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66 条记录 (耗时 0.021 秒)

    Two-piece slit valve insert for vacuum processing system
    1.
    发明授权
    Two-piece slit valve insert for vacuum processing system 失效
    两片式真空处理系统的狭缝阀插件

    公开(公告)号：US6045620A

    公开(公告)日：2000-04-04

    申请号：US893813

    申请日：1997-07-11

    申请人： Avi Tepman ,  Robert B. Lowrance

    发明人： Avi Tepman ,  Robert B. Lowrance

    IPC分类号： H01L21/302 ,  F16K27/00 ,  H01L21/00 ,  H01L21/205 ,  H01L21/3065 ,  C23C16/00

    CPC分类号： H01L21/67126 ,  Y10S414/139 ,  Y10T29/49716

    摘要： A vacuum processing system has a transfer chamber with a slit valve at which is attached a process chamber and with a slit valve insert disposed in the slit valve for matching up with the process chamber. The slit valve may be made of two pieces, an outer portion that slides into the transfer chamber's slit valve opening from the outside of the transfer chamber, and an inner portion that slides into the outer portion from the inside of the transfer chamber. The portions of the insert permit any process chamber to be attached to any slit valve opening. The outer portion may not be removed from the slit valve opening when a process chamber is attached to the transfer chamber, but the inner portion may be easily removed for servicing regardless of in whether a process chamber is attached.

    摘要翻译： 真空处理系统具有带有狭缝阀的传送室，在该传送室上安装有处理室和设置在狭缝阀中的狭缝阀插入件，用于与处理室匹配。 狭缝阀可以由两片制成，外部从转印室的外侧滑入转印室的狭缝阀开口，以及从转印室的内部滑入外部的内部。 插入部分允许任何处理室连接到任何狭缝阀开口。 当处理室附接到传送室时，外部可能不从狭缝阀开口移除，但是无论是否附着处理室，内部可以容易地移除用于维修。

    Method and apparatus for printing using a facetted drum
    3.
    发明授权
    Method and apparatus for printing using a facetted drum 有权
    使用刻面滚筒打印的方法和装置

    公开(公告)号：US08632145B2

    公开(公告)日：2014-01-21

    申请号：US13175826

    申请日：2011-07-02

    申请人： Conor Francis Madigan ,  Eliyahu Vronsky ,  Alexander Sou-Kang Ko ,  Robert B. Lowrance ,  Christopher Buchner

    发明人： Conor Francis Madigan ,  Eliyahu Vronsky ,  Alexander Sou-Kang Ko ,  Robert B. Lowrance ,  Christopher Buchner

    IPC分类号： B41J29/38

    CPC分类号： B41J2/0057

    摘要： The disclosure generally relates to a method and apparatus for printing from a rotating source. In an exemplary embodiment, the disclosure relates to a facetted drum for simultaneously printing multiple pixels. The facetted drum includes a support structure and a plurality of printheads affixed to the support structure, each printhead having at least one microporous structure for receiving a first quantity of liquid ink having dissolved or suspended film material in a carrier fluid and dispensing a second quantity of ink material substantially free of the carrier fluid. The plurality of printheads are positioned proximal to a substrate to simultaneously print a plurality of spatially-discrete and image-resolved pixels on the substrate.

    摘要翻译： 本公开总体上涉及一种用于从旋转源打印的方法和装置。 在示例性实施例中，本公开涉及用于同时打印多个像素的刻面滚筒。 所述多面体滚筒包括支撑结构和固定到所述支撑结构的多个打印头，每个打印头具有至少一个微孔结构，用于接收在载体流体中具有溶解或悬浮的薄膜材料的第一量的液体油墨并且分配第二量 油墨基本上不含载体流体。 多个打印头位于基板的近侧，以在基板上同时打印多个空间离散和图像分辨的像素。

    Systems and methods for transferring small lot size substrate carriers between processing tools
    4.
    发明授权
    Systems and methods for transferring small lot size substrate carriers between processing tools 有权
    在处理工具之间传送小批量衬底载体的系统和方法

    公开(公告)号：US07711445B2

    公开(公告)日：2010-05-04

    申请号：US11555252

    申请日：2006-10-31

    申请人： Michael R. Rice ,  Eric A. Englhardt ,  Vinay Shah ,  Martin R. Elliott ,  Robert B. Lowrance ,  Jeffrey C. Hudgens

    发明人： Michael R. Rice ,  Eric A. Englhardt ,  Vinay Shah ,  Martin R. Elliott ,  Robert B. Lowrance ,  Jeffrey C. Hudgens

    IPC分类号： G06F19/00

    CPC分类号： H01L21/67727 ,  H01L21/67276 ,  H01L21/67769 ,  H01L21/67778 ,  Y02P80/40 ,  Y02P90/86

    摘要： In a first aspect, a method of managing work in progress within a small lot size semiconductor device manufacturing facility is provided. The first method includes providing a small lot size semiconductor device manufacturing facility having (1) a plurality of processing tools; and (2) a high speed transport system adapted to transport small lot size substrate carriers among the processing tools. The method further includes maintaining a predetermined work in progress level within the small lot size semiconductor device manufacturing facility by (1) increasing an average cycle time of low priority substrates within the small lot size semiconductor device manufacturing facility; and (2) decreasing an average cycle time of high priority substrates within the small lot size semiconductor device manufacturing facility so as to approximately maintain the predetermined work in progress level within the small lot size semiconductor device manufacturing facility. Numerous other aspects are provided.

    摘要翻译： 在第一方面，提供了一种在小批量半导体器件制造设施内管理正在进行的工作的方法。 第一种方法包括提供具有（1）多个处理工具的小批量半导体器件制造设备; 和（2）适于在处理工具之间运输小批量衬底载体的高速运输系统。 该方法还包括：（1）增加小批量半导体器件制造设备内的低优先级衬底的平均周期时间，使小批量半导体器件制造设备内的预定工作保持在进行中; 和（2）减小小批量半导体器件制造设备内的高优先级衬底的平均周期时间，以便在小批量半导体器件制造设备内大致维持预定工作进行中的水平。 提供了许多其他方面。

    Multiple independent robot assembly and apparatus for processing and transferring semiconductor wafers
    9.
    发明授权
    Multiple independent robot assembly and apparatus for processing and transferring semiconductor wafers 失效
    用于处理和转移半导体晶片的多个独立的机器人组件和设备

    公开(公告)号：US06799939B2

    公开(公告)日：2004-10-05

    申请号：US10378864

    申请日：2003-03-05

    申请人： Robert B. Lowrance ,  Howard Grunes

    发明人： Robert B. Lowrance ,  Howard Grunes

    IPC分类号： B66F1100

    CPC分类号： H01L21/67742 ,  H01L21/68707 ,  H01L21/68742 ,  Y10S414/135

    摘要： A robot assembly including multiple independently operable robot assemblies are provided for use in semiconductor wafer processing. The robot assembly includes independent co-axial upper and lower robot assemblies adapted to handle multiple objects. The upper robot is stacked above the lower robot and the two robots are mounted concentrically to allow fast wafer transfer. Concentric drive mechanisms may also be provided for imparting rotary motion to either rotate the robot assembly or extend an extendable arm assembly into an adjacent chamber. Each robot can be either a single blade robot or a dual blade robot. Also provided is an apparatus for processing semiconductor wafers comprising a pre/post process transfer chamber housing multiple independent robot assemblies and surrounded by a plurality of pre-process chambers and post process chambers. Within each process, pre-process and post-process chamber is an apparatus for holding a plurality of stacked wafers. The apparatus includes a wafer lifting and storing apparatus exhibiting a plurality of vertically movable lift pins surrounding the chamber pedestal. The lift pins are configured to receive and hold a plurality of stacked wafers, preferably two, therein.

    摘要翻译： 提供了包括多个可独立操作的机器人组件的机器人组件，用于半导体晶片处理。 机器人组件包括适于处理多个物体的独立的同轴上下机器人组件。 上部机器人堆叠在下部机器人的上方，两个机器人同心安装以允许快速的晶片传送。 也可以提供同心驱动机构用于赋予旋转运动以旋转机器人组件或将可伸展臂组件延伸到相邻的腔室中。 每个机器人可以是单刀片机器人或双刀片机器人。 还提供了一种用于处理半导体晶片的装置，其包括容纳多个独立机器人组件并被多个预处理室和后处理室包围的前/后处理转移室。 在每个过程中，预处理室和后处理室是用于保持多个堆叠的晶片的装置。 该装置包括晶片提升和存储装置，其显示围绕室底座的多个可垂直移动的提升销。 提升销被配置为在其中接收和保持多个堆叠的晶片，优选地两个。

    Multiple independent robot assembly and apparatus for processing and transferring semiconductor wafers
    10.
    发明授权
    Multiple independent robot assembly and apparatus for processing and transferring semiconductor wafers 失效

    公开(公告)号：US6102164A

    公开(公告)日：2000-08-15

    申请号：US608237

    申请日：1996-02-28

    申请人： William McClintock ,  Robert B. Lowrance ,  Howard Grunes

    发明人： William McClintock ,  Robert B. Lowrance ,  Howard Grunes

    IPC分类号： B25J9/06 ,  B25J18/02 ,  B65G49/07 ,  H01L21/677 ,  H01L21/687 ,  B65G35/00

    CPC分类号： H01L21/67742 ,  H01L21/68707 ,  H01L21/68742 ,  Y10S414/135

    摘要： A robot assembly including multiple independently operable robot assemblies are provided for use in semiconductor wafer processing. The robot assembly includes independent co-axial upper and lower robot assemblies adapted to handle multiple objects. The upper robot is stacked above the lower robot and the two robots are mounted concentrically to allow fast wafer transfer. Concentric drive mechanisms may also be provided for imparting rotary motion to either rotate the robot assembly or extend an extendable arm assembly into an adjacent chamber. Each robot can be either a single blade robot or a dual blade robot. Also provided is an apparatus for processing semiconductor wafers comprising a pre/post process transfer chamber housing multiple independent robot assemblies and surrounded by a plurality of pre-process chambers and post process chambers. Within each process, pre-process and post-process chamber is an apparatus for holding a plurality of stacked wafers. The apparatus includes a wafer lifting and storing apparatus exhibiting a plurality of vertically movable lift pins surrounding the chamber pedestal. The lift pins are configured to receive and hold a plurality of stacked wafers, preferably two, therein.