公开(公告)号：US11739434B2

公开(公告)日：2023-08-29

申请号：US16739569

申请日：2020-01-10

Applicant: Applied Materials, Inc.

Inventor： Cameron Law ,  Daniel Durado ,  Thomas Oberlitner

IPC: C25D17/02 ,  C25D7/12 ,  H01L21/288 ,  H01L21/67 ,  H01L21/768 ,  C25D17/04 ,  C25D21/10 ,  C25D17/00 ,  C25D21/12

CPC classification number: C25D17/02 ,  C25D7/12 ,  C25D17/04 ,  C25D21/10 ,  H01L21/288 ,  H01L21/6723 ,  H01L21/76873 ,  C25D17/001 ,  C25D21/12

Abstract: Electroplating processing systems according to the present technology may include a recirculating tank containing a first volume of processing fluid. The recirculating tank may be fluidly coupled with a delivery pump. The systems may include a vessel configured to receive the processing fluid from the pump. The vessel may include an inner chamber and an outer chamber, and the inner chamber may be sized to hold a second volume of processing fluid less than the first volume of processing fluid. A liquid level sensor may be associated with the vessel to provide a liquid level indication in the outer chamber. The systems may include a return line coupled with an outlet of the vessel and coupled with an inlet of the recirculating tank. The systems may also include a return pump fluidly coupled with the return line. The return pump may be electrically coupled with the liquid level sensor.

公开(公告)号：US20230349064A1

公开(公告)日：2023-11-02

申请号：US18348055

申请日：2023-07-06

Applicant: Applied Materials, Inc.

Inventor： Cameron Law ,  Daniel Durado ,  Thomas Oberlitner ,  Richard W. Plavidal

IPC: C25D17/02 ,  C25D7/12 ,  H01L21/288 ,  H01L21/67 ,  H01L21/768 ,  C25D17/04 ,  C25D21/10

CPC classification number: C25D17/02 ,  C25D7/12 ,  H01L21/288 ,  H01L21/6723 ,  H01L21/76873 ,  C25D17/04 ,  C25D21/10 ,  C25D17/001

Abstract: Electroplating processing systems according to the present technology may include a recirculating tank containing a first volume of processing fluid. The recirculating tank may be fluidly coupled with a delivery pump. The systems may include a vessel configured to receive the processing fluid from the pump. The vessel may include an inner chamber and an outer chamber, and the inner chamber may be sized to hold a second volume of processing fluid less than the first volume of processing fluid. A liquid level sensor may be associated with the vessel to provide a liquid level indication in the outer chamber. The systems may include a return line coupled with an outlet of the vessel and coupled with an inlet of the recirculating tank. The systems may also include a return pump fluidly coupled with the return line. The return pump may be electrically coupled with the liquid level sensor.

公开(公告)号：US20200152467A1

公开(公告)日：2020-05-14

申请号：US16739569

申请日：2020-01-10

Applicant: Applied Materials, Inc.

Inventor： Cameron Law ,  Daniel Durado ,  Thomas Oberlitner ,  Richard W. Plavidal

IPC: H01L21/288 ,  C25D7/12 ,  H01L21/67 ,  H01L21/768 ,  C25D17/02 ,  C25D17/00 ,  C25D21/12

Abstract: Electroplating processing systems according to the present technology may include a recirculating tank containing a first volume of processing fluid. The recirculating tank may be fluidly coupled with a delivery pump. The systems may include a vessel configured to receive the processing fluid from the pump. The vessel may include an inner chamber and an outer chamber, and the inner chamber may be sized to hold a second volume of processing fluid less than the first volume of processing fluid. A liquid level sensor may be associated with the vessel to provide a liquid level indication in the outer chamber. The systems may include a return line coupled with an outlet of the vessel and coupled with an inlet of the recirculating tank. The systems may also include a return pump fluidly coupled with the return line. The return pump may be electrically coupled with the liquid level sensor.