请日：2020-10-02
Applicant: Applied Materials, Inc.
Inventor： Viachslav Babayan , Ludovic Godet , Kyle M. Hanson , Robert B. Moore
Abstract: Implementations described herein relate to a platform apparatus for post exposure processing. In one implementation, a platform apparatus includes a plumbing module and a process module. The process module further includes a central region having a robot disposed therein, and a plurality of process stations disposed about the central region and sharing the plumbing module. Each process station includes a process chamber and a post process chamber in a stacked arrangement. The process chamber includes a chamber body defining a process volume, a door coupled to the chamber body, a first electrode coupled to the door, and a power source communicatively coupled to the first electrode.
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公开(公告)号：US20210017665A1
公开(公告)日：2021-01-21
申请号：US16513434
申请日：2019-07-16
Applicant: Applied Materials, Inc.
Inventor： Sam Lee , Kyle M. Hanson , Eric J. Bergman
Abstract: Cleaning substrates or electroplating system components may include methods of rinsing a substrate at a semiconductor plating chamber. The methods may include moving a head from a plating bath to a first position. The head may include a substrate coupled with the head. The methods may include rotating the head for a first period of time to sling bath fluid back into the plating bath. A residual amount of bath fluid may remain. The methods may include delivering a first fluid to the substrate from a first fluid nozzle to at least partially expel the residual amount of bath fluid back into the plating bath. The methods may include moving the head to a second position. The methods may include rotating the head for a second period of time. The methods may also include delivering a second fluid across the substrate from a second fluid nozzle.
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Patent Agency Ranking
公开(公告)号：US09984867B2
公开(公告)日：2018-05-29
申请号：US14602201
申请日：2015-01-21
Applicant: Applied Materials, Inc.
Inventor： Ekaterina Mikhaylichenko , Brian J. Brown , Kyle M. Hanson , Vincent S. Francischetti
IPC: H01L21/02 , H01L21/67 , H01L21/677 , B08B3/08
CPC classification number: H01L21/02054 , B08B3/08 , H01L21/67028 , H01L21/67034 , H01L21/67057 , H01L21/67733 , H01L21/67736 , H01L21/67751
Abstract: In some embodiments, a system is provided that includes (1) a loading position; (2) a drying position; (3) a movable tank configured to (a) hold at least one substrate; (b) hold a cleaning chemistry so as to expose a substrate within the movable tank to the cleaning chemistry; and (c) translate between the loading position and the drying position; and (4) a drying station located at the drying position and configured to rinse and dry a substrate as the substrate is unloaded from the movable tank when the movable tank is at the drying position. Numerous other aspects are provided.
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公开(公告)号：US20150050752A1
公开(公告)日：2015-02-19
申请号：US13967160
申请日：2013-08-14
Applicant: APPLIED Materials, Inc.
Inventor： Kyle M. Hanson , Joy E. Peterson
IPC: H01L21/02 , H01L21/306 , H01L21/66
CPC classification number: H01L21/02068 , H01L21/02087 , H01L21/30604 , H01L22/10
Abstract: In a method for removing metal at the edge of a wafer, including from a notch in the edge of the wafer, water is dripped or otherwise supplied onto the up-facing metal-plated front side of the wafer, while rotating the wafer. A metal etchant, such as sulfuric acid, is provided onto the back side of the wafer, at a flow rate multiple times greater than the water flow rate. The etchant flows over the edge of the wafer and the notch, and onto an annular edge on the front side of the wafer. The metal plated in the notch is removed, even if the notch has a radial depth greater than the width of the exclusion zone. The flow rates of the water and the etchant, and the rotation speed may be adjusted to provide a static water film, with the etchant diffusing into the outer edge of the water film.
Abstract translation: 在晶片边缘处除去金属的方法中，包括从晶片边缘的凹口，在旋转晶片的同时，将水滴落或以其它方式供给到晶片的面向金属的前面。 将金属蚀刻剂（例如硫酸）以比水流速大多倍的流量提供到晶片的背面。 蚀刻剂流过晶片边缘和凹口，并流到晶片正面的环形边缘上。 即使切口的径向深度大于排除区域的宽度，也可以去除刻在凹口中的金属。 可以调节水和蚀刻剂的流速以及旋转速度以提供静电水膜，其中蚀刻剂扩散到水膜的外边缘。
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公开(公告)号：US20250116028A1
公开(公告)日：2025-04-10
申请号：US18483957
申请日：2023-10-10
Applicant: Applied Materials, Inc.
Inventor： Paul R. McHugh , Gregory J. Wilson , Kyle M. Hanson , Nolan L. Zimmerman , Randy A. Harris , John L. Klocke , Eric J. Bergman , Keith Edward Ypma
Abstract: Exemplary electroplating systems may include a vessel. The systems may include a head that is configured to hold a substrate. The head may be positionable within an interior of the vessel. The systems may include a spray jet array disposed within the interior of the vessel. The spray jet array may include a plate defining a plurality of apertures through a thickness of the plate. The systems may include at least one fluid pump that is fluidly coupled with an inlet end of each of the plurality of apertures.
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公开(公告)号：US20240337040A1
公开(公告)日：2024-10-10
申请号：US18298223
申请日：2023-04-10
Applicant: Applied Materials, Inc.
Inventor： Kyle M. Hanson
IPC: C25D17/00 , B29C64/124
CPC classification number: C25D17/004 , B29C64/124 , B33Y10/00 , B33Y70/10 , B33Y80/00 , F16J15/022
Abstract: The present technology includes monolithic electroplating seals, such as electroplating seals formed utilizing additive manufacturing. Seals include an external seal member and an internal seal member. The external seal member includes an inner annular radius, an outer annular radius, and an external seal member body defined between an exterior surface and an interior surface opposite the exterior surface. The exterior surface is formed from at least one polymer layer having a porosity of less than or about 10 vol. % and the external seal member body includes a filler. The internal seal member is formed integrally with and extends along at least a portion of the interior surface of the external seal member from the inner annular radius towards the outer annular radius. The internal seal member includes a deformable thermoplastic elastomer.
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公开(公告)号：US20230313406A1
公开(公告)日：2023-10-05
申请号：US18130004
申请日：2023-04-03
Applicant: Applied Materials, Inc.
Inventor： Paul R. McHugh , Forrest G. Reinhart , Gregory J. Wilson , Kwan Wook Roh , Kyle M. Hanson , James E. Brown , David J. Reis
CPC classification number: C25D17/002 , C25D3/38 , C25D21/04 , C25D21/02
Abstract: Electroplating methods may include providing an electrolyte feedstock comprising copper to a first compartment of an electrochemical cell. The methods may include providing an acidic solution to a second compartment of the electrochemical cell. The first compartment and second compartment may be separated by a membrane. The methods may include applying a current to an anode of the electrochemical cell. The anode of the electrochemical cell may be disposed proximate the first compartment and across from the membrane. The methods may include forming an anolyte and catholyte precursor.
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