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1.发明公开公开(公告)号：US20240282900A1
公开(公告)日：2024-08-22
申请号：US18649385
申请日：2024-04-29
发明人： Shubai ZHANG , Lingyun SHI , Wei ZHANG , Longtao HUANG , Zhaohui LI , Zhifu YANG , Hao CHENG
CPC分类号： H01L33/62 , G06T7/0004 , H01L33/58 , G06T2207/30121 , G06T2207/30152 , H01L2933/0066
摘要： A circuit substrate includes a base substrate, traces, a protective layer, and an electronic device. The traces are provided on the base substrate. The protective layer is provided on the traces, and has openings each exposing a portion of a trace, the portion serving as a conductive pattern. The electronic device includes a chip and multiple bumps provided on the chip. The conductive pattern is connected to at least one of the bumps on the chip. The conductive pattern includes a first portion and a second portion connected to each other. An orthographic projection of the chip on the base substrate covers an orthographic projection of the first portion on the base substrate, and is non-overlapping with an orthographic projection of the second portion on the base substrate. The total area of conductive patterns connected to the chip is less than an area of the chip.
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2.发明公开公开(公告)号：US20240145645A1
公开(公告)日：2024-05-02
申请号：US18573590
申请日：2022-09-26
发明人： Jinpeng LI , Ming ZHAI , Zhifu YANG , Shubai ZHANG , Teng ZHANG , Jian LI , Heling ZHU , Pei QIN
IPC分类号： H01L33/54 , H01L25/075 , H01L33/56
CPC分类号： H01L33/54 , H01L25/0753 , H01L33/56
摘要： The present disclosure provides an encapsulating structure, a display substrate and a manufacturing method therefor, and a display apparatus. The encapsulating structure is used for encapsulating components, and includes: a first encapsulating layer configured to cover the components; and a second encapsulating layer stacked with the first encapsulating layer; the second encapsulating layer is located on the side of the first encapsulating layer away from the components, a surface of the second encapsulating layer facing the first encapsulating layer is in contact with a surface of the first encapsulating layer facing the second encapsulating layer, and a surface of the second encapsulating layer away from the first encapsulating layer is substantially parallel to a plane where the encapsulating structure is located.
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公开(公告)号：US20230343895A1
公开(公告)日：2023-10-26
申请号：US18019823
申请日：2022-02-10
发明人： Pengjun CAO , Pei LI , Jinpeng LI , Jian LI , Teng ZHANG , Kangle CHANG , Zhaohui LI , Zhifu YANG
CPC分类号： H01L33/24 , H01L27/156 , H01L33/46 , H01L33/505 , H01L33/54 , H01L33/62
摘要： A light emitting substrate, comprising a base substrate, a retaining wall disposed on the base substrate, and a plurality of light emitting diodes. The retaining wall defines a plurality of partitions on the base substrate, and at least one light emitting diode is provided in at least one partition.
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