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公开(公告)号：US08560298B2
公开(公告)日：2013-10-15
申请号：US12255372
申请日：2008-10-21
IPC分类号： G06F17/28
CPC分类号： G06F17/2827 , G06F17/2223 , G06F17/278
摘要： A document in a first language and an additional document in a second language may be reviewed. It may be determined if the additional document is sufficiently similar to the document. If the additional document is determined sufficiently similar to the document, a named entity in the document may be selected. The method may search for a similar named entity by comparing the named entity to a word in the additional document and determining if the named entity and word are sufficiently similar. If a similar word to the named entity is located, the named entity and the similar named entities may be stored as name entity transliterations.
摘要翻译： 可以审查第一语言的文档和第二语言的附加文档。 可以确定附加文档是否足够类似于文档。 如果附加文档被确定为与文档足够相似，则可以选择文档中的命名实体。 该方法可以通过将命名实体与附加文档中的单词进行比较来确定命名实体和单词是否足够相似来搜索类似的命名实体。 如果找到与命名实体类似的单词，则命名实体和类似的命名实体可以存储为名称实体音译。
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2.发明授权Underfilling process in a molded matrix array package using flow front modifying solder resist 失效使用流动前修饰阻焊剂的模压矩阵阵列封装中的底部填充工艺公开(公告)号：US07151014B2
公开(公告)日：2006-12-19
申请号：US10774155
申请日：2004-02-05
IPC分类号： H01L23/31
CPC分类号： H01L21/563 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00014 , H05K3/3452 , H01L2924/00 , H01L2224/0401
摘要： Placing a flow modifier on a package substrate to create two flow fronts on a molded matrix array package. A flow modifier may be laid on a package substrate to a height that blocks off the bottom of other substrates (e.g., dice) coupled to the package substrate. By separating the top flow front and the bottom flow front, this process prevents the top flow front from wrapping around the sides of the substrates and trapping air below each substrate and in front of the bottom flow front.
摘要翻译： 将流动调节器放置在封装衬底上，以在模制的矩阵阵列封装上创建两个流动前沿。 流动改性剂可以铺设在封装衬底上，以阻止耦合到封装衬底的其它衬底（例如，裸片）的底部的高度。 通过分离顶部流动前部和底部流动前部，该过程防止顶部流动前部围绕基底的侧面包裹并且在每个基底之下并在底部流动前部的前方捕获空气。
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公开(公告)号：US20100185670A1
公开(公告)日：2010-07-22
申请号：US12350981
申请日：2009-01-09
CPC分类号： G06F17/30669 , G06F17/2223 , G06F17/30666
摘要： An approach is described for using a query expressed in a source language to retrieve information expressed in a target language. The approach uses a translation dictionary to convert terms in the query from the source language to appropriate terms in the target language. The approach determines viable transliterations for out-of-vocabulary (OOV) query terms by retrieving a body of information based on an in-vocabulary component of the query, and then mining the body of information to identify the viable transliterations for the OOV query terms. The approach then adds the viable transliterations to the translation dictionary. The retrieval, mining, and adding operations can be repeated one or more or times.
摘要翻译： 描述了使用以源语言表示的查询来检索以目标语言表达的信息的方法。 该方法使用翻译字典将查询中的术语从源语言转换为目标语言的适当术语。 该方法通过基于查询的词汇组成部分检索一组信息，然后挖掘信息主体来识别OOV查询词语的可行音译，从而确定词汇（OOV）查询词语的可行音译 。 然后，该方法将可行的音译添加到翻译字典中。 检索，挖掘和添加操作可以重复一次或多次。
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公开(公告)号：US08332205B2
公开(公告)日：2012-12-11
申请号：US12350981
申请日：2009-01-09
CPC分类号： G06F17/30669 , G06F17/2223 , G06F17/30666
摘要： An approach is described for using a query expressed in a source language to retrieve information expressed in a target language. The approach uses a translation dictionary to convert terms in the query from the source language to appropriate terms in the target language. The approach determines viable transliterations for out-of-vocabulary (OOV) query terms by retrieving a body of information based on an in-vocabulary component of the query, and then mining the body of information to identify the viable transliterations for the OOV query terms. The approach then adds the viable transliterations to the translation dictionary. The retrieval, mining, and adding operations can be repeated one or more or times.
摘要翻译： 描述了使用以源语言表示的查询来检索以目标语言表达的信息的方法。 该方法使用翻译字典将查询中的术语从源语言转换为目标语言的适当术语。 该方法通过基于查询的词汇组成部分检索一组信息，然后挖掘信息主体来识别OOV查询词语的可行音译，从而确定词汇量（OOV）查询词语的可行音译 。 然后，该方法将可行的音译添加到翻译字典中。 检索，挖掘和添加操作可以重复一次或多次。
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5.发明授权Underfilling process in a molded matrix array package using flow front modifying solder resist 有权使用流动前修饰阻焊剂的模压矩阵阵列封装中的底部填充工艺公开(公告)号：US07339276B2
公开(公告)日：2008-03-04
申请号：US10287318
申请日：2002-11-04
CPC分类号： H01L21/563 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00014 , H05K3/3452 , H01L2924/00 , H01L2224/0401
摘要： Placing a flow modifier on a package substrate to create two flow fronts on a molded matrix array package. A flow modifier may be laid on a package substrate to a height that blocks off the bottom of other substrates (e.g., dice) coupled to the package substrate. By separating the top flow front and the bottom flow front, this process prevents the top flow front from wrapping around the sides of the substrates and trapping air below each substrate and in front of the bottom flow front.
摘要翻译： 将流动调节器放置在封装衬底上，以在模制的矩阵阵列封装上创建两个流动前沿。 流动改性剂可以铺设在封装衬底上，以阻止耦合到封装衬底的其它衬底（例如，裸片）的底部的高度。 通过分离顶部流动前部和底部流动前部，该过程防止顶部流动前部围绕基底的侧面包裹并且在每个基底之下并在底部流动前部的前方捕获空气。
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