PROCESS CHAMBER SUBSTRATE TRANSFER

    公开(公告)号:US20250085056A1

    公开(公告)日:2025-03-13

    申请号:US18463038

    申请日:2023-09-07

    Abstract: A processing system is provided including a first chamber and a second chamber. The first chamber includes: a chamber body enclosing an interior volume; an edge ring having a top and a bottom, the edge ring including a first ledge extending inwardly from the top and a second ledge extending inwardly relative to the first ledge. The first ledge is configured to support a substrate and the second ledge is configured to support a susceptor. The first chamber further includes a plurality of heating lamps positioned over the edge ring. The second chamber includes: a chamber body enclosing an interior volume; a first cooling plate; one or more robots in the interior volume of the second chamber, the one or more robots having one or more end effectors positioned over the first cooling plate; and a plurality of lift pins extending through the first cooling plate.

    SUPPORT ASSEMBLY FOR SUBSTRATE BACKSIDE DISCOLORATION CONTROL
    3.
    发明申请
    SUPPORT ASSEMBLY FOR SUBSTRATE BACKSIDE DISCOLORATION CONTROL 审中-公开
    支撑组件用于底板背面控制

    公开(公告)号:US20160204005A1

    公开(公告)日:2016-07-14

    申请号:US14973079

    申请日:2015-12-17

    Abstract: A processing chamber for processing a substrate is disclosed herein. In one embodiment, the processing chamber includes a support shaft assembly. The support shaft assembly has a ring shaped susceptor, a disc shaped heat plate, and a support shaft system. The support shaft system supports the susceptor and the heat plate, such that the susceptor is supported above the heat plate defining a gap between the heat plate and the susceptor. In another embodiment, the heat plate includes a plurality of grooves and the susceptor includes a plurality of fins. The fins are configured to sit within the grooves such that the susceptor is supported above the heat plate, defining a gap between the heat plate and the susceptor. In another embodiment, a method of processing a substrate in the aforementioned embodiments is disclosed herein.

    Abstract translation: 本文公开了一种用于处理衬底的处理室。 在一个实施例中,处理室包括支撑轴组件。 支撑轴组件具有环形基座,盘形加热板和支撑轴系统。 支撑轴系支撑基座和加热板,使得基座支撑在加热板上方,限定加热板和基座之间的间隙。 在另一个实施例中,加热板包括多个槽,并且基座包括多个翅片。 翅片构造成位于凹槽内,使得基座支撑在加热板上方,从而限定加热板和基座之间的间隙。 在另一个实施例中,本文公开了上述实施例中的衬底的处理方法。

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