公开(公告)号：US20200098702A1

公开(公告)日：2020-03-26

申请号：US16533145

申请日：2019-08-06

Applicant: Applied Materials, Inc.

Inventor： Shuran SHENG ,  Lin ZHANG ,  Joseph C. WERNER

IPC: H01L23/00 ,  H01L27/11582 ,  H01L21/02 ,  C23C16/50 ,  C23C14/35 ,  C23C14/10 ,  C23C14/06 ,  C23C16/40 ,  C23C16/34 ,  C23C16/26

Abstract: A method and apparatus for forming a backside coating on a substrate to counteract stresses from a previously deposited film is disclosed. In one embodiment, a method for flattening a bowed substrate includes providing a substrate having a film stack formed on a first major surface thereof, wherein the substrate comprises a bowed orientation, and forming a coating a second major surface of the substrate, wherein the coating is configured to counter stresses produced by the film stack and flattens the substrate from the bowed orientation.

公开(公告)号：US20220113198A1

公开(公告)日：2022-04-14

申请号：US17070803

申请日：2020-10-14

Applicant: Applied Materials, Inc.

Inventor： Shuran SHENG ,  Lin ZHANG ,  Joseph C. WERNER

IPC: G01K3/00 ,  G01K3/10 ,  G03F7/42

Abstract: Embodiments herein provide methods of monitoring temperatures of fluid delivery conduits for delivering fluids to, and other components external to, a processing volume of a processing chamber used in electronic device fabrication manufacturing, and monitoring systems related thereto. In one embodiment, a method includes receiving, at the temperature monitoring system (TMS) controller, information from a first plurality of temperature sensors and a second plurality of temperature sensors, comparing, using the TMS controller, the temperature information to one or more pre-determined control limits, and communicating, using the TMS controller, an out-of-control event to a user. Generally, the temperature monitoring system features the first and second pluralities of temperature sensors, the TMS controller, a first connection module, and a second connection module.

公开(公告)号：US20190221458A1

公开(公告)日：2019-07-18

申请号：US16247026

申请日：2019-01-14

Applicant: Applied Materials, Inc.

Inventor： Xuesong LU ,  Lin ZHANG ,  Joseph C. WERNER ,  Jang Seok OH ,  Balaji PASUPATHY ,  Michael W. JOHNSON

IPC: H01L21/67 ,  H01J37/32 ,  G01K3/10 ,  G01K3/00 ,  C23C16/50 ,  C23C16/455 ,  C23C16/52

CPC classification number: H01L21/67248 ,  C23C16/45544 ,  C23C16/50 ,  C23C16/52 ,  G01K3/005 ,  G01K3/10 ,  H01J37/3244 ,  H01J37/32899 ,  H01J2237/24585 ,  H01J2237/3321 ,  H01L21/67017 ,  H01L21/67167 ,  H01L21/67207

Abstract: Embodiments herein provide methods of monitoring temperatures of fluid delivery conduits for delivering fluids to, and other components external to, a processing volume of a processing chamber used in electronic device fabrication manufacturing, and monitoring systems related thereto. In one embodiment, a method of monitoring a processing system includes receiving, through a data acquisition device, temperature information from one or more temperature sensors and receiving context information from a system controller coupled to a processing system comprising the processing chamber. Here, the one or more temperature sensors are disposed in one or more locations external to a processing volume of a processing chamber. The context information relates to instructions executed by the system controller to control one or more operations of the processing system.

公开(公告)号：US20220344135A1

公开(公告)日：2022-10-27

申请号：US17242059

申请日：2021-04-27

Applicant: Applied Materials, Inc.

Inventor： Shuran SHENG ,  Lin ZHANG ,  Jiyong HUANG ,  Jang Seok OH ,  Joseph C. WERNER ,  Nitin KHURANA ,  Ganesh BALASUBRAMANIAN ,  Jennifer Y. SUN ,  Xinhai HAN ,  Zhijun JIANG

IPC: H01J37/32 ,  B08B7/00 ,  C23C16/44

Abstract: Examples disclosed herein relate to a method and apparatus for cleaning and repairing a substrate support having a heater disposed therein. A method includes (a) cleaning a surface of a substrate support having a bulk layer, the substrate support is disposed in a processing environment configured to process substrates. The cleaning process includes forming a plasma at a high temperature from a cleaning gas mixture having a fluorine containing gas and oxygen. The method includes (b) removing oxygen radicals from the processing environment with a treatment plasma formed from a treatment gas mixture. The treatment gas mixture includes the fluorine containing gas. The method further includes (c) repairing an interface of the substrate support and the bulk layer with a post-treatment plasma. The post-treatment plasma is formed from a post-treatment gas mixture including a nitrogen containing gas. The high temperature is greater than or equal to about 500 degrees Celsius.

公开(公告)号：US20200370174A1

公开(公告)日：2020-11-26

申请号：US16806656

申请日：2020-03-02

Applicant: Applied Materials, Inc.

Inventor： Shuran SHENG ,  Lin ZHANG ,  Jiyong HUANG ,  Joseph C. WERNER ,  Stanley WU ,  Mahesh Adinath KANAWADE ,  Yikai CHEN ,  Yixing LIN ,  Ying MA

IPC: C23C16/44 ,  C01F17/265

Abstract: Embodiments of the present disclosure generally relate to an apparatus and a method for cleaning a processing chamber. In one embodiment, a substrate support cover includes a bulk member coated with a fluoride coating. The substrate support cover is placed on a substrate support disposed in the processing chamber during a cleaning process. The fluoride coating does not react with the cleaning species. The substrate support cover protects the substrate support from reacting with the cleaning species, leading to reduced condensation formed on chamber components, which in turn leads to reduced contamination of the substrate in subsequent processes.