公开(公告)号：US3867217A

公开(公告)日：1975-02-18

申请号：US41061973

申请日：1973-10-29

Applicant: BELL TELEPHONE LABOR INC

Inventor： MAGGS CHARLES ,  WEICK WALTER WERNER

IPC: B23K26/18 ,  H01L49/02 ,  H05K1/03 ,  H05K3/02 ,  C23F1/02

CPC classification number: H05K3/027 ,  B23K26/18 ,  H01L49/02 ,  H05K1/0306 ,  H05K2201/0317 ,  H05K2203/025 ,  H05K2203/0361

Abstract: In a technique for forming thin-film circuits by laser machining, the gold conductor layer is first covered with a copper protective layer. After machining, the laser-machined gaps are cleaned by a fluid stream containing abrasive particles, during which operation the protective layer shields the gold conductors. Thereafter, the protective layer is removed by selective etching.

Abstract translation: 在通过激光加工形成薄膜电路的技术中，金导体层首先被铜保护层覆盖。 加工后，激光加工的间隙由含有磨料颗粒的流体流清洁，在此期间保护层屏蔽金导体。 此后，通过选择性蚀刻除去保护层。