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公开(公告)号：US12233441B2
公开(公告)日：2025-02-25
申请号：US17987591
申请日：2022-11-15
Applicant: Applied Materials, Inc.
Inventor： Banqiu Wu , Khalid Makhamreh , Eliyahu Shlomo Dagan
Abstract: A cleaning apparatus for cleaning a substrate wherein the substrate is contacted with ozonated water and irradiating the substrate and the ozonated water with UV electromagnetic radiation from a UV lamp within a cleaning chamber; wherein greater than or equal to about 50% of the UV electromagnetic radiation has a wavelength of greater than or equal to about 280 nm. Methods of cleaning a substrate are also presented.
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公开(公告)号：US12128456B2
公开(公告)日：2024-10-29
申请号：US18133972
申请日：2023-04-12
Applicant: Applied Materials, Inc.
Inventor： Banqiu Wu , Khalid Makhamreh , Eliyahu Shlomo Dagan
CPC classification number: B08B3/123 , B08B13/00 , G01B11/303
Abstract: A method of cleaning a substrate in a megasonic cleaning chamber, comprises: flowing a cleaning fluid through a supply tube in a megasonic cleaning chamber toward a substrate; using a megasonic transducer to generate megasonic waves through the cleaning fluid and create cavities in the cleaning fluid; and using one or more sensors to determine properties of the cavities in-situ based on emissions received from the cavities. A non-transitory computer readable medium has instructions stored thereon that, when executed, causes the method to be performed.
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公开(公告)号：US11803118B2
公开(公告)日：2023-10-31
申请号：US17228451
申请日：2021-04-12
Applicant: Applied Materials, Inc.
Inventor： Banqiu Wu , Khalid Makhamreh , Eliyahu Shlomo Dagan
CPC classification number: G03F1/82 , B08B7/0035 , B08B13/00 , H01J37/3244 , H01J37/32082 , H01J37/3299 , H01J37/32825 , H01J37/32972 , H01J2237/0206 , H01J2237/335
Abstract: Methods and apparatus leverage dielectric barrier discharge (DBD) plasma to treat samples for surface modification prior to photomask application and for photomask cleaning. In some embodiments, a method of treating a surface with AP plasma includes igniting plasma over an ignition plate where the AP plasma is formed by one or more plasma heads of an AP plasma reactor positioned above the ignition plate, monitoring characteristics of the AP plasma with an optical emission spectrometer (OES) sensor to determine if stable AP plasma is obtained and, if so, moving the AP reactor over a central opening of an assistant plate where the central opening contains a sample under treatment and where the assistant plate reduces AP plasma arcing on the sample during treatment. The AP reactor scans back and forth over the central opening of the assistant plate while maintaining stabilized AP plasma to treat the sample.
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公开(公告)号：US11644748B2
公开(公告)日：2023-05-09
申请号：US17226775
申请日：2021-04-09
Applicant: Applied Materials, Inc.
Inventor： Banqiu Wu , Khalid Makhamreh , Eliyahu Shlomo Dagan
CPC classification number: G03F1/82 , G03F7/168 , G03F7/70825 , G03F7/70841 , G03F7/70875
Abstract: Embodiments of baking chambers for baking a photomask are provided herein. In some embodiments, a baking chamber includes: a chamber body enclosing a first interior volume and a second interior volume, disposed beneath and fluidly independent from the first interior volume; a radiant heat source disposed in the first interior volume; a photomask support structure configured to support a photomask disposed in the second interior volume; a window disposed between the first interior volume the second interior volume, wherein the window is made of a material that is transparent to thermal radiation; a first gas inlet and a first gas outlet coupled to the first interior volume; and a second gas inlet and a second gas outlet coupled to the second interior volume on opposite ends thereof to facilitate flow of a process gas laterally through the second interior volume and across the photomask support structure.
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公开(公告)号：US11114350B2
公开(公告)日：2021-09-07
申请号：US16453773
申请日：2019-06-26
Applicant: Applied Materials, Inc.
Inventor： Banqiu Wu , Khalid Makhamreh , Eli Dagan
IPC: H01L21/02 , H01L21/66 , H01L21/311
Abstract: Methods and apparatus for removing a photoresist layer from a photomask substrate are provided. In one example, a method for removing a photoresist layer from a substrate in a chamber includes generating a first plasma including first radicals from a first gas mixture in a processing chamber, exposing a portion of a photoresist layer on a substrate to the first radicals to remove the portion of the photoresist layer from the substrate, generating a second plasma including second radicals from a second gas mixture, wherein the second radicals have a different composition than the first radicals, and exposing another portion of photoresist layer to the second radicals to remove the second portion of the photoresist layer.
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Patent Agency Ranking
公开(公告)号：US12085849B2
公开(公告)日：2024-09-10
申请号：US17229584
申请日：2021-04-13
Applicant: Applied Materials, Inc.
Inventor： Banqiu Wu , Khalid Makhamreh , Eliyahu Shlomo Dagan
CPC classification number: G03F1/82 , B08B7/0078 , H05B3/22
Abstract: Embodiments of baking chambers are provided herein. In some embodiments, a baking chamber for baking a substrate includes: a chamber body enclosing an interior volume; a heater disposed in the interior volume, wherein the heater is configured to have a surface temperature of about 100 to about 400 degrees Celsius during use; a shroud disposed in the interior volume opposite the heater, wherein the shroud includes a central opening fluidly coupled to a gas inlet; a plurality of substrate lift pins configured to support a substrate in the interior volume between the heater and the shroud, wherein the shroud includes a plurality of first openings to facilitate the plurality of substrate lift pins; and a gas outlet disposed in the chamber body opposite the shroud such that a gas flow path through the interior volume extends from the gas inlet, around the heater, and to the gas outlet.
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公开(公告)号：US11921422B2
公开(公告)日：2024-03-05
申请号：US17226762
申请日：2021-04-09
Applicant: Applied Materials, Inc.
Inventor： Banqiu Wu , Khalid Makhamreh , Eliyahu Shlomo Dagan
CPC classification number: G03F1/82 , G03F7/168 , G03F7/70825 , G03F7/70841 , G03F7/70875
Abstract: Embodiments of baking chambers for baking a substrate and methods of use thereof are provided herein. In some embodiments, a multi-chamber process tool for processing a substrate including: a wet clean chamber for cleaning the substrate; and a baking chamber configured to heat the substrate to remove residue or haze left over after a wet clean process performed in the wet clean chamber, the baking chamber comprising: a chamber body enclosing an interior volume; a heater disposed in the interior volume, wherein the heater is configured to have a surface temperature of about 100 to about 400 degrees Celsius during use; a substrate support configured to support a substrate disposed in the interior volume, wherein the substrate support has a direct line of sight with the heater such that the heater heats the substrate support via convection; and a gas inlet and a gas outlet coupled to the interior volume.
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公开(公告)号：US11798799B2
公开(公告)日：2023-10-24
申请号：US17397088
申请日：2021-08-09
Applicant: Applied Materials, Inc.
Inventor： Banqiu Wu , Khalid Makhamreh , Hiroki Ogawa , Eliyahu Shlomo Dagan
CPC classification number: H01L21/02052 , B08B3/10 , B08B7/0057 , B08B2203/005
Abstract: A cleaning apparatus for cleaning a substrate includes a lamp for emitting ultraviolet radiation in an irradiation region; a housing that houses the lamp; a water deflector spaced below the housing, the water deflector having a water inlet for receiving a supply of ozonated water and a water outlet for discharging ozonated water irradiated by the lamp into a substrate processing region beneath the water deflector, and defining a water flow path between the water inlet and the water outlet, the water flow path extending in the irradiation region; an upper reflector extending along and above the lamp; and a lower reflector extending along and below the water deflector, wherein the upper reflector and the lower reflector at least partially define the irradiation region and reflect ultraviolet radiation toward the water flow path, and wherein the lower reflector shields the substrate from ultraviolet radiation emitted by the lamp.
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公开(公告)号：US11654460B2
公开(公告)日：2023-05-23
申请号：US17550903
申请日：2021-12-14
Applicant: Applied Materials, Inc.
Inventor： Banqiu Wu , Khalid Makhamreh , Eliyahu Shlomo Dagan
CPC classification number: B08B3/123 , B08B13/00 , G01B11/303
Abstract: Embodiments of megasonic cleaning chambers are provided herein. In some embodiments, a megasonic cleaning chamber includes: a chamber body defining an interior volume therein; a substrate support to support a substrate disposed in the interior volume; a supply tube comprising a transparent material configured to direct a cleaning fluid to the substrate support; a megasonic power generator coupled to the supply tube to provide megasonic power to the cleaning fluid; a megasonic transducer coupled to the megasonic power generator and the supply tube to create megasonic waves in the cleaning fluid and to form cavities in the cleaning fluid, wherein the megasonic transducer is configured to direct the megasonic waves and cavities toward the substrate support; and one or more sensors configured to generate a signal indicative of a property of the cavities in the cleaning fluid.
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公开(公告)号：US12159782B2
公开(公告)日：2024-12-03
申请号：US18370481
申请日：2023-09-20
Applicant: Applied Materials, Inc.
Inventor： Banqiu Wu , Khalid Makhamreh , Hiroki Ogawa , Eliyahu Shlomo Dagan
Abstract: A cleaning apparatus for cleaning a substrate includes a lamp for emitting ultraviolet radiation in an irradiation region; a housing that houses the lamp; a water deflector spaced below the housing, the water deflector having a water inlet for receiving a supply of ozonated water and a water outlet for discharging ozonated water irradiated by the lamp into a substrate processing region beneath the water deflector, and defining a water flow path between the water inlet and the water outlet, the water flow path extending in the irradiation region; an upper reflector extending along and above the lamp; and a lower reflector extending along and below the water deflector, wherein the upper reflector and the lower reflector at least partially define the irradiation region and reflect ultraviolet radiation toward the water flow path, and wherein the lower reflector shields the substrate from ultraviolet radiation emitted by the lamp.
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