-
公开(公告)号:US20240332388A1
公开(公告)日:2024-10-03
申请号:US18609650
申请日:2024-03-19
Applicant: Applied Materials, Inc.
Inventor: Byeong Chan Lee , Benjamin Colombeau , Nicolas Breil , Ashish Pal , El Mehdi Bazizi , Veeraraghavan S. Basker , Balasubramanian Pranatharthiharan , Pratik B. Vyas , Gregory Costrini
IPC: H01L29/423 , H01L21/8238 , H01L27/092 , H01L29/06 , H01L29/08 , H01L29/66 , H01L29/775 , H01L29/786
CPC classification number: H01L29/42392 , H01L21/823807 , H01L21/823871 , H01L27/092 , H01L29/0665 , H01L29/0847 , H01L29/66439 , H01L29/66545 , H01L29/775 , H01L29/78696
Abstract: One or more embodiments of the disclosure are directed to methods of forming semiconductor devices, e.g., gate-all-around (GAA) transistors that are used in FEOL and/or BEOL processes. The processes described herein may be integrated and performed in any suitable cluster tool. Some embodiments of the disclosure are directed to cavity shaping processes. Further embodiments of the disclosure are directed to logic transistors with wrap-around backside source/drain contact.
-
公开(公告)号:US20240258375A1
公开(公告)日:2024-08-01
申请号:US18160949
申请日:2023-01-27
Applicant: Applied Materials, Inc.
Inventor: Ashish Pal , Pratik B. Vyas , El Mehdi Bazizi , Stephen Weeks , Ludovico Megalini , Siddarth Krishnan
CPC classification number: H01L29/105 , H01L21/046 , H01L29/1608 , H01L29/66068
Abstract: A silicon carbide transistor may be formed with a channel that includes a p-doped region between n-doped source and drain regions. A counter-doped region may be formed at the top of the channel directly underneath the gate oxide. Instead of using the conventional doping levels for the p-doped region, the doping concentration may be increase to be greater than about 1e18 cm3. The transistor may also include pocket regions on one or both sides of the channel. The pocket regions may be formed in the counter-doped region and may extend up to the gate oxide. These improvements individually and/or in combination may increase the current in the channel of the transistor without significantly increasing the threshold voltage beyond acceptable operating limits.
-