公开(公告)号：US5489880A

公开(公告)日：1996-02-06

申请号：US238504

申请日：1994-05-05

Applicant: Arvind Swarup

Inventor： Arvind Swarup

IPC: H03H7/48 ,  H01P5/12

CPC classification number: H03H7/48

Abstract: A power divider has a microstripline circuit with bandpass filters at each output that are lumped element printed bandpass filters. The filters widen the isolation bandwidth of the divider. Power dividers can be reversed for use as power combiners.

Abstract translation: 功率分配器具有微带电路，每个输出端具有带通滤波器，是集总元件印刷的带通滤波器。 滤波器扩大分频器的隔离带宽。 功率分配器可以反向使用作为功率组合器。

公开(公告)号：US20150180110A1

公开(公告)日：2015-06-25

申请号：US14571846

申请日：2014-12-16

Applicant: Arvind Swarup ,  David Davitt

Inventor： Arvind Swarup ,  David Davitt

IPC: H01P5/08 ,  H03H7/38 ,  H01P11/00

CPC classification number: H01P5/08 ,  H01P5/028 ,  H01P11/00 ,  H03H7/38 ,  Y10T29/49004

Abstract: A transmission line circuit assembly has a substrate layer having a transmission line trace, further having a functional portion and a transitional portion. An enclosure of the assembly houses the transitional portion of the transmission line trace. A first surface of a dielectric plug is conductively coupled to an inner top surface of the enclosure. A second surface of the plug is aligned and spaced apart from the transitional portion of the transmission line trace to define a gap therebetween. An interfacing portion of a connecting pin is housed within the enclosure and bonded to the transitional portion. A connecting portion of the pin is connectable to an external conductor. The gap may be filled with a dielectric material. The transitional portion, dielectric plug, dielectric filler and connecting pin form an electromagnetic transition providing tuning and matching of the function portion with the external conductor.

Abstract translation: 传输线电路组件具有具有传输线迹线的衬底层，还具有功能部分和过渡部分。 组件的外壳容纳传输线迹线的过渡部分。 电介质塞的第一表面导电地耦合到外壳的内顶表面。 插头的第二表面与传输线迹线的过渡部分对准并间隔开，以限定它们之间的间隙。 连接销的接口部分容纳在外壳内并结合到过渡部分。 销的连接部分可连接到外部导体。 间隙可以用电介质材料填充。 过渡部分，电介质插塞，介质填充物和连接销形成电磁过渡，提供功能部分与外部导体的调谐和匹配。

公开(公告)号：US06170154B2

公开(公告)日：2001-01-09

申请号：US09285555

申请日：1999-04-02

Applicant: Arvind Swarup

Inventor： Arvind Swarup

IPC: H05K336

CPC classification number: H01P3/085 ,  H01P3/088 ,  H01P5/18 ,  H03H7/0123 ,  H03H7/42 ,  H05K1/0237 ,  H05K1/0298 ,  H05K1/162 ,  H05K1/165 ,  H05K2201/0715 ,  H05K2201/09236 ,  Y10T29/49126

Abstract: A novel circuit packaging structure including a combination of printed lumped elements within a multi-layer stripline architecture is provided and methods of making the same. The lumped elements are provided by printing the individual passive elements, including interdigital capacitors and spiral inductors, onto the supporting substrate and then embedding these elements into the multi-layer stripline structure. The stripline structure consists of a signal layer sandwiched between at least two ground layers separated by two dielectric substrates of equal thickness. This ground-signal-ground approach confines the electromagnetic fields within the multi-layer structure, thereby minimizing radiation from coupling to nearby components. This approach offers a unique combination of stripline technology and printed lumped elements resulting in miniaturized radio frequency and microwave circuits at operating at frequencies well below 1 GHz, up to several GHz.

Abstract translation: 提供了一种包括多层带状线结构内的印刷集总元件的组合的新型电路封装结构及其制造方法。 通过将各个无源元件（包括叉指电容器和螺旋电感器）打印到支撑衬底上，然后将这些元件嵌入到多层带状线结构中来提供集总元件。 带状线结构由夹在由两个相等厚度的介电基片隔开的至少两个接地层之间的信号层组成。 这种接地信号地面方法将电磁场限制在多层结构内，从而使耦合到附近部件的辐射最小化。 这种方法提供了带状线技术和印刷集总元件的独特组合，从而使得在远低于1 GHz，高达几GHz的频率下工作的小型化射频和微波电路。

公开(公告)号：US5929729A

公开(公告)日：1999-07-27

申请号：US957295

申请日：1997-10-24

Applicant: Arvind Swarup

Inventor： Arvind Swarup

IPC: H01P3/08 ,  H01P5/18 ,  H03H7/01 ,  H03H7/42 ,  H05K1/00 ,  H05K1/02 ,  H05K1/16 ,  H01F5/00 ,  H03H7/00

CPC classification number: H01P3/085 ,  H01P3/088 ,  H01P5/18 ,  H03H7/0123 ,  H03H7/42 ,  H05K1/162 ,  H05K1/165 ,  H05K1/0237 ,  H05K1/0298 ,  H05K2201/0715 ,  H05K2201/09236 ,  Y10T29/49126

Abstract: A novel circuit packaging structure including a combination of printed lumped elements within a multi-layer stripline architecture is provided and methods of making the same. The lumped elements are provided by printing the individual passive elements, including interdigital capacitors and spiral inductors, onto the supporting substrate and then embedding these elements into the multi-layer stripline structure. The stripline structure consists of a signal layer sandwiched between at least two ground layers separated by two dielectric substrates of equal thickness. This ground-signal-ground approach confines the electromagnetic fields within the multi-layer structure, thereby minimizing radiation from coupling to nearby components. This approach offers a unique combination of stripline technology and printed lumped elements resulting in miniaturized radio frequency and microwave circuits at operating at frequencies well below 1 GHz, up to several GHz.

Abstract translation: 提供了一种包括多层带状线结构内的印刷集总元件的组合的新型电路封装结构及其制造方法。 通过将各个无源元件（包括叉指电容器和螺旋电感器）打印到支撑衬底上，然后将这些元件嵌入到多层带状线结构中来提供集总元件。 带状线结构由夹在由两个相等厚度的介电基片隔开的至少两个接地层之间的信号层组成。 这种接地信号地面方法将电磁场限制在多层结构内，从而使耦合到附近部件的辐射最小化。 这种方法提供了带状线技术和印刷集总元件的独特组合，从而使得在远低于1 GHz，高达几GHz的频率下工作的小型化射频和微波电路。