公开(公告)号：US12127441B2

公开(公告)日：2024-10-22

申请号：US18183822

申请日：2023-03-14

Applicant: Applied Materials, Inc.

Inventor： Yu-hsin Lin ,  Ji Young Choung ,  Chung-chia Chen ,  Jungmin Lee ,  Wen-Hao Wu ,  Takashi Anjiki ,  Takuji Kato ,  Dieter Haas ,  Si Kyoung Kim ,  Stefan Keller

IPC: H10K59/122 ,  H10K50/822 ,  H10K50/844 ,  H10K59/173

CPC classification number: H10K59/122 ,  H10K50/822 ,  H10K50/844 ,  H10K59/173

Abstract: Embodiments described herein relate to a device including a substrate, a plurality of adjacent pixel-defining layer (PDL) structures disposed over the substrate, and a plurality of sub-pixels. Each sub-pixel includes adjacent first overhangs, adjacent second overhangs, an anode, a hole injection layer (HIL) material, an additional organic light emitting diode (OLED) material, and a cathode. Each first overhang is defined by a body structure disposed on and extending laterally past a base structure disposed on the PDL structure. Each second overhang is defined by a top structure disposed on and extending laterally past the body structure. The HIL material is disposed over and in contact with the anode and disposed under the adjacent first overhangs. The additional OLED material is disposed on the HIL material and extends under the first overhang.

公开(公告)号：US11610954B1

公开(公告)日：2023-03-21

申请号：US17744364

申请日：2022-05-13

Applicant: Applied Materials, Inc.

Inventor： Yu-Hsin Lin ,  Ji-Young Choung ,  Chung-Chia Chen ,  Jungmin Lee ,  Wen-Hao Wu ,  Takashi Anjiki ,  Takuji Kato ,  Dieter Haas ,  Si Kyoung Kim ,  Stefan Keller

IPC: H01L27/32 ,  H01L51/52

Abstract: Embodiments described herein relate to a device including a substrate, a plurality of adjacent pixel-defining layer (PDL) structures disposed over the substrate, and a plurality of sub-pixels. Each sub-pixel includes adjacent first overhangs, adjacent second overhangs, an anode, a hole injection layer (HIL) material, an additional organic light emitting diode (OLED) material, and a cathode. Each first overhang is defined by a body structure disposed over and extending laterally past a base structure disposed over the PDL structure. Each second overhang is defined by a top structure disposed over and extending laterally past the body structure. The HIL material is disposed over and in contact with the anode and disposed under the adjacent first overhangs. The additional OLED material is disposed over the HIL material and extends under the first overhang.

公开(公告)号：US10546732B2

公开(公告)日：2020-01-28

申请号：US15033868

申请日：2013-11-05

Applicant: Applied Materials, Inc.

Inventor： Stefan Keller ,  Uwe Schüβler ,  Dieter Haas ,  Stefan Bangert

IPC: H01J37/34 ,  C23C14/35 ,  H01J37/32

Abstract: A sputter deposition source for sputter deposition in a vacuum chamber is described. The source includes a wall portion of the vacuum chamber; a target providing a material to be deposited during the sputter deposition; an RF power supply for providing RF power to the target; a power connector for connecting the target with the RF power supply; and a conductor rod extending through the wall portion from inside of the vacuum chamber to outside of the vacuum chamber, wherein the conductor rod is connected to one or more components inside of the vacuum chamber and wherein the conductor rod is connected to the RF power supply outside of the vacuum chamber to generate a defined RF return path through the conductor rod.

公开(公告)号：US11713506B2

公开(公告)日：2023-08-01

申请号：US16180800

申请日：2018-11-05

Applicant: Applied Materials, Inc.

Inventor： Stefan Keller ,  Uwe Schüssler ,  Jose Manuel Dieguez-Campo ,  Stefan Bangert ,  Byung-Sung Kwak

IPC: C23C16/448 ,  C23C14/24 ,  H01M4/38 ,  C23C14/54 ,  C23C14/14 ,  C23C16/06 ,  C23C16/455 ,  C23C16/52

CPC classification number: C23C16/4485 ,  C23C14/14 ,  C23C14/246 ,  C23C14/543 ,  C23C16/06 ,  C23C16/4557 ,  C23C16/45519 ,  C23C16/45561 ,  C23C16/45565 ,  C23C16/52 ,  H01M4/381

Abstract: A depositing arrangement for evaporation of a material is disclosed herein. The depositing arrangement has an alkali metal or alkaline earth metal for deposition of the material on a substrate. The deposition arrangement has a first chamber configured for liquefying the material; a valve being in fluid communication with the first chamber, and being downstream of the first chamber, wherein the valve is configured for control of the flow rate of the liquefied material through the valve. The deposition arrangement has an evaporation zone being in fluid communication with the valve, and being downstream of the valve, wherein the evaporation zone is configured for vaporizing the liquefied material; a heating unit to heat the material to higher temperatures before providing the liquid material in the evaporation zone; and one or more outlets for directing the vaporized material towards the substrate.

公开(公告)号：US11673170B2

公开(公告)日：2023-06-13

申请号：US16318052

申请日：2017-04-28

Applicant: Applied Materials, Inc.

Inventor： Jose Manuel Dieguez-Campo ,  Stefan Keller ,  Jae Won Lee ,  Takashi Anjiki ,  Dieter Haas

IPC: B08B7/04 ,  B08B3/08 ,  B08B7/00 ,  B08B9/08 ,  C23C14/12 ,  C23C14/24 ,  C23C14/56 ,  H01L51/00 ,  H01L51/56

CPC classification number: B08B7/04 ,  B08B3/08 ,  B08B7/0035 ,  B08B9/08 ,  C23C14/12 ,  C23C14/24 ,  C23C14/566 ,  H01L51/001 ,  H01L51/0011 ,  H01L51/56 ,  B08B2209/08

Abstract: The present disclosure provides a method for cleaning a vacuum system used in the manufacture of OLED devices. The method includes performing pre-cleaning for cleaning at least a portion of the vacuum system, and performing plasma cleaning using a remote plasma source.