公开(公告)号：US20180047599A1

公开(公告)日：2018-02-15

申请号：US15674180

申请日：2017-08-10

Applicant: Applied Materials, Inc.

Inventor： Kang-Lie CHIANG ,  Greg A. BLACKBURN ,  Pallavi ZHANG ,  Michael D. ARMACOST ,  Nitin KHURANA

IPC: H01L21/67 ,  G01R19/165 ,  G01R21/06

CPC classification number: H01L21/67253 ,  G01R19/16576 ,  G01R21/06 ,  H01L21/67069 ,  H01L21/67242 ,  H01L21/67276

Abstract: Embodiments of the present disclosure provide a method, system, and computer program product for monitoring a service life of a chamber component. In one example, the method includes receiving one or more power measurements of a semiconductor processing chamber from one or more sensors positioned about the semiconductor processing chamber. The processor compares the one or more power measurements to one or more threshold values corresponding to the service life of the chamber component. The processor determines whether the one or more power measurements exceed the threshold values. If the processor determines that the one or more power measurements exceed the threshold values, the processor takes remedial measures for the service life of the chamber component.

公开(公告)号：US20190148194A1

公开(公告)日：2019-05-16

申请号：US16240318

申请日：2019-01-04

Applicant: Applied Materials, Inc.

Inventor： Kang-Lie CHIANG ,  Greg A. BLACKBURN ,  Pallavi ZHANG ,  Michael D. ARMACOST ,  Nitin KHURANA

IPC: H01L21/67 ,  G01R19/165 ,  G01R21/06

CPC classification number: H01L21/67253 ,  G01R19/16576 ,  G01R21/06 ,  H01L21/67069 ,  H01L21/67242 ,  H01L21/67276

Abstract: Embodiments of the present disclosure provide a method, system, and computer program product for monitoring a service life of a chamber component. In one example, the method includes receiving one or more power measurements of a semiconductor processing chamber from one or more sensors positioned about the semiconductor processing chamber. The processor compares the one or more power measurements to one or more threshold values corresponding to the service life of the chamber component. The processor determines whether the one or more power measurements exceed the threshold values. If the processor determines that the one or more power measurements exceed the threshold values, the processor takes remedial measures for the service life of the chamber component.

公开(公告)号：US20180330977A1

公开(公告)日：2018-11-15

申请号：US15593502

申请日：2017-05-12

Applicant: Applied Materials, Inc.

Inventor： Chong JIANG ,  Lei JING ,  Mingte LIU ,  Adolph Miller ALLEN ,  Michael W. JOHNSON ,  Pallavi ZHANG ,  Michael D. ARMACOST

IPC: H01L21/683 ,  H01L21/66 ,  H01L21/67 ,  H01L21/02

CPC classification number: H01L21/6833 ,  H01J37/32091 ,  H01J37/32577 ,  H01J37/32697 ,  H01J37/32706 ,  H01J37/32715 ,  H01J37/32935 ,  H01J37/3299

Abstract: Embodiments of the disclosure relate to methods and a system for adjusting the chucking voltage of an electrostatic chuck. In one embodiment, a system for plasma processing a substrate includes a plasma processing chamber, a radio-frequency (RF) matching circuit coupled to the chamber, a sensor and a controller. The chamber includes a chamber body having an inner volume, a bipolar electrostatic chuck disposed in the inner volume and a power supply configured to provide chucking voltage to a pair of electrodes embedded within the electrostatic chuck. When plasma is energized within the chamber by the application of RF power through an RF matching circuit, the sensor is configured to detect a change in an electrical characteristic at the RF matching circuit. The controller is coupled to the power supply and configured to adjust the chucking voltage in response to the change in the electrical characteristic detected by the sensor.

公开(公告)号：US20170343999A1

公开(公告)日：2017-11-30

申请号：US15610280

申请日：2017-05-31

Applicant: Applied Materials, Inc.

Inventor： Jimmy ISKANDAR ,  Michael D. ARMACOST ,  Heng HAO

IPC: G05B23/02 ,  H01L21/67

CPC classification number: G05B23/0291 ,  G05B23/0243

Abstract: Embodiments provide techniques for compressing sensor data collected within a manufacturing environment. One embodiment monitors a plurality of runs of a recipe for fabricating one or more semiconductor devices within a manufacturing environment to collect runtime data from a plurality of sensors within the manufacturing environment. The collected runtime data is compressed by generating, for each of the plurality of sensors and for each of the plurality of runs, a respective representation of the corresponding runtime data that describes a shape of the corresponding runtime data and a magnitude of the corresponding runtime data. A query specifying one or more runtime data attributes is received and executed against the compressed runtime data to generate query results, by comparing the one or more runtime data attributes to at least one of the generated representations of runtime data.

公开(公告)号：US20170045573A1

公开(公告)日：2017-02-16

申请号：US15231487

申请日：2016-08-08

Applicant: Applied Materials, Inc.

Inventor： Jimmy ISKANDAR ,  Chong JIANG ,  Michael D. ARMACOST ,  Bradley D. SCHULZE

IPC: G01R31/26 ,  G06N7/00 ,  G06F17/50 ,  H01L21/66

CPC classification number: G06F17/50 ,  G01R31/2831 ,  G06F17/5068 ,  G06F2217/10 ,  H01L22/12

Abstract: Embodiments presented herein provide techniques for predicting the topography of a product produced from a manufacturing process. One embodiment includes generating a plurality of prediction models. Each of the plurality of prediction models corresponds to a respective one of a plurality of positional coordinates of a product produced from a manufacturing process. The method also includes receiving a set of user-specified input parameters to apply to the manufacturing control process. The method further includes generating a graphical representation of a topography map for the product for the user-specified of input parameters based on the plurality of prediction models.

Abstract translation: 本文提供的实施例提供了用于预测从制造过程产生的产品的形貌的技术。 一个实施例包括生成多个预测模型。 多个预测模型中的每一个对应于从制造过程产生的产品的多个位置坐标中的相应一个。 该方法还包括接收一组用户指定的输入参数以应用于制造控制过程。 该方法还包括基于多个预测模型生成针对用户指定的输入参数的产品的地形图的图形表示。