公开(公告)号：US20240344199A1

公开(公告)日：2024-10-17

申请号：US18456836

申请日：2023-08-28

Applicant: Applied Materials, Inc.

Inventor： Yogananda Sarode Vishwanath ,  Anand KUMAR ,  George KIM

IPC: C23C16/455 ,  C23C16/52 ,  H01J37/32 ,  H01L21/02

CPC classification number: C23C16/45563 ,  C23C16/52 ,  H01J37/32449 ,  H01J37/32798 ,  H01L21/02274 ,  H01J2237/3321 ,  H01J2237/334

Abstract: Semiconductor processing systems and system components are described. The system components include a chamber lid of a semiconductor processing chamber that includes a dielectric material having a substantially disk shape and integrating a lid portion and a gas delivery nozzle portion into a single structure. The chamber lid includes a plurality of gas flow paths that each traverse a region of the chamber lid from an input location at a first surface of the chamber lid to a respective output location on a different surface of the chamber lid and through which etch gases are distributed to particular portions of a processing region of the processing chamber.