公开(公告)号：US20240198468A1

公开(公告)日：2024-06-20

申请号：US18106155

申请日：2023-02-06

申请人： Applied Materials, Inc.

发明人： Aniketnitin PATIL ,  Raja Murali DHAMODHARAN ,  Martin Jeffrey SALINAS ,  Shu-Kwan LAU

IPC分类号： B23Q3/10 ,  C30B25/12 ,  C30B35/00

CPC分类号： B23Q3/106 ,  C30B25/12 ,  C30B35/005

摘要： The present disclosure relates to lift assemblies, and related methods and components, for substrate processing chambers. In one implementation, a lift assembly for disposition in relation to a substrate processing chamber includes a first motor, a first drive assembly coupled to the first motor, and a first support block coupled to the first drive assembly. The first motor is configured to linearly move the first support block using the first drive assembly. The lift assembly includes a second motor, a second drive assembly coupled to the second motor, and a second support block coupled to the second drive assembly. The second motor is configured to linearly move the second support block using the second drive assembly, and the second motor is configured to linearly move the second support block independently of the first motor linearly moving the first support block.

公开(公告)号：US20240021444A1

公开(公告)日：2024-01-18

申请号：US18074239

申请日：2022-12-02

申请人： Applied Materials, Inc.

发明人： Manjunath SUBBANNA ,  Ala MORADIAN ,  Errol Antonio C. SANCHEZ ,  Zuoming ZHU ,  Peydaye Saheli GHAZAL ,  Martin Jeffrey SALINAS ,  Aniketnitin PATIL ,  Raja Murali DHAMODHARAN ,  Shu-Kwan LAU

IPC分类号： H01L21/67 ,  H01L21/20 ,  C23C16/44 ,  C23C16/455

CPC分类号： H01L21/67017 ,  H01L21/67103 ,  H01L21/20 ,  C23C16/4412 ,  C23C16/455 ,  H01L21/67739

摘要： The present disclosure relates to batch processing apparatus, systems, and related methods and structures for epitaxial deposition operations. In one implementation, an apparatus for substrate processing includes a cassette. The cassette is at least partially supported by a pedestal assembly. The cassette includes a plurality of levels arranged vertically with respect to each other, each level of the plurality of levels including a support surface configured to support a substrate. A level spacing between adjacent levels of the plurality of levels is 25 mm or higher, and the level spacing is defined between the support surfaces of the adjacent levels.

公开(公告)号：US20240254627A1

公开(公告)日：2024-08-01

申请号：US18122484

申请日：2023-03-16

申请人： Applied Materials, Inc.

发明人： Raja Murali DHAMODHARAN ,  Kalaivanan MOHANADASS ,  Aniketnitin PATIL ,  Martin Jeffrey SALINAS ,  Shu-Kwan LAU

IPC分类号： C23C16/455 ,  C23C16/458 ,  C30B25/12 ,  C30B25/14

CPC分类号： C23C16/45563 ,  C23C16/4586 ,  C30B25/12 ,  C30B25/14

摘要： Embodiments of the present disclosure relate to injectors, liners, process kits, processing chambers, and related methods for gas flow in batch processing operations. In one or more embodiments, the liners facilitate gas flow uniformity in batch processing. In one or more embodiments, a liner includes a plurality of inlet openings on an inlet side, the plurality of inlet openings extending into an outer face of the liner. The plurality of inlet openings include a plurality of first inlet openings that include a first row extending into a first side face, and a second row extending into a second side face. The plurality of inlet openings include a plurality of second inlet openings extending between an inner face and the outer face. The liner includes one or more outlet openings on an outlet side. The outlet side opposes the inlet side. The one or more outlet openings extend into the inner face.

公开(公告)号：US20230341186A1

公开(公告)日：2023-10-26

申请号：US17730038

申请日：2022-04-26

申请人： Applied Materials, Inc.

发明人： Abraham PALATY ,  Vinodh RAMACHANDRAN ,  Shu-Kwan LAU ,  Shainish NELLIKKA ,  Raja Murali DHAMODHARAN ,  Danny D. WANG

IPC分类号： F28D1/02 ,  F28D1/047 ,  F28F1/24

CPC分类号： F28D1/0226 ,  F28D1/0477 ,  F28D1/024 ,  F28F1/24 ,  F28D2001/0286

摘要： A heating module for a substrate processing chamber includes heating lamps coupled to a reflector plate and a heat exchanger. The heat exchanger cools a gas within the heating module. A fan within the heating module circulates the gas through apertures in the reflector plate to cool the heating bulbs. The gas is cooled by the heat exchanger, and is recirculated. One or more shrouds directs the gas as the gas is being circulated.