-
公开(公告)号：US11523517B2
公开(公告)日：2022-12-06
申请号：US17038244
申请日：2020-09-30
发明人： Ying-Qiu Zheng , Chao Peng , Xian-Qin Hu
IPC分类号： H05K1/00 , H05K3/00 , H05K3/28 , H05K3/42 , H05K3/46 , G03F7/20 , G03F7/32 , H05K3/24 , H05K3/06 , H05K3/40 , H05K1/09
摘要： A method for manufacturing a circuit board with narrow conductive traces and narrow spaces between traces includes a base layer and two first wiring layers disposed on opposite surfaces of the base layer. Each first wiring layer includes a first bottom wiring and a first electroplated copper wiring. The first bottom wiring is formed on the base layer. The first bottom wiring includes a first end facing the base layer, a second end opposite to the first end, and a first sidewall connecting the first end and the second end. The first electroplated copper wiring covers the second end and the first sidewall of the first bottom wiring.
-
公开(公告)号：US12063750B2
公开(公告)日：2024-08-13
申请号：US17979150
申请日：2022-11-02
发明人： Ying-Qiu Zheng , Chao Peng , Xian-Qin Hu
IPC分类号： H05K1/02 , H05K1/05 , H05K1/09 , H05K3/06 , H05K3/24 , H05K3/28 , H05K3/38 , H05K3/40 , H05K3/46
CPC分类号： H05K3/246 , H05K1/095 , H05K3/067 , H05K3/4069 , H05K3/4664 , H05K3/28 , H05K2201/0347 , H05K2201/0379 , H05K2203/0514 , H05K2203/0723
摘要： A method for manufacturing a circuit board with narrow conductive traces and narrow spaces between traces includes a base layer and two first wiring layers disposed on opposite surfaces of the base layer. Each first wiring layer includes a first bottom wiring and a first electroplated copper wiring. The first bottom wiring is formed on the base layer. The first bottom wiring includes a first end facing the base layer, a second end opposite to the first end, and a first sidewall connecting the first end and the second end. The first electroplated copper wiring covers the second end and the first sidewall of the first bottom wiring.
-
搜索结果
2 条记录 (耗时 0.019 秒)
