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公开(公告)号：US11523517B2
公开(公告)日：2022-12-06
申请号：US17038244
申请日：2020-09-30
发明人： Ying-Qiu Zheng , Chao Peng , Xian-Qin Hu
IPC分类号： H05K1/00 , H05K3/00 , H05K3/28 , H05K3/42 , H05K3/46 , G03F7/20 , G03F7/32 , H05K3/24 , H05K3/06 , H05K3/40 , H05K1/09
摘要： A method for manufacturing a circuit board with narrow conductive traces and narrow spaces between traces includes a base layer and two first wiring layers disposed on opposite surfaces of the base layer. Each first wiring layer includes a first bottom wiring and a first electroplated copper wiring. The first bottom wiring is formed on the base layer. The first bottom wiring includes a first end facing the base layer, a second end opposite to the first end, and a first sidewall connecting the first end and the second end. The first electroplated copper wiring covers the second end and the first sidewall of the first bottom wiring.
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公开(公告)号：US11197368B1
公开(公告)日：2021-12-07
申请号：US17029355
申请日：2020-09-23
发明人： Fu-Yun Shen , Xian-Qin Hu
IPC分类号： H05K1/00 , H05K1/02 , H05K1/09 , H05K1/14 , H05K3/06 , H05K3/28 , H05K3/40 , H05K3/46 , H01P5/103
摘要： A circuit board with reduced dielectric losses enabling the movement of high frequency signals includes an inner circuit board and two outer circuit boards. The inner circuit board includes a first conductor layer and a first substrate layer. The first conductor layer includes a signal line and two ground lines on both sides of the signal line. The first substrate layer covers a side of the first conductor layer and defines first through holes which expose the signal line. Each outer circuit board includes a second substrate layer and a second conductor layer. The second substrate layer abuts the inner circuit board and defines second through holes which are not aligned with the first through holes, partially surrounding the signal line with air which has a very low dielectric constant. A method for manufacturing the high-frequency circuit board is also disclosed.
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公开(公告)号：US11700685B2
公开(公告)日：2023-07-11
申请号：US17512901
申请日：2021-10-28
发明人： Fu-Yun Shen , Xian-Qin Hu
CPC分类号： H05K1/024 , H05K1/0219 , H05K3/4602 , H05K3/4655 , H05K2201/0723 , H05K2201/09063
摘要： A circuit board with reduced dielectric losses enabling the movement of high frequency signals includes an inner circuit board and two outer circuit boards. The inner circuit board includes a first conductor layer and a first substrate layer. The first conductor layer includes a signal line and two ground lines on both sides of the signal line. The first substrate layer covers a side of the first conductor layer and defines first through holes which expose the signal line. Each outer circuit board includes a second substrate layer and a second conductor layer. The second substrate layer abuts the inner circuit board and defines second through holes which are not aligned with the first through holes, partially surrounding the signal line with air which has a very low dielectric constant. A method for manufacturing the high-frequency circuit board is also disclosed.
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公开(公告)号：US11212922B2
公开(公告)日：2021-12-28
申请号：US16767870
申请日：2019-04-23
发明人： Ming-Jaan Ho , Xian-Qin Hu , Fu-Yun Shen , Hsiao-Ting Hsu , Yong-Chao Wei
摘要： The disclosure provides a method for manufacturing a circuit board, which includes: (1) providing a substrate, forming a through hole in the substrate; (2) filling the through hole with a conductor to form a conductive hole; (3) providing a peelable film to cover the substrate; (4) forming a groove by laser, the groove including a concave portion; (5) performing a surface treatment on a wall of the groove; (6) removing the peelable film; (7) forming a seed layer; (8) making a circuit layer to obtain a circuit board unit, the circuit layer including a connection pad, the connection pad shaped as a conductive protrusion which surrounds and is electrically connected to the conductor; (9) repeating step (1) to step (8) at least once; and (10) laminating the circuit board units. The disclosure also provides a circuit board.
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公开(公告)号：US11979977B2
公开(公告)日：2024-05-07
申请号：US16978842
申请日：2019-08-31
发明人： Hsiao-Ting Hsu , Tao-Ming Liao , Ming-Jaan Ho , Xian-Qin Hu , Fu-Yun Shen
CPC分类号： H05K1/0207 , H05K1/0206 , H05K3/423 , H05K3/4641 , H05K1/0203 , H05K1/0272 , H05K1/11 , H05K1/14
摘要： A method for manufacturing a circuit board including: providing at least one wiring base board, the wiring base board comprising a first conductor layer, an insulation layer, and an alloy layer which are stacked in order, wherein a solder paste layer is formed on a side of the alloy layer, a part of the alloy layer is exposed out of the solder paste layer to form a thermal conductive surface; providing a core layer; and pressing two wiring base boards on two opposite sides of the core layer to form a sealed heat dissipating chamber between the thermal conductive surfaces of the two wiring base boards. The present disclosure further provides a circuit board having a heat dissipation structure.
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公开(公告)号：US11665833B2
公开(公告)日：2023-05-30
申请号：US17527320
申请日：2021-11-16
发明人： Ming-Jaan Ho , Xian-Qin Hu , Fu-Yun Shen , Hsiao-Ting Hsu , Yong-Chao Wei
CPC分类号： H05K3/4644 , H05K1/111 , H05K3/04 , H05K3/107 , H05K3/4614 , H05K2201/0394 , H05K2201/09563
摘要： A circuit board includes at least two circuit board units stacked together. Each circuit board unit includes a substrate and a circuit layer. The substrate defines a conductive hole penetrating therethrough. The conductive hole provided with a conductor therein. One side of the substrate further defines a groove, the groove including a concave portion aligned with the conductive hole. The circuit layer includes a connection pad located in the concave portion. The connection pad is shaped as a conductive protrusion, which surrounds and is electrically connected to the conductor. The circuit layer is located in the groove, and the conductive hole is electrically connecting the circuit layers of the circuit board units.
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公开(公告)号：US11417890B2
公开(公告)日：2022-08-16
申请号：US16699966
申请日：2019-12-02
发明人： Xian-Qin Hu , Hsiao-Ting Hsu
IPC分类号： H01M4/66 , H01M4/139 , H01M10/0585 , H01M10/0525 , H01M4/74
摘要： A flexible battery assembly includes a positive plate, a first filling film, a separator, a second filling film, and a negative plate stacked in order. The positive plate includes a first insulating layer, spaced first current collectors, and a positive electrode active layer. The negative plate includes a second insulating layer, spaced second current collectors, and a negative electrode active layer. Each first current collector corresponds to one second current collector. The first filling film comprises first openings each corresponding to one first current collector, and the first current collectors are embedded in the first openings. The second filling film comprises second openings each corresponding to one second current collector, and the second current collectors are embedded in the second openings. An electrolyte is sealed in the first openings and the second openings. A method for manufacturing such flexible battery assembly is also disclosed.
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公开(公告)号：US12063750B2
公开(公告)日：2024-08-13
申请号：US17979150
申请日：2022-11-02
发明人： Ying-Qiu Zheng , Chao Peng , Xian-Qin Hu
IPC分类号： H05K1/02 , H05K1/05 , H05K1/09 , H05K3/06 , H05K3/24 , H05K3/28 , H05K3/38 , H05K3/40 , H05K3/46
CPC分类号： H05K3/246 , H05K1/095 , H05K3/067 , H05K3/4069 , H05K3/4664 , H05K3/28 , H05K2201/0347 , H05K2201/0379 , H05K2203/0514 , H05K2203/0723
摘要： A method for manufacturing a circuit board with narrow conductive traces and narrow spaces between traces includes a base layer and two first wiring layers disposed on opposite surfaces of the base layer. Each first wiring layer includes a first bottom wiring and a first electroplated copper wiring. The first bottom wiring is formed on the base layer. The first bottom wiring includes a first end facing the base layer, a second end opposite to the first end, and a first sidewall connecting the first end and the second end. The first electroplated copper wiring covers the second end and the first sidewall of the first bottom wiring.
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公开(公告)号：US11264701B1
公开(公告)日：2022-03-01
申请号：US17027936
申请日：2020-09-22
发明人： Zi-Qiang Gao , Chih-Wen Cheng , Ke He , Xian-Qin Hu
摘要： A method for manufacturing an antenna printed circuit board includes the following steps: providing a flexible-rigid printed circuit board comprising a flexible region and a rigid region. The flexible region comprises at least one first connecting pad and at least one second connecting pad arranged opposite sides of the rigid region. At least one antenna module is attached to the first connecting pad through a conductive paste. The antenna module is fixed on the rigid region by a first reflow soldering process. At least one radio frequency integrated circuit structure is attached to the second connecting pad through a conductive paste. The radio frequency integrated circuit is fixed on the rigid region by a second reflow soldering process. A gap between the antenna module and the rigid region and a gap between the radio frequency integrated circuit structure and the rigid region are filled with dielectric materials and cured.
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公开(公告)号：US10660218B2
公开(公告)日：2020-05-19
申请号：US15957875
申请日：2018-04-19
申请人： HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. , Avary Holding (Shenzhen) Co., Limited.
发明人： Xian-Qin Hu , Li-Kun Liu , Yan-Lu Li , Ming-Jaan Ho
IPC分类号： H05K3/46 , H05K3/00 , H05K3/42 , H01L23/498 , H05K1/18 , H01L21/48 , H05K1/11 , H05K3/28 , H05K3/06
摘要： A multilayer circuit board comprises an inner circuit unit having at least one solder portion, and at least one outer circuit board coupled with the inner circuit unit. The inner circuit unit connects with the outer circuit board by an insulation colloid. At least one side of the inner circuit unit does not extend to edges of the multilayer circuit board. The at least one outer circuit board forms at least one through-hole and at least one conductive hole. The at least one conductive hole which is internally-plated with copper extends from the at least one outer circuit board to the inner circuit unit. A method of manufacturing the multilayer circuit board is also disclosed.
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