公开(公告)号：US20150247237A1

公开(公告)日：2015-09-03

申请号：US14594296

申请日：2015-01-12

Applicant: Applied Materials, Inc.

Inventor： Sungwon HA ,  Kwangduk Douglas LEE ,  Ganesh BALASUBRAMANIAN ,  Juan Carlos ROCHA-ALVAREZ ,  Martin Jay SEAMONS ,  Ziqing DUAN ,  Zheng John YE ,  Bok Hoen KIM ,  Lei JING ,  Ngoc LE ,  Ndanka MUKUTI

IPC: C23C16/44 ,  C23C16/455 ,  C23C16/50

CPC classification number: C23C16/45565 ,  C23C16/4401 ,  C23C16/4585 ,  C23C16/5096 ,  H01J37/32091 ,  H01J37/32449

Abstract: Embodiments described herein relate to a faceplate for improving film uniformity. A semiconductor processing apparatus includes a pedestal, an edge ring and a faceplate having distinct regions with differing hole densities. The faceplate has an inner region and an outer region which surrounds the inner region. The inner region has a greater density of holes formed therethrough when compared to the outer region. The inner region is sized to correspond with a substrate being processed while the outer region is sized to correspond with the edge ring.

Abstract translation: 本文所述的实施例涉及一种用于提高膜均匀性的面板。 半导体处理装置包括具有不同孔洞密度区域的基座，边缘环和面板。 面板具有内部区域和围绕内部区域的外部区域。 当与外部区域相比时，内部区域具有通过其形成的更大密度的孔。 内部区域的尺寸被设计成与被处理的基底相对应，而外部区域的尺寸被设计成与边缘环相对应。