公开(公告)号：US12035574B2

公开(公告)日：2024-07-09

申请号：US18528888

申请日：2023-12-05

申请人： Applied Materials, Inc.

发明人： Jungmin Lee ,  Chung-chia Chen ,  Ji Young Choung ,  Yu-hsin Lin

IPC分类号： H10K59/122 ,  H10K59/12 ,  H10K59/80

CPC分类号： H10K59/122 ,  H10K59/1201 ,  H10K59/80521

摘要： Embodiments described herein relate to a sub-pixel. The sub-pixel includes an anode, overhang structures, separation structures, an organic light emitting diode (OLED) material, and a cathode. The anode is defined by adjacent first pixel isolation structures (PIS) and adjacent second PIS. The overhang structures are disposed on the first PIS. The overhang structures include a second structure disposed over the first structure and an intermediate structure disposed between the second structure and the first structure. A bottom surface of the second structure extends laterally past an upper surface of the first structure. The first structure is disposed over the first PIS. Separation structures are disposed over the second PIS. The OLED material is disposed over the anode and an upper surface of the separation structures. The cathode disposed over the OLED material and an upper surface of the separation structures.

公开(公告)号：US12127441B2

公开(公告)日：2024-10-22

申请号：US18183822

申请日：2023-03-14

申请人： Applied Materials, Inc.

发明人： Yu-hsin Lin ,  Ji Young Choung ,  Chung-chia Chen ,  Jungmin Lee ,  Wen-Hao Wu ,  Takashi Anjiki ,  Takuji Kato ,  Dieter Haas ,  Si Kyoung Kim ,  Stefan Keller

IPC分类号： H10K59/122 ,  H10K50/822 ,  H10K50/844 ,  H10K59/173

CPC分类号： H10K59/122 ,  H10K50/822 ,  H10K50/844 ,  H10K59/173

摘要： Embodiments described herein relate to a device including a substrate, a plurality of adjacent pixel-defining layer (PDL) structures disposed over the substrate, and a plurality of sub-pixels. Each sub-pixel includes adjacent first overhangs, adjacent second overhangs, an anode, a hole injection layer (HIL) material, an additional organic light emitting diode (OLED) material, and a cathode. Each first overhang is defined by a body structure disposed on and extending laterally past a base structure disposed on the PDL structure. Each second overhang is defined by a top structure disposed on and extending laterally past the body structure. The HIL material is disposed over and in contact with the anode and disposed under the adjacent first overhangs. The additional OLED material is disposed on the HIL material and extends under the first overhang.

公开(公告)号：US12035575B2

公开(公告)日：2024-07-09

申请号：US18545709

申请日：2023-12-19

申请人： Applied Materials, Inc.

发明人： Jungmin Lee ,  Chung-chia Chen ,  Ji Young Choung ,  Yu-hsin Lin

IPC分类号： H10K59/122 ,  H10K59/12 ,  H10K59/80

CPC分类号： H10K59/122 ,  H10K59/1201 ,  H10K59/80521

摘要： Embodiments described herein relate to a sub-pixel. The sub-pixel includes an anode, overhang structures, separation structures, an organic light emitting diode (OLED) material, and a cathode. The anode is defined by adjacent first pixel isolation structures (PIS) and adjacent second PIS. The overhang structures are disposed on the first PIS. The overhang structures include a second structure disposed over the first structure and an intermediate structure disposed between the second structure and the first structure. A bottom surface of the second structure extends laterally past an upper surface of the first structure. The first structure is disposed over the first PIS. Separation structures are disposed over the second PIS. The OLED material is disposed over the anode and an upper surface of the separation structures. The cathode disposed over the OLED material and an upper surface of the separation structures.

公开(公告)号：US12041823B2

公开(公告)日：2024-07-16

申请号：US18528906

申请日：2023-12-05

申请人： Applied Materials, Inc.

发明人： Jungmin Lee ,  Chung-chia Chen ,  Ji Young Choung ,  Yu-hsin Lin

IPC分类号： H10K59/122 ,  H10K59/12 ,  H10K59/80

CPC分类号： H10K59/122 ,  H10K59/1201 ,  H10K59/80521

摘要： Embodiments described herein relate to a sub-pixel. The sub-pixel includes an anode, overhang structures, separation structures, an organic light emitting diode (OLED) material, and a cathode. The anode is defined by adjacent first pixel isolation structures (PIS) and adjacent second PIS. The overhang structures are disposed on the first PIS. The overhang structures include a second structure disposed over the first structure and an intermediate structure disposed between the second structure and the first structure. A bottom surface of the second structure extends laterally past an upper surface of the first structure. The first structure is disposed over the first PIS. Separation structures are disposed over the second PIS. The OLED material is disposed over the anode and an upper surface of the separation structures. The cathode disposed over the OLED material and an upper surface of the separation structures.

公开(公告)号：US11690254B2

公开(公告)日：2023-06-27

申请号：US18049825

申请日：2022-10-26

申请人： Applied Materials, Inc.

发明人： Ji Young Choung ,  Dieter Haas ,  Yu-hsin Lin ,  Jungmin Lee ,  Seong Ho Yoo ,  Si Kyoung Kim

IPC分类号： H10K59/122 ,  H10K50/84 ,  H10K50/844 ,  H10K71/00 ,  H10K59/12

CPC分类号： H10K59/122 ,  H10K50/84 ,  H10K50/844 ,  H10K71/00 ,  H10K59/1201

摘要： Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes a plurality of sub-pixels, each sub-pixel of the plurality of sub-pixels defined by adjacent pixel-defining layer (PDL) structures with inorganic overhang structures disposed on the PDL structures, each sub-pixel having an anode, organic light-emitting diode (OLED) material disposed on the anode, and a cathode disposed on the OLED material. The device is made by a process including the steps of: depositing the OLED material and the cathode by evaporation deposition, and depositing an encapsulation layer disposed over the cathode.

公开(公告)号：US12120938B1

公开(公告)日：2024-10-15

申请号：US18390720

申请日：2023-12-20

申请人： Applied Materials, Inc.

发明人： Ji Young Choung ,  Dieter Haas ,  Yu-hsin Lin ,  Jungmin Lee ,  Seong Ho Yoo ,  Si Kyoung Kim

IPC分类号： H10K59/80 ,  H10K59/122 ,  H10K59/173

CPC分类号： H10K59/873 ,  H10K59/122 ,  H10K59/173

摘要： Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes a plurality of sub-pixels, each sub-pixel of the plurality of sub-pixels defined by adjacent pixel-defining layer (PDL) structures with inorganic overhang structures disposed on the PDL structures, each sub-pixel having an anode, organic light-emitting diode (OLED) material disposed on the anode, and a cathode disposed on the OLED material. The device is made by a process including the steps of: depositing the OLED material and the cathode by evaporation deposition, and depositing an encapsulation layer disposed over the cathode.

公开(公告)号：US12120925B2

公开(公告)日：2024-10-15

申请号：US18301805

申请日：2023-04-17

申请人： Applied Materials, Inc.

发明人： Chung-chia Chen ,  Ji Young Choung ,  Dieter Haas ,  Yu-hsin Lin ,  Jungmin Lee ,  Wen-Hao Wu ,  Si Kyoung Kim

IPC分类号： H10K59/122 ,  H10K50/844 ,  H10K71/00 ,  H10K102/00

CPC分类号： H10K59/122 ,  H10K50/844 ,  H10K71/00 ,  H10K2102/00

摘要： Embodiments described herein relate to a device comprising a substrate, a pixel-defining layer (PDL) structures disposed over the substrate and defining sub-pixels of the device, and a plurality overhang structures. Each overhang structure is defined by a top structure extending laterally past a body structure. Each body structure is disposed over an upper surface of each PDL structure. Overhang structures define a plurality of sub-pixels including a first sub-pixel and a second sub-pixel. Each sub-pixel includes an anode, an organic light-emitting diode (OLED) material, a cathode, and an encapsulation layer. The OLED materials are disposed over the first anode and extends under the overhang structures. The cathodes are disposed over the OLED materials and under the overhang structures. The encapsulation layers are disposed over the first cathode. The first encapsulation layer has a first thickness and the second encapsulation layer has a second thickness different from the first thickness.

公开(公告)号：US11882709B2

公开(公告)日：2024-01-23

申请号：US18315362

申请日：2023-05-10

申请人： Applied Materials, Inc.

发明人： Jungmin Lee ,  Chung-chia Chen ,  Ji Young Choung ,  Yu-hsin Lin

IPC分类号： H10K59/122 ,  H10K59/12 ,  H10K59/80

CPC分类号： H10K59/122 ,  H10K59/1201 ,  H10K59/80521

摘要： Embodiments described herein relate to a sub-pixel. The sub-pixel includes an anode, overhang structures, separation structures, an organic light emitting diode (OLED) material, and a cathode. The anode is defined by adjacent first pixel isolation structures (PIS) and adjacent second PIS. The overhang structures are disposed on the first PIS. The overhang structures include a second structure disposed over the first structure and an intermediate structure disposed between the second structure and the first structure. A bottom surface of the second structure extends laterally past an upper surface of the first structure. The first structure is disposed over the first PIS. Separation structures are disposed over the second PIS. The OLED material is disposed over the anode and an upper surface of the separation structures. The cathode disposed over the OLED material and an upper surface of the separation structures.