公开(公告)号：US20220285193A1

公开(公告)日：2022-09-08

申请号：US17683938

申请日：2022-03-01

Applicant: APPLIED MATERIALS, INC.

Inventor： Srinivas Poshatrahalli Gopalakrishna ,  Paul B. Reuter ,  Devendra Channappa Holeyannavar ,  Douglas B. Baumgarten ,  Sushant S. Koshti ,  Arunkumar Ramachandraiah ,  Narayanan Ramachandran

IPC: H01L21/677 ,  B25J9/16

Abstract: The disclosure describes devices, systems, and methods for integrating load locks into a factory interface footprint space. A factory interface for an electronic device manufacturing system can include a load port for receiving a substrate carrier. The load port can include a frame adapted for connecting the load port to a factory interface, the frame comprising a transport opening through which one or more substrates are capable of being transported between the substrate carrier and the factory interface. The load port can also include an actuator coupled to the frame, and a load port door coupled to the actuator and configured to seal the transport opening. The frame height can be greater than the height of the load port door, and less than 2.5 times the height of the load port door.

公开(公告)号：US12159802B2

公开(公告)日：2024-12-03

申请号：US17683938

申请日：2022-03-01

Applicant: APPLIED MATERIALS, INC.

Inventor： Srinivas Poshatrahalli Gopalakrishna ,  Paul B. Reuter ,  Devendra Channappa Holeyannavar ,  Douglas B. Baumgarten ,  Sushant S. Koshti ,  Arunkumar Ramachandraiah ,  Narayanan Ramachandran

IPC: H01L21/677 ,  B25J9/16

Abstract: The disclosure describes devices, systems, and methods for integrating load locks into a factory interface footprint space. A factory interface for an electronic device manufacturing system can include a load port for receiving a substrate carrier. The load port can include a frame adapted for connecting the load port to a factory interface, the frame comprising a transport opening through which one or more substrates are capable of being transported between the substrate carrier and the factory interface. The load port can also include an actuator coupled to the frame, and a load port door coupled to the actuator and configured to seal the transport opening. The frame height can be greater than the height of the load port door, and less than 2.5 times the height of the load port door.

公开(公告)号：US20250167027A1

公开(公告)日：2025-05-22

申请号：US18517791

申请日：2023-11-22

Applicant: Applied Materials, Inc.

Inventor： Srinivas Poshatrahalli Gopalakrishna ,  Shivaraj Nara Manjunath ,  Devendra Channappa Holeyannavar ,  Paul Reuter ,  Douglas Baumgarten ,  Sushant Koshti ,  Amit Kumar Biswas ,  Nithiyanantham Balasubramaniam ,  Latha Ramesh ,  Navya Talluri

IPC: H01L21/673 ,  G01N19/10 ,  G01N33/00 ,  G06F30/27 ,  H01L21/67

Abstract: A method for monitoring inside parameters of a substrate carrier. The method includes receiving a first substrate carrier, supplying a fluid, at a first flow rate, through an inlet of the first substrate carrier, and at least partially purging the fluid through an outlet of the first substrate carrier for a first period of time. The method further includes measuring, using a first sensor disposed at the outlet, a first value of a first property of an exhaust from the substrate carrier at the outlet of the first substrate carrier, and determining, based at least in part on the first value of the first property, a second value of the first property inside the first substrate carrier.

公开(公告)号：US12142508B2

公开(公告)日：2024-11-12

申请号：US17499109

申请日：2021-10-12

Applicant: APPLIED MATERIALS, INC.

Inventor： Sushant S. Koshti ,  Paul B. Reuter ,  David Phillips ,  Jacob Newman ,  Andrew J. Constant ,  Michael R. Rice ,  Shay Assaf ,  Srinivas Poshatrahalli Gopalakrishna ,  Devendra Channappa Holeyannavar ,  Douglas B. Baumgarten ,  Arunkumar Ramachandraiah ,  Narayanan Ramachandran

IPC: H01L21/677 ,  B65G1/04 ,  H01L21/687

Abstract: A factory interface for an electronic device manufacturing system can include a load lock disposed within the interior volume of a factory interface and a factory interface robot disposed within the interior volume of the factory interface. The factory interface robot can be configured to transfer substrates between a first set of substrate carriers and the first load lock. The factory interface robot can comprise a vertical tower, a plurality of links, and an end effector.

公开(公告)号：US20230113673A1

公开(公告)日：2023-04-13

申请号：US17499109

申请日：2021-10-12

Applicant: APPLIED MATERIALS, INC.

Inventor： Sushant S. Koshti ,  Paul B. Reuter ,  David Phillips ,  Jacob Newman ,  Andrew J. Constant ,  Michael R. Rice ,  Shay Assaf ,  Srinivas Poshatrahalli Gopalakrishna ,  Devendra Channappa Holeyannavar ,  Douglas B. Baumgarten ,  Arunkumar Ramachandraiah ,  Narayanan Ramachandran

IPC: H01L21/677 ,  H01L21/687 ,  B65G1/04

Abstract: A factory interface for an electronic device manufacturing system can include a load lock disposed within the interior volume of a factory interface and a factory interface robot disposed within the interior volume of the factory interface. The factory interface robot can be configured to transfer substrates between a first set of substrate carriers and the first load lock. The factory interface robot can comprise a vertical tower, a plurality of links, and an end effector.