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1.发明授权Semiconductor device property extraction, generation, visualization, and monitoring methods 有权半导体器件属性提取，生成，可视化和监控方法公开(公告)号：US08611639B2
公开(公告)日：2013-12-17
申请号：US11830485
申请日：2007-07-30
申请人： Ashok Kulkarni , Chien-Huei (Adam) Chen , Cecelia Campochiaro , Richard Wallingford , Yong Zhang , Brian Duffy
发明人： Ashok Kulkarni , Chien-Huei (Adam) Chen , Cecelia Campochiaro , Richard Wallingford , Yong Zhang , Brian Duffy
IPC分类号： G06K9/00
CPC分类号： G01N21/9501
摘要： Various methods, carrier media, and systems for monitoring a characteristic of a specimen are provided. One computer-implemented method for monitoring a characteristic of a specimen includes determining a property of individual pixels on the specimen using output generated by inspecting the specimen with an inspection system. The method also includes determining a characteristic of individual regions on the specimen using the properties of the individual pixels in the individual regions. The method further includes monitoring the characteristic of the specimen based on the characteristics of the individual regions.
摘要翻译： 提供了各种方法，载体介质和用于监测试样特征的系统。 一种用于监测样本特征的计算机实现方法包括使用通过用检查系统检查样本产生的输出来确定样本上的各个像素的特性。 该方法还包括使用各个区域中的各个像素的特性来确定样本上的各个区域的特征。 该方法还包括基于各个区域的特征来监测样本的特性。
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2.发明申请SEMICONDUCTOR DEVICE PROPERTY EXTRACTION, GENERATION, VISUALIZATION, AND MONITORING METHODS 有权半导体器件属性提取，生成，可视化和监控方法公开(公告)号：US20090037134A1
公开(公告)日：2009-02-05
申请号：US11830485
申请日：2007-07-30
申请人： Ashok Kulkarni , Chien-Huei (Adam) Chen , Cecelia Campochiaro , Richard Wallingford , Yong Zhang , Brian Duffy
发明人： Ashok Kulkarni , Chien-Huei (Adam) Chen , Cecelia Campochiaro , Richard Wallingford , Yong Zhang , Brian Duffy
IPC分类号： G06F15/00
CPC分类号： G01N21/9501
摘要： Various methods, carrier media, and systems for monitoring a characteristic of a specimen are provided. One computer-implemented method for monitoring a characteristic of a specimen includes determining a property of individual pixels on the specimen using output generated by inspecting the specimen with an inspection system. The method also includes determining a characteristic of individual regions on the specimen using the properties of the individual pixels in the individual regions. The method further includes monitoring the characteristic of the specimen based on the characteristics of the individual regions.
摘要翻译： 提供了各种方法，载体介质和用于监测试样特征的系统。 一种用于监测样本特征的计算机实现方法包括使用通过用检查系统检查样本产生的输出来确定样本上的各个像素的特性。 该方法还包括使用各个区域中的各个像素的特性来确定样本上的各个区域的特征。 该方法还包括基于各个区域的特征来监测样本的特性。
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公开(公告)号：US09053390B2
公开(公告)日：2015-06-09
申请号：US13585115
申请日：2012-08-14
申请人： Mohan Mahadevan , Govind Thattaisundaram , Ajay Gupta , Chien-Huei (Adam) Chen , Jason Kirkwood , Ashok Kulkarni , Songnian Rong , Ernesto Escorcia , Eugene Shifrin
发明人： Mohan Mahadevan , Govind Thattaisundaram , Ajay Gupta , Chien-Huei (Adam) Chen , Jason Kirkwood , Ashok Kulkarni , Songnian Rong , Ernesto Escorcia , Eugene Shifrin
CPC分类号： G06K9/6254 , G06T7/0004 , G06T2207/30148
摘要： Methods and systems for determining inspection scenarios without input from a user are presented. Inspection scenarios include at least one acquisition mode, defect detection parameter values, and classification parameter values. In one example, a number of defect events are determined by a hot inspection of a wafer surface. The defect events are classified and attributes associated with each defect event are identified. The defect events are labeled with this information. Based on the identified attributes and classification, inspection scenarios are determined. The inspection scenarios are solutions in a mathematical space formed by the identified attributes. In some examples, a plurality of inspection scenarios are determined and a desired inspection scenario is selected from the plurality based on the number of defects of interest and the number of nuisance events captured by the selected inspection scenario.
摘要翻译： 提出了用于确定用户无需输入的检测情景的方法和系统。 检查场景包括至少一个采集模式，缺陷检测参数值和分类参数值。 在一个示例中，通过晶片表面的热检查来确定多个缺陷事件。 对缺陷事件进行分类，并识别与每个缺陷事件相关的属性。 缺陷事件用此信息标记。 根据确定的属性和分类，确定检验情况。 检查方案是由所识别的属性形成的数学空间中的解决方案。 在一些示例中，确定多个检查情景，并且基于感兴趣的缺陷的数量和由所选择的检查情景捕获的滋扰事件的数量，从多个中选择期望的检查情景。
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4.发明授权Methods for identifying array areas in dies formed on a wafer and methods for setting up such methods 有权用于识别在晶片上形成的模具中的阵列区域的方法和用于设置这种方法的方法公开(公告)号：US07925072B2
公开(公告)日：2011-04-12
申请号：US11683696
申请日：2007-03-08
申请人： Chien-Huei (Adam) Chen , Ajay Gupta , Richard Wallingford , Kaustubh (Kaust) Namjoshi , Mike Van Riet , Michael Cook
发明人： Chien-Huei (Adam) Chen , Ajay Gupta , Richard Wallingford , Kaustubh (Kaust) Namjoshi , Mike Van Riet , Michael Cook
IPC分类号： G06K9/00
CPC分类号： G06T7/001 , G06T2207/30148
摘要： Methods for identifying array areas in dies formed on a wafer and methods for setting up such methods are provided. One method for identifying array areas in dies formed on a wafer includes comparing an array pattern in a template image acquired in one of the array areas to a search area image acquired for the wafer. The method also includes determining areas in the search area image in which a pattern is formed that substantially matches the array pattern in the template image based on results of the comparing step. In addition, the method includes identifying the array areas in the dies formed on the wafer based on results of the determining step.
摘要翻译： 提供了用于识别在晶片上形成的模具中的阵列区域的方法以及用于设置这种方法的方法。 用于识别在晶片上形成的管芯中的阵列区域的一种方法包括将在一个阵列区域中获取的模板图像中的阵列图案与为晶片获取的搜索区域图像进行比较。 该方法还包括基于比较步骤的结果来确定在其中形成图案的搜索区域图像中的与模板图像中的阵列图案基本一致的区域。 此外，该方法包括基于确定步骤的结果识别在晶片上形成的管芯中的阵列区域。
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公开(公告)号：US20140050389A1
公开(公告)日：2014-02-20
申请号：US13585115
申请日：2012-08-14
申请人： Mohan Mahadevan , Govind Thattaisundaram , Ajay Gupta , Chien-Huei (Adam) Chen , Jason Kirkwood , Ashok Kulkarni , Songnian Rong , Ernesto Escorcia , Eugene Shifrin
发明人： Mohan Mahadevan , Govind Thattaisundaram , Ajay Gupta , Chien-Huei (Adam) Chen , Jason Kirkwood , Ashok Kulkarni , Songnian Rong , Ernesto Escorcia , Eugene Shifrin
IPC分类号： G06K9/62
CPC分类号： G06K9/6254 , G06T7/0004 , G06T2207/30148
摘要： Methods and systems for determining inspection scenarios without input from a user are presented. Inspection scenarios include at least one acquisition mode, defect detection parameter values, and classification parameter values. In one example, a number of defect events are determined by a hot inspection of a wafer surface. The defect events are classified and attributes associated with each defect event are identified. The defect events are labeled with this information. Based on the identified attributes and classification, inspection scenarios are determined. The inspection scenarios are solutions in a mathematical space formed by the identified attributes. In some examples, a plurality of inspection scenarios are determined and a desired inspection scenario is selected from the plurality based on the number of defects of interest and the number of nuisance events captured by the selected inspection scenario.
摘要翻译： 提出了用于确定用户无需输入的检测情景的方法和系统。 检查场景包括至少一个采集模式，缺陷检测参数值和分类参数值。 在一个示例中，通过晶片表面的热检查来确定多个缺陷事件。 对缺陷事件进行分类，并识别与每个缺陷事件相关的属性。 缺陷事件用此信息标记。 根据确定的属性和分类，确定检验情况。 检查方案是由所识别的属性形成的数学空间中的解决方案。 在一些示例中，确定多个检查情景，并且基于感兴趣的缺陷的数量和由所选择的检查情景捕获的滋扰事件的数量，从多个中选择期望的检查情景。
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6.发明授权Computer-implemented methods, carrier media, and systems for creating a defect sample for use in selecting one or more parameters of an inspection recipe 有权计算机实现的方法，载体介质和用于创建用于选择检验配方的一个或多个参数的缺陷样品的系统公开(公告)号：US08135204B1
公开(公告)日：2012-03-13
申请号：US11859342
申请日：2007-09-21
申请人： Chien-Huei (Adam) Chen , Barry Becker , Hong Chen , Michael Van Riet , Chris Maher , Stephanie Chen , Suryanarayana Tummala , Yong Zhang
发明人： Chien-Huei (Adam) Chen , Barry Becker , Hong Chen , Michael Van Riet , Chris Maher , Stephanie Chen , Suryanarayana Tummala , Yong Zhang
IPC分类号： G06K9/00
CPC分类号： G01N21/9501 , G01N21/956 , G01N2021/95676
摘要： Computer-implemented methods, carrier media, and systems for creating a defect sample for use in selecting one or more parameters of an inspection recipe are provided. One method includes separating defects into bins based on regions in which the defects are located, defect types, and values of the defects for parameter(s) of a detection algorithm. The method also includes determining a number of the defects to be selected from each bin by distributing a user-specified target number of defects across the bins. In addition, the method includes selecting defects from the bins based on the determined numbers thereby creating a defect sample for use in selecting values of parameter(s) of the detection algorithm for use in the inspection recipe.
摘要翻译： 提供了计算机实现的方法，载体介质和用于创建用于选择检查配方的一个或多个参数的缺陷样本的系统。 一种方法包括基于缺陷所在的区域，缺陷类型和检测算法的参数缺陷值将缺陷分离成箱体。 该方法还包括通过在用户区间分配用户指定的目标数量的缺陷来确定要从每个仓库中选择的缺陷的数量。 此外，该方法包括基于确定的数量从箱中选择缺陷，从而创建用于选择用于检查配方的检测算法的参数的值的缺陷样本。
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7.发明申请METHODS FOR ACCURATE IDENTIFICATION OF AN EDGE OF A CARE AREA FOR AN ARRAY AREA FORMED ON A WAFER AND METHODS FOR BINNING DEFECTS DETECTED IN AN ARRAY AREA FORMED ON A WAFER 有权用于精确识别形成在水平面上的阵列区域的边缘边缘的方法以及在形成于WAFER上的阵列区域中检测出的缺陷的方法公开(公告)号：US20110142327A1
公开(公告)日：2011-06-16
申请号：US13032577
申请日：2011-02-22
IPC分类号： G06K9/00
CPC分类号： G06T7/001 , G06T7/11 , G06T7/187 , G06T2207/10056 , G06T2207/30148
摘要： Methods for identifying an edge of a care area for an array area formed on a wafer and/or for binning defects detected in the array area are provided. One method for identifying an edge of a care area for an array area formed on a wafer includes determining a value for a difference image as a function of position from a position known to be inside the array area to a position known to be outside of the array area. The method also includes identifying the position that is located closest to the inside of the array area and that has the value greater than a threshold as a position of the edge of the care area.
摘要翻译： 提供了用于识别在晶片上形成的阵列区域的护理区域的边缘和/或用于合并在阵列区域中检测到的缺陷的方法。 用于识别形成在晶片上的阵列区域的护理区域的边缘的一种方法包括从已知在阵列区域内的位置到已知在阵列区域外的位置确定作为位置的函数的差异图像的值 阵列区域。 该方法还包括识别位于最靠近阵列区域内部并且具有大于阈值的值作为护理区域的边缘的位置的位置。
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8.发明授权Methods for accurate identification of an edge of a care area for an array area formed on a wafer and methods for binning defects detected in an array area formed on a wafer 有权用于精确识别形成在晶片上的阵列区域的护理区域的边缘的方法以及在形成在晶片上的阵列区域中检测到的合并缺陷的方法公开(公告)号：US07894659B2
公开(公告)日：2011-02-22
申请号：US11680152
申请日：2007-02-28
IPC分类号： G06K9/00
CPC分类号： G06T7/001 , G06T7/11 , G06T7/187 , G06T2207/10056 , G06T2207/30148
摘要： Methods for identifying an edge of a care area for an array area formed on a wafer and/or for binning defects detected in the array area are provided. One method for identifying an edge of a care area for an array area formed on a wafer includes determining a value for a difference image as a function of position from a position known to be inside the array area to a position known to be outside of the array area. The method also includes identifying the position that is located closest to the inside of the array area and that has the value greater than a threshold as a position of the edge of the care area.
摘要翻译： 提供了用于识别在晶片上形成的阵列区域的护理区域的边缘和/或用于合并在阵列区域中检测到的缺陷的方法。 用于识别形成在晶片上的阵列区域的护理区域的边缘的一种方法包括从已知在阵列区域内的位置到已知在阵列区域外的位置确定作为位置的函数的差异图像的值 阵列区域。 该方法还包括识别位于最靠近阵列区域内部并且具有大于阈值的值作为护理区域的边缘的位置的位置。
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9.发明授权Methods for accurate identification of an edge of a care area for an array area formed on a wafer and methods for binning defects detected in an array area formed on a wafer 有权用于精确识别形成在晶片上的阵列区域的护理区域的边缘的方法以及在形成在晶片上的阵列区域中检测到的合并缺陷的方法公开(公告)号：US08213705B2
公开(公告)日：2012-07-03
申请号：US13032577
申请日：2011-02-22
IPC分类号： G06K9/62
CPC分类号： G06T7/001 , G06T7/11 , G06T7/187 , G06T2207/10056 , G06T2207/30148
摘要： Methods for identifying an edge of a care area for an array area formed on a wafer and/or for binning defects detected in the array area are provided. One method for identifying an edge of a care area for an array area formed on a wafer includes determining a value for a difference image as a function of position from a position known to be inside the array area to a position known to be outside of the array area. The method also includes identifying the position that is located closest to the inside of the array area and that has the value greater than a threshold as a position of the edge of the care area.
摘要翻译： 提供了用于识别在晶片上形成的阵列区域的护理区域的边缘和/或用于合并在阵列区域中检测到的缺陷的方法。 用于识别形成在晶片上的阵列区域的护理区域的边缘的一种方法包括从已知在阵列区域内的位置到已知在阵列区域外的位置确定作为位置的函数的差异图像的值 阵列区域。 该方法还包括识别位于最靠近阵列区域内部并且具有大于阈值的值作为护理区域的边缘的位置的位置。
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10.发明授权Methods and systems for determining a defect criticality index for defects on wafers 有权用于确定晶片缺陷的缺陷临界指数的方法和系统公开(公告)号：US08139844B2
公开(公告)日：2012-03-20
申请号：US12102343
申请日：2008-04-14
IPC分类号： G06K9/00
CPC分类号： G01R31/318511 , G06T7/0004 , G06T2207/30148
摘要： Various methods and systems for determining a defect criticality index (DCI) for defects on wafers are provided. One computer-implemented method includes determining critical area information for a portion of a design for a wafer surrounding a defect detected on the wafer by an inspection system based on a location of the defect reported by the inspection system and a size of the defect reported by the inspection system. The method also includes determining a DCI for the defect based on the critical area information, a location of the defect with respect to the critical area information, and the reported size of the defect.
摘要翻译： 提供了用于确定晶片缺陷的缺陷关键指数（DCI）的各种方法和系统。 一种计算机实现的方法包括：基于由检查系统报告的缺陷的位置以及由检测系统报告的缺陷的大小，通过检查系统确定围绕在晶片上检测到的缺陷的晶片的一部分设计的临界区域信息 检查系统。 该方法还包括基于关键区域信息，缺陷相对于关键区域信息的位置以及报告的缺陷大小来确定缺陷的DCI。
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