-
公开(公告)号：US20230343895A1
公开(公告)日：2023-10-26
申请号：US18019823
申请日：2022-02-10
发明人： Pengjun CAO , Pei LI , Jinpeng LI , Jian LI , Teng ZHANG , Kangle CHANG , Zhaohui LI , Zhifu YANG
CPC分类号： H01L33/24 , H01L27/156 , H01L33/46 , H01L33/505 , H01L33/54 , H01L33/62
摘要： A light emitting substrate, comprising a base substrate, a retaining wall disposed on the base substrate, and a plurality of light emitting diodes. The retaining wall defines a plurality of partitions on the base substrate, and at least one light emitting diode is provided in at least one partition.
-
2.发明公开公开(公告)号：US20240304762A1
公开(公告)日：2024-09-12
申请号：US18026332
申请日：2022-04-26
发明人： Yutian CHU , Sha FENG , Zhijun XIONG , Yuanda LU , Liang SUN , Zhaohui LI , Enkai DONG , Jiacheng QI , Jinpeng LI , Qiqi ZHOU , Le WANG
CPC分类号： H01L33/46 , H01L33/62 , H01L2933/0025 , H01L2933/0066
摘要： Provided are a light-emitting chip, a light-emitting substrate, a display device, and a manufacturing method for a light-emitting substrate. The light-emitting chip includes: a substrate; a light-emitting structure, the light-emitting structure disposed on a side of the substrate; a reflective layer disposed on a side, facing away from the substrate, of the light-emitting structure; at least two sub-light-emitting auxiliary bonding layers disposed on a side, facing away from the light-emitting structure, of the reflective layer; and a raised portion, disposed on a side, facing away from the light-emitting structure, of the reflective layer, an orthographic projection of the raised portion on the substrate and an orthographic projection of the sub-light-emitting auxiliary bonding layers on the substrate do not overlap with each other, and a thickness of the raised portion is smaller than a thickness of each of the at least two sub-light-emitting auxiliary bonding layers.
-
3.发明公开公开(公告)号：US20240282900A1
公开(公告)日：2024-08-22
申请号：US18649385
申请日：2024-04-29
发明人： Shubai ZHANG , Lingyun SHI , Wei ZHANG , Longtao HUANG , Zhaohui LI , Zhifu YANG , Hao CHENG
CPC分类号： H01L33/62 , G06T7/0004 , H01L33/58 , G06T2207/30121 , G06T2207/30152 , H01L2933/0066
摘要： A circuit substrate includes a base substrate, traces, a protective layer, and an electronic device. The traces are provided on the base substrate. The protective layer is provided on the traces, and has openings each exposing a portion of a trace, the portion serving as a conductive pattern. The electronic device includes a chip and multiple bumps provided on the chip. The conductive pattern is connected to at least one of the bumps on the chip. The conductive pattern includes a first portion and a second portion connected to each other. An orthographic projection of the chip on the base substrate covers an orthographic projection of the first portion on the base substrate, and is non-overlapping with an orthographic projection of the second portion on the base substrate. The total area of conductive patterns connected to the chip is less than an area of the chip.
-
-
搜索结果
3 条记录 (耗时 0.029 秒)
