公开(公告)号：US09649592B2

公开(公告)日：2017-05-16

申请号：US14638871

申请日：2015-03-04

Applicant: Applied Materials, Inc.

Inventor： Michael S. Cox ,  Monique McIntosh ,  Colin John Dickinson ,  Paul E. Fisher ,  Yutaka Tanaka ,  Zheng Yuan

IPC: B01D53/32 ,  B01D53/64 ,  B01J19/08

CPC classification number: B01D53/32 ,  B01D53/54 ,  B01D53/64 ,  B01D53/70 ,  B01D53/76 ,  B01D2251/00 ,  B01D2251/10 ,  B01D2251/102 ,  B01D2251/104 ,  B01D2251/108 ,  B01D2251/20 ,  B01D2251/202 ,  B01D2251/204 ,  B01D2251/2062 ,  B01D2251/208 ,  B01D2251/502 ,  B01D2252/103 ,  B01D2257/55 ,  B01D2257/553 ,  B01D2257/556 ,  B01D2257/60 ,  B01D2257/7025 ,  B01D2257/93 ,  B01D2258/0216 ,  B01D2259/818 ,  B01J19/088 ,  B01J2219/0815 ,  B01J2219/0875 ,  B01J2219/0894 ,  H01J37/32091 ,  H01J37/321 ,  H01J37/3244 ,  H01J37/32522 ,  H01J37/32669 ,  H01J2237/002 ,  H01J2237/335 ,  Y02C20/20 ,  Y02C20/30

Abstract: A plasma abatement process for abating effluent containing compounds from a processing chamber is described. A plasma abatement process takes gaseous foreline effluent from a processing chamber, such as a deposition chamber, and reacts the effluent within a plasma chamber placed in the foreline path. The plasma dissociates the compounds within the effluent, converting the effluent into more benign compounds. Abating reagents may assist in the abating of the compounds. The abatement process may be a volatizing or a condensing abatement process. Representative volatilizing abating reagents include, for example, CH4, H2O, H2, NF3, SF6, F2, HCl, HF, Cl2, and HBr. Representative condensing abating reagents include, for example, H2, H2O, O2, N2, O3, CO, CO2, NH3, N2O, CH4, and combinations thereof.

公开(公告)号：US20160276179A1

公开(公告)日：2016-09-22

申请号：US14418411

申请日：2014-12-18

Applicant: Applied Materials, Inc.

Inventor： Paul E. Fisher ,  Monique McIntosh ,  Andrew Herbert ,  Colin John Dickinson

IPC: H01L21/67 ,  B01D53/76 ,  B01D53/34 ,  B01D53/56

CPC classification number: H01L21/67017 ,  B01D53/346 ,  B01D53/56 ,  B01D53/76

Abstract: Embodiments enclosed herein relate to methods and apparatus for reducing nitrogen oxides (NOx) produced during processing, such as during semiconductor fabrication processing. A processing system may include an abatement controller and an effluent abatement system, wherein the abatement controller controls the effluent abatement system to reduce NOx production, while ensuring abatement of the effluent gases from the processing system. The effluent abatement system may include a combustion-type effluent abatement system and/or a plasma-type effluent abatement system. The abatement controller may select operating modes of the effluent abatement systems to reduce NOx production.

Abstract translation: 本文包括的实施例涉及用于还原在加工期间产生的氮氧化物（NOx）的方法和装置，例如在半导体制造处理期间。 处理系统可以包括减排控制器和污水消除系统，其中减排控制器控制污水排放系统以减少NOx产生，同时确保减少来自处理系统的废气。 废水排放系统可以包括燃烧型流出物排放系统和/或等离子体型排出物排放系统。 减排控制器可以选择排污系统的运行模式以减少NOx的产生。

公开(公告)号：US10449486B2

公开(公告)日：2019-10-22

申请号：US15486938

申请日：2017-04-13

Applicant: Applied Materials, Inc.

Inventor： Michael S. Cox ,  Monique McIntosh ,  Colin John Dickinson ,  Paul E. Fisher ,  Yutaka Tanaka ,  Zheng Yuan

IPC: B01D53/32 ,  B01D53/64 ,  B01J19/08 ,  B01D53/54 ,  B01D53/70 ,  B01D53/76 ,  H01J37/32

Abstract: A plasma abatement process for abating effluent containing compounds from a processing chamber is described. A plasma abatement process takes gaseous foreline effluent from a processing chamber, such as a deposition chamber, and reacts the effluent within a plasma chamber placed in the foreline path. The plasma dissociates the compounds within the effluent, converting the effluent into more benign compounds. Abating reagents may assist in the abating of the compounds. The abatement process may be a volatizing or a condensing abatement process. Representative volatilizing abating reagents include, for example, CH4, H2O, H2, NF3, SF6, F2, HCl, HF, Cl2, and HBr. Representative condensing abating reagents include, for example, H2, H2O, O2, N2, O3, CO, CO2, NH3, N2O, CH4, and combinations thereof.

公开(公告)号：US11185815B2

公开(公告)日：2021-11-30

申请号：US16030337

申请日：2018-07-09

Applicant: Applied Materials, Inc.

Inventor： Michael S. Cox ,  Monique McIntosh ,  Colin John Dickinson ,  Paul E. Fisher ,  Yutaka Tanaka ,  Zheng Yuan

IPC: H05H1/24 ,  B01D53/32 ,  B01D53/64 ,  B01D53/70 ,  B01D53/76 ,  B01J19/08 ,  H01J37/32 ,  B01D53/54

Abstract: A plasma abatement process for abating effluent containing compounds from a processing chamber is described. A plasma abatement process takes gaseous foreline effluent from a processing chamber, such as a deposition chamber, and reacts the effluent within a plasma chamber placed in the foreline path. The plasma dissociates the compounds within the effluent, converting the effluent into more benign compounds. Abating reagents may assist in the abating of the compounds. The abatement process may be a volatizing or a condensing abatement process. Representative volatilizing abating reagents include, for example, CH4, H2O, H2, NF3, SF6, F2, HCl, HF, Cl2, and HBr. Representative condensing abating reagents include, for example, H2, H2O, O2, N2, O3, CO, CO2, NH3, N2O, CH4, and combinations thereof.